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Interposer
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. Interposer comes from the Latin word "interpōnere", meaning "to put between". They are often used in BGA packages, multi-chip modules and high bandwidth memory. A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II. This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible. Silicon and glass are also evaluated as an integration method. Interposer stacks are also a widely accepted, cost-effective alternative to 3D ICs. There are already several products with interposer technology in the market, notably the AMD Fiji/Fury GPU, and the Xilinx Virtex-7 FPGA. In 2016, CEA Leti demonstrated their second generation 3D- NoC technology which combines small ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
High Bandwidth Memory
High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs and FPGAs and in some supercomputers (such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX). The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015. High Bandwidth Memory has been adopted by JEDEC as an industry standard in October 2013.High Bandwidth Memory (HBM) DRAM (JESD235) JEDEC, October 2013 The second generation, HBM2, was accepted by JEDEC in January 2016. Technology |
BGA Package Sideview
BGA may refer to: Organizations * Battle Ground Academy, a private school in Franklin, Tennessee, US * Behavior Genetics Association * Boldklubberne Glostrup Albertslund, a Danish football club * British Gear Association * British Gliding Association * British Go Association * British Geophysical Association * British-German Association * Palonegro International Airport, Colombia, by IATA code * The Bundesverband Großhandel, Außenhandel, Dienstleistungen (The Federation of German Wholesale, Foreign Trade and Services) Other uses * Ball grid array, a type of surface-mount packaging used for integrated circuits * Cyanobacteria (blue-green algae) * Break glass alarm, a type of manually activated fire alarm; see Fire alarm pull station * ''Bach-Gesellschaft Ausgabe'', the first complete edition of Johann Sebastian Bach's compositions * Boys Generally Asian Boys Generally Asian, also known by the acronym BgA, is an American K-pop parody group that was created by YouTube personali ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon On Insulator
In semiconductor manufacturing, silicon on insulator (SOI) technology is fabrication of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or sapphire (these types of devices are called silicon on sapphire, or SOS). The choice of insulator depends largely on intended application, with sapphire being used for high-performance radio frequency (RF) and radiation-sensitive applications, and silicon dioxide for diminished short-channel effects in other microelectronics devices. The insulating layer and topmost silicon layer also vary widely with application. Industry need SOI technology is one of several manufacturing strategies to allow the continued miniaturization of microelectronic devices, colloquially referred to as ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die Preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing. Wafer mounting Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ensures that the individual dies remain firmly in place during 'dicing', as the process of cutting the wafer is called. The picture on the right shows a 300 mm wafer after it was mounted and diced. The blue plastic is the adhesive tape. The wafer is the round disc in the middle. In this case, a large number of dies were already removed. Semiconductor-die cutting In the manufacturing of micro-elect ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Storage Networking Industry Association
The Storage Networking Industry Association (SNIA) is a registered 501(c)(6) non-profit trade association incorporated in December 1997. SNIA has more than 185 unique members, 2,000 active contributing members and over 50,000 IT end users and storage professionals. The SNIA absorbed the Small Form Factor Committee. SNIA's membership community participates in the following storage-related technical working groups: * Certification * Cloud Storage Technologies * Computational Storage * Data Management * Data Security * Dictionary * Networked Storage * Next Generation Data Center * Persistent Memory * Physical Storage * Power Efficiency Measurement * Storage Management Initiative – Specification (SMI-S) * Storage Management Swordfish Protocol SNIA and its technical council maintain a vendor-neutral dictionary and glossary of storage networking, data, and information management terminology. The SNIA dictionary won an award for publication excellence in 2009 and 2012 from the Bu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Redundancy (engineering)
In engineering, redundancy is the intentional duplication of critical components or functions of a system with the goal of increasing reliability of the system, usually in the form of a backup or fail-safe, or to improve actual system performance, such as in the case of GNSS receivers, or multi-threaded computer processing. In many safety-critical systems, such as fly-by-wire and hydraulic systems in aircraft, some parts of the control system may be triplicated, which is formally termed triple modular redundancy (TMR). An error in one component may then be out-voted by the other two. In a triply redundant system, the system has three sub components, all three of which must fail before the system fails. Since each one rarely fails, and the sub components are expected to fail independently, the probability of all three failing is calculated to be extraordinarily small; it is often outweighed by other risk factors, such as human error. Redundancy may also be known by the terms "m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Serial ATA
SATA (Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives. Serial ATA succeeded the earlier Parallel ATA (PATA) standard to become the predominant interface for storage devices. Serial ATA industry compatibility specifications originate from the Serial ATA International Organization (SATA-IO) which are then promulgated by the INCITS Technical Committee T13, AT Attachment (INCITS T13). History SATA was announced in 2000 in order to provide several advantages over the earlier PATA interface such as reduced cable size and cost (seven conductors instead of 40 or 80), native hot swapping, faster data transfer through higher signaling rates, and more efficient transfer through an (optional) I/O queuing protocol. Revision 1.0 of the specification was released in January 2003. Serial ATA industry compatibility specifications originate from the Serial ATA Internat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CMOS
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", ) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data converters, RF circuits (RF CMOS), and highly integrated transceivers for many types of communication. The CMOS process was originally conceived by Frank Wanlass at Fairchild Semiconductor and presented by Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. commercialized the technology with the trademark "COS-MO ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Virtex 7
Virtex is the flagship family of FPGA products developed by Xilinx, a part of AMD. Other current product lines include Kintex (mid-range) and Artix (low-cost), each including configurations and models optimized for different applications.DSP-FPGA.comXilinx FPGA Products” April 2010. Retrieved June 10, 2010. In addition, Xilinx offers the Spartan low-cost series, which continues to be updated and is nearing production utilizing the same underlying architecture and process node as the larger 7-series devices. Virtex FPGAs are typically programmed in hardware description languages such as VHDL or Verilog, using