Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...
s are put into protective
packages
Package may refer to:
Containers or Enclosures
* Packaging and labeling, enclosing or protecting products
* Mail, items larger than a letter
* Chip package or chip carrier
* Electronic packaging, in electrical engineering
* Automotive package, ...
to allow easy handling and assembly onto
printed circuit boards
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich struct ...
and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as
JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States.
JEDEC has over 300 members, including some of the w ...
and
Pro Electron Pro Electron or EECA is the European type designation and registration system for active components (such as semiconductors, liquid crystal displays, sensor devices, electronic tubes and cathode ray tubes).
Pro Electron was set up in 1966 in Bru ...
. Other types are proprietary designations that may be made by only one or two manufacturers.
Integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. ...
is the last assembly process before testing and shipping devices to customers.
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In
flip chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to externa ...
systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for
wire bonding
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC ...
connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
Through-hole packages
Through-hole technology uses holes drilled through the
printed circuit board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a L ...
(PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.
Surface mount
Chip on board
Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. By eliminating the packagi ...
is a packaging technique that directly connects a die to a PCB, without an
interposer
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.
Interposer comes from t ...
or
lead frame
A lead frame (pronounced ) is the metal structure inside a chip package that carries signals from the die to the outside.
The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away ...
.
Chip carrier
A
chip carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounti ...
is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
Pin grid arrays
Flat packages
Small outline packages
Chip-scale packages
Ball grid array
Ball grid array (BGA) uses the underside of the package to place pads with
balls of solder
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked pa ...
in grid pattern as connections to PCB.
[
]
Transistor, diode, small-pin-count IC packages
* MELF
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device that is vacuum deposition, metallized at its ends. MELF devices are usually diodes and resistors.
The EN 140401-803 and JEDEC DO-213 standa ...
: Metal electrode leadless face (usually for resistors and diodes)
* SOD: Small-outline diode.
* SOT: Small-outline transistor
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, link froamkor.com/packaging/leadframe/sot23-tsot/ref>
also manufac ...
(also SOT-23, SOT-223, SOT-323).
* TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
** TO-3
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. ''TO'' stands for "Transistor Outline" and relates ...
: Panel-mount with leads
** TO-5
In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The ''TO'' element stands for "transistor outline" and refers to a series of technical drawings produced by JED ...
: Metal can package with radial leads
** TO-18
In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying ''Transistor Outline Package, Case Style 18''.
Constructi ...
: Metal can package with radial leads
** TO-39
In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The ''TO'' element stands for "transistor outline" and refers to a series of technical drawings produced by JE ...
** TO-46
** TO-66
TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. The TO-66 package is made entirely of metal and is commonly used by silicon ...
: Similar shape to the TO-3 but smaller
** TO-92
The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost.
History and origin
The JEDEC TO-92 descriptor is derived from the or ...
: Plastic-encapsulated package with three leads
** TO-99
In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The ''TO'' element stands for "transistor outline" and refers to a series of technical drawings produced by JED ...
: Metal can package with eight radial leads
** TO-100
** TO-126
TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink. On one side of the package typically a metal sh ...
: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
** TO-220
The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven ...
: Through-hole plastic package with a (usually) metal heat sink tab and three leads
** TO-226
** TO-247: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
** TO-251: Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
** TO-252
TO-252, also known as DPAK or Decawatt Package, is a semiconductor package developed by Motorola for Surface-mount technology, surface mounting on Printed circuit board, circuit boards. It represents a surface-mount variant of TO-251 package, and s ...
: (also called SOT428, DPAK): SMT package similar to the DPAK but smaller
** TO-262: Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
** TO-263
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style ...
: Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
** TO-274: Also called Super-247: SMT package similar to the TO-247 without the mounting hole
Dimension reference
Surface-mount
; C: Clearance between IC body and PCB
; H: Total height
; T: Lead thickness
; L: Total carrier length
; LW: Lead width
; LL: Lead length
; P: Pitch
Through-hole
; C: Clearance between IC body and board
; H: Total height
; T: Lead thickness
; L: Total carrier length
; LW: Lead width
; LL: Lead length
; P: Pitch
; WB: IC body width
; WL: Lead-to-lead width
Package dimensions
All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).
; C: Clearance between package body and PCB
PCB may refer to:
Science and technology
* Polychlorinated biphenyl, an organic chlorine compound, now recognized as an environmental toxin and classified as a persistent organic pollutant
* Printed circuit board, a board used in electronics
* ...
.
; H: Height of package from pin tip to top of package.
; T: Thickness of pin.
; L: Length of package body only.
; LW: Pin width.
; LL: Pin length from package to pin tip.
; P: Pin pitch (distance between conductors to the PCB).
; WB: Width of the package body only.
; WL: Length from pin tip to pin tip on the opposite side.
Dual row
Quad rows
LGA
Multi-chip packages
A variety of techniques for interconnecting several chips within a single package have been proposed and researched:
* SiP (system in package
A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system ...
)
* PoP (package on package
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to rout ...
)
* 3D-SICs, Monolithic 3D ICs, and other three-dimensional integrated circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or ...
s
* Multi-chip module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are int ...
* WSI (wafer-scale integration
Wafer-scale integration (WSI) is a rarely used system of building very-large integrated circuit (commonly called a "chip") networks from an entire silicon wafer to produce a single "super-chip". Combining large size and reduced packaging, WSI was ...
)
* Proximity communication
By terminal count
Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States.
JEDEC has over 300 members, including some of the w ...
).
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of , but the imperial 01005 name is already being used for the package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.
