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TO-220
The TO-220 is a style of electronic Semiconductor package, package used for Power semiconductor device, high-powered, Through-hole technology, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used to mount the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits. Typical applications The TO-220 package is a "power package" intended for Power semiconductor device, power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so- ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-263
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. Image:D2PAK.JPG, A pair of MOSFETs in the surface-mount package D2PAK. Image:TO263 beside TO220.JPG, A TO-220 package compared to a D2PAK package. Dimensions Variants Texas instruments has a smaller version of the TO-263: the TO-263 THIN. The height of the TO-263 THIN is 2mm instead of the standard 4,5mm. See also TO-220, through hole version of the TO-263 References External links Package informationfrom Fairchild Mechanic ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heatsink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-hole Technology
In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. History Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, bu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-92
The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost. History and origin The JEDEC TO-92 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 92. The package is also known by the designation SOT54. By 1966 the package was being used by Motorola for their 2N3904 devices among others. Construction and orientation The case is molded around the transistor elements in two parts; the face is flat, usually bearing a machine-printed part number (some early examples had the part number printed on the top surface instead). The back is semi-circularly-shaped. A line of moulding flash from the injection-moulding process can be seen around the case. The leads protrude from the bottom of the case. When looking at the face of the transistor, the leads are commonly configured from left-to-right as the ''emitter'', ''ba ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-126
TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink. On one side of the package typically a metal sheet is exposed, with the transistor die bonded to the other side of the metal sheet inside the package. This allows for an efficient heat transfer from the transistor die to an external heat sink but also implies that the metal sheet is electrically connected to the die (for a bipolar junction transistor usually the collector is connected to this metal sheet). History and origin The JEDEC TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA. STMicroelectronics refers to this package style as SOT-32. National Standards } , - , Rosstandart , GOST R 57439—2017 , - , rowspan=2, Kombinat Mikroelektronik ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-3
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. ''TO'' stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC. The TO-3 case has a flat surface which can be attached to a heatsink, normally via a thermally conductive but electrically insulating washer. The design originated at Motorola around 1955 from a group headed by Virgil E. Bottom, Dr. Virgil E. Bottom. who was director of research of the Motorola Semiconductor Division. The first use of this design was for the germanium alloy-junction transistor, alloy-junction power transistor 2N176 – the first power transistor to be put into quantity production. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. Typical applications The metal package can be attached to a heat sink, making it suitable ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power Semiconductor Device
A power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics (for example in a switch-mode power supply). Such a device is also called a power device or, when used in an integrated circuit, a power IC. A power semiconductor device is usually used in "commutation mode" (i.e., it is either on or off), and therefore has a design optimized for such usage; it should usually not be used in linear operation. Linear power circuits are widespread as voltage regulators, audio amplifiers, and radio frequency amplifiers. Power semiconductors are found in systems delivering as little as a few tens of milliwatts for a headphone amplifier, up to around a gigawatt in a high voltage direct current transmission line. History The first electronic device used in power circuits was the electrolytic rectifier - an early version was described by a French experimenter, A. Nodon, in 1904. These were briefly popular with early radio experimenters as they c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power Module
A power module or power electronic module provides the physical containment for several power components, usually power semiconductor devices. These power semiconductors (so-called dies) are typically soldered or sintered on a power electronic substrate that carries the power semiconductors, provides electrical and thermal contact and electrical insulation where needed. Compared to discrete power semiconductors in plastic housings as TO-247 or TO-220, power packages provide a higher power density and are in many cases more reliable. Module Topologies Besides modules that contain a single power electronic switch (as MOSFET, IGBT, BJT, Thyristor, GTO or JFET) or diode, classical power modules contain multiple semiconductor dies that are connected to form an electrical circuit of a certain structure, called topology. Modules also contain other components such as ceramic capacitors to minimize switching voltage overshoots and NTC thermistors to monitor the module's substrate temp ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Package
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Gosstandart
Gosstandart (russian: Госстандарт) was the Soviet government agency responsible for standardization, metrology, and quality management. The name is an abbreviation for ''Gosudarstvennyy standart'' (‘State Standard’). History Established in 1925 as a committee for standardization within the USSR Council of Labor and Defence, ''Gosstandart'' was at first put in charge of inspecting measuring instruments used in industrial and agricultural production and later was tasked with developing, updating, and disseminating GOST standards. Over the course of its existence, the agency was reformed a number of times, receiving a new name with each transformation: the ''National Committee for Standardization''; the ''Committee for Standards, Metrology, and Measuring Instruments''; the ''State Committee for Standards''; the ''State Committee for Standards and Product Quality Management''. The agency received its nickname, ''Gosstandart'', in 1970. Later years After the dissolutio ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JEITA
The is a Japanese trade organization for the electronics and IT industries. It was formed in 2000 from two earlier organizations, the Electronic Industries Association of Japan and the Japan Electronic Industries Development Association. History In 1979, Minato Communications Association Co., Ltd. has first appeared in Minato, Tokyo, Japan. In 2000, Minato Communications Association Co., Ltd. was Re-branded into Japan Electronics and Information Technology Industries Association. See also * JIS semiconductor designation * Design rule for Camera File system * Integrated Services Digital Broadcasting Integrated Services Digital Broadcasting (ISDB; Japanese: , ''Tōgō dejitaru hōsō sābisu'') is a Japanese broadcasting standard for digital television (DTV) and digital radio. ISDB supersedes both the NTSC-J analog television system and t ... * EIAJ DC coaxial power connector standards External links JEITA Electronics industry in Japan Trade associations based in J ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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