Skymaster DT 500 - Sharp GCI 3AV0 - Philips TDA6651TT-91794

The Thin Shrink Small Outline Package (TSSOP) is a rectangular

surface mount Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred ...

plastic

integrated circuit An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...

(IC) package with gull-wing leads.

Application

They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.

Physical properties

The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.

Exposed Pad

Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb. In most applications, the exposed pad is connected to ground.

HTSSOP

The Heat sink thin shrink small outline package (HTSSOP) is Texas Instruments name for a TSSOP with an exposed pad on the bottom side. There are some other manufacturers who uses the same name.

Similar package types

* Shrink Small Outline Package * Mini Small Outline Package * Small outline integrated circuit

References

External links

Soldering a TSSOP chip by hand
{{Semiconductor packages Semiconductor packages