Two-terminal packages
Rectangular passive components
Mostly resistor
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active el ...
s and capacitor
A capacitor is a device that stores electrical energy in an electric field by virtue of accumulating electric charges on two close surfaces insulated from each other. It is a passive electronic component with two terminals.
The effect of ...
s.
Tantalum capacitors
Aluminum capacitors
Small-outline diode (SOD)
Metal electrode leadless face (MELF)
Mostly resistor
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active el ...
s and diode
A diode is a two-terminal electronic component that conducts current primarily in one direction (asymmetric conductance); it has low (ideally zero) resistance in one direction, and high (ideally infinite) resistance in the other.
A diode ...
s; barrel shaped components, dimensions do not match those of rectangular references for identical codes.
DO-214
Commonly used for rectifier, Schottky, and other diodes.
Three- and four-terminal packages
Small-outline transistor (SOT)
Other
*DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola
Motorola, Inc. () was an American Multinational corporation, multinational telecommunications company based in Schaumburg, Illinois, United States. After having lost $4.3 billion from 2007 to 2009, the company split into two independent p ...
to house higher powered devices. Comes in three or five-terminal versions.
*D2PAK
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-styl ...
(TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the TO220
The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven ...
through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions.
*D3PAK (TO-268): Even larger than D2PAK.
Five- and six-terminal packages
Small-outline transistor (SOT)
Packages with more than six terminals
Dual-in-line
* Flatpack was one of the earliest surface-mounted packages.
* Small-outline integrated circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...
(SOIC): dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm.
* Small-outline package, J-leaded (SOJ): The same as SOIC except J-leaded.
* Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm.
* Shrink small-outline package
A small outline integrated circuit (SOIC) is a Surface-mount technology, surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% ...
(SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm.
* Thin shrink small-outline package (TSSOP).
* Quarter-size small-outline package (QSOP): with pin spacing of 0.635 mm.
* Very small outline package (VSOP): even smaller than QSOP; 0.4-, 0.5-, or 0.65-mm pin spacing.
* Dual flat no-lead (DFN): smaller footprint than leaded equivalent.
Quad-in-line
Quad-in-line:
*Plastic leaded chip carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounti ...
(PLCC): square, J-lead, pin spacing 1.27 mm
*Quad flat package (QFP
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 ...
): various sizes, with pins on all four sides
*Low-profile quad flat-package (LQFP
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 ...
): 1.4 mm high, varying sized and pins on all four sides
*Plastic quad flat-pack (PQFP
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 ...
), a square with pins on all four sides, 44 or more pins
*Ceramic quad flat-pack ( CQFP): similar to PQFP
*Metric quad flat-pack ( MQFP): a QFP package with metric pin distribution
*Thin quad flat-pack (TQFP
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 30 ...
), a thinner version of LQFP
*Quad flat no-lead (QFN
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no l ...
): smaller footprint than leaded equivalent
*Leadless chip carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mount ...
(LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
*Micro leadframe package ( MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)
*Power quad flat no-lead ( PQFN): with exposed die-pads for heatsinking
Grid arrays
* Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be p ...
(BGA): A square or rectangular array of solder balls on one surface, ball spacing typically
** Fine-pitch ball grid array (FBGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put ...
): A square or rectangular array of solder balls on one surface
** Low-profile fine-pitch ball grid array (LFBGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be pu ...
): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
** Micro ball grid array ( μBGA): Ball spacing less than 1 mm
** Thin fine-pitch ball grid array
Thin may refer to:
* a lean body shape. ''(See also: emaciation, underweight)''
* Thin (film), ''Thin'' (film), a 2006 HBO documentary about eating disorders
* Paper Thin (disambiguation), referring to multiple songs
* Thin (web server), a Ruby w ...
(TFBGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put ...
): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
* Land grid array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a ...
(LGA): An array of bare lands only. Similar to in appearance to QFN
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no l ...
, but mating is by spring pins within a socket rather than solder.
* Column grid array
A column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above to other structural elements below. In other words, a column is a compression member. ...
(CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
** Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
* Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch).
Non-packaged devices
Although surface-mount, these devices require specific process for assembly.
* Chip-on-board (COB), a bare silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic tab ...
chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also coll ...
) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
*Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a flex circuit. Tape-automated bonding
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILE ...
process is also a chip-on-flex process as well.
*Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display
A liquid-crystal display (LCD) is a flat panel display, flat-panel display or other Electro-optic modulator, electronically modulated optical device that uses the light-modulating properties of liquid crystals combined with polarizers. Liqui ...
(LCD) controller, is mounted directly on glass.
*Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles.
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.
See also
* Surface-mount technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred ...
* Three-dimensional integrated circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or ...
* Interposer
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.
Interposer comes from t ...
* IPC (electronics)
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. It was founded in 1957 as the Institute of Printed Circuits. Its name was later changed to the Institute for I ...
* List of chip carriers
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standa ...
* List of electronics package dimensions
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standa ...
* Redistribution layer
A redistribution layer (RDL) is an extra metal layer on an integrated circuit that makes its IO pads available in other locations of the chip, for better access to the pads where necessary.
When an integrated circuit is manufactured, it usually h ...
* Small-outline transistor
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, link froamkor.com/packaging/leadframe/sot23-tsot/ref>
also manufac ...
* Wafer-level packaging
Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) ''before'' the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder ...
References
External links
JEDEC JEP95
official list of all (over 500) standard electronic packages
Fairchild Index of Package Information
* ttps://web.archive.org/web/20120418031551/http://www.intersil.com/design/packages/ Intersil packaging information
ICpackage.org
Solder Pad Layout Dimensions
International Microelectronics And Packaging Society
{{DEFAULTSORT:Integrated circuit packaging types
Semiconductor packages
Electronics lists