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TSSOP
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. Application They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. Physical properties The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. Exposed Pad Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb. In most applications, the exposed pad ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Integrated Circuit Packaging Types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using " ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TSSOP 16L
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. Application They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. Physical properties The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. Exposed Pad Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb. In most applications, the exposed ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thin Small Outline Package
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications. TSOP is the smallest leaded form factor for flash memory. History The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card. Physical properties TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mini Small Outline Package
The Mini Small Outline Package (MSOP) a miniaturized version of the Shrink Small Outline ic package . Application Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in Disk drives, video/audio and consumer electronics. Physical properties The size of the Mini Small Outline Package is only 3mm x 3mm for the 8 & 10 pins version and 3mm x 4mm for the 12 & 16 pins version. The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB. Synonyms for the MSOP Package * μMAX or micro max - Maxim name for the msop package. * µMAX-EP or micro max exposed pad - Maxim name for the msop package with exposed pad. * MSE - Linear Technology name for the msop pa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Skymaster DT 500 - Sharp GCI 3AV0 - Philips TDA6651TT-91794
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__NOTOC__ Skymaster may refer to: Airlines * Skymaster Airlines, a Brazilian airline Aircraft *Cessna Skymaster, an American civil aircraft design *Cessna O-2 Skymaster, an American military aircraft design *Douglas C-54 Skymaster, an American military aircraft design * Skymaster Excel, an American powered parachute design Amusement park ride *Skymaster, also called a Kamikaze (ride) Companies * Skymaster (satellite), a satellite company *Skymaster Powered Parachutes, an American powered parachute manufacturer Comic book characters * Skrullian Skymaster, a member of Marvel Comics' Squadron Supreme The Squadron Supreme is a superhero team appearing in American comic books published by Marvel Comics, of which there are several notable alternate versions. The original team was created by Roy Thomas and John Buscema, derived from the previous ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Disk Drives
Data storage is the recording (storing) of information (data) in a storage medium. Handwriting, phonographic recording, magnetic tape, and optical discs are all examples of storage media. Biological molecules such as RNA and DNA are considered by some as data storage. Recording may be accomplished with virtually any form of energy. Electronic data storage requires electrical power to store and retrieve data. Data storage in a digital, machine-readable medium is sometimes called ''digital data''. Computer data storage is one of the core functions of a general-purpose computer. Electronic documents can be stored in much less space than paper documents. Barcodes and magnetic ink character recognition (MICR) are two ways of recording machine-readable data on paper. Recording media A recording medium is a physical material that holds information. Newly created information is distributed and can be stored in four storage media–print, film, magnetic, and optical–and seen or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Consumer Electronics
Consumer electronics or home electronics are electronic (analog or digital) equipment intended for everyday use, typically in private homes. Consumer electronics include devices used for entertainment, communications and recreation. Usually referred to as black goods due to many products being housed in black or dark casings. This term is used to distinguish them from "white goods" which are meant for housekeeping tasks, such as washing machines and refrigerators, although nowadays, these would be considered black goods, some of these being connected to the Internet. In British English, they are often called brown goods by producers and sellers. In the 2010s, this distinction is absent in large big box consumer electronics stores, which sell entertainment, communication and home office devices, light fixtures and appliances, including the bathroom type. Radio broadcasting in the early 20th century brought the first major consumer product, the broadcast receiver. Later produc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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