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TO-252
TO-252, also known as DPAK or Decawatt Package, is a semiconductor package developed by Motorola for Surface-mount technology, surface mounting on Printed circuit board, circuit boards. It represents a surface-mount variant of TO-251 package, and smaller variant of the TO-263, D2PAK package. It is often used for high-power MOSFETs and voltage regulators. Variants Package can have 3 pins with pitch or 5 pins with pitch. The middle pin is usually connected to the tab. The middle pin is sometimes omitted. See also * TO-263 References External links TO-252 standardfrom JEDEC TO-252 drawingsfrom ON Semiconductor TO-252 package detailsfrom Central Semiconductor Corp. TO-252 (DPAK) package information from Amkor Technology {{Semiconductor packages Semiconductor packages ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-263
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. Image:D2PAK.JPG, A pair of MOSFETs in the surface-mount package D2PAK. Image:TO263 beside TO220.JPG, A TO-220 package compared to a D2PAK package. Dimensions Variants Texas instruments has a smaller version of the TO-263: the TO-263 THIN. The height of the TO-263 THIN is 2mm instead of the standard 4,5mm. See also TO-220, through hole version of the TO-263 References External links Package informationfrom Fairchild Mechanic ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Cisco EPC3212 - Advanced Power Electronics 9870GH-8781
Cisco Systems, Inc., commonly known as Cisco, is an American-based multinational digital communications technology conglomerate corporation headquartered in San Jose, California. Cisco develops, manufactures, and sells networking hardware, software, telecommunications equipment and other high-technology services and products. Cisco specializes in specific tech markets, such as the Internet of Things (IoT), domain security, videoconferencing, and energy management with leading products including Webex, OpenDNS, Jabber, Duo Security, and Jasper. Cisco is one of the largest technology companies in the world ranking 74 on the Fortune 100 with over $51 billion in revenue and nearly 80,000 employees. Cisco Systems was founded in December 1984 by Leonard Bosack and Sandy Lerner, two Stanford University computer scientists who had been instrumental in connecting computers at Stanford. They pioneered the concept of a local area network (LAN) being used to connect distant computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Package
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Motorola
Motorola, Inc. () was an American Multinational corporation, multinational telecommunications company based in Schaumburg, Illinois, United States. After having lost $4.3 billion from 2007 to 2009, the company split into two independent public companies, Motorola Mobility and Motorola Solutions on January 4, 2011. Motorola Solutions is the legal successor to Motorola, Inc., as the reorganization was structured with Motorola Mobility being spun off. Motorola Mobility was acquired by Lenovo in 2014. Motorola designed and sold wireless network equipment such as cellular transmission base stations and signal amplifiers. Motorola's home and broadcast network products included set-top boxes, digital video recorders, and network equipment used to enable video broadcasting, computer telephony, and high-definition television. Its business and government customers consisted mainly of wireless voice and broadband systems (used to build private networks), and, public safety communicat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MOSFET
The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. A metal-insulator-semiconductor field-effect transistor (MISFET) is a term almost synonymous with MOSFET. Another synonym is IGFET for insulated-gate field-effect transistor. The basic principle of the field-effect transistor was first patented by Julius Edgar Lilienfeld in 1925.Lilienfeld, Julius Edgar (1926-10-08) "Method and apparatus for controlling electric currents" upright=1.6, Two power MOSFETs in V_in_the_''off''_state,_and_can_conduct_a_continuous_current_of_30 surface-mount_packages._Operating_as_switches,_each_of_these_components_can_su ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Yakumo Notebook 536S - Globaltech GS1581D-7142
Yakumo may refer to: * Yakumo, Hokkaidō, a town in Hokkaidō Prefecture, Japan * Yakumo, Shimane, a village in Shimane Prefecture, Japan * Yakumo (train), a train service in Japan * Japanese cruiser ''Yakumo'', a cruiser of the Imperial Japanese Navy * Yakumo Fujii, the main character in ''3×3 Eyes'' media * ''Yakumo'', a main character in the anime ''Shinzo'' * Yakumo Tsukamoto, a character in ''School Rumble'' media * Yakumo, a character in '' Yu Yu Hakusho The Movie: Poltergeist Report'' * Ran Yakumo and Yukari Yakumo, characters in ''Touhou Project'' media * ''Psychic Detective Yakumo'' * Lafcadio Hearn , born Patrick Lafcadio Hearn (; el, Πατρίκιος Λευκάδιος Χέρν, Patríkios Lefkádios Chérn, Irish language, Irish: Pádraig Lafcadio O'hEarain), was an Irish people, Irish-Greeks, Greek-Japanese people, Japanese writer, t ... or Koizumi Yakumo (小泉 八雲?) (1850–1904), international writer known for his collections of Japanese legends and ghos ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States. JEDEC has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ON Semiconductor
onsemi (stylized in lowercase; legally ON Semiconductor Corporation; formerly ON Semiconductor until August 5, 2021) is an American semiconductor supplier company, based in Phoenix, Arizona and ranked #483 on the 2022 ''Fortune'' 500 based on its 2021 sales. Products include power and signal management, logic, discrete, and custom devices for automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. onsemi runs a network of manufacturing facilities, sales offices and design centers in North America, Europe, and the Asia Pacific regions. Based on its 2016 revenues of $3.907 billion, onsemi ranked among the worldwide top 20 semiconductor sales leaders. History onsemi was founded in 1999. The company was originally a spinoff of Motorola's Semiconductor Components Group. It continues to manufacture Motorola's discrete, standard analog, and standard logic devices. In February 2022, it was announced that BelGaN G ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Amkor Technology
Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania. The company was founded in 1968 and, , had approximately 29,300 employees worldwide and a reported $4.19 billion in sales. With factories in China, Japan, Korea, Malaysia, Philippines, Portugal and Taiwan, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits (ICs) for chip manufacturers. History In February 2016, Amkor fully acquired J-Devices Corp., the largest outsourced semiconductor assembly and test provider in Japan. In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year. Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened manufacturing and test ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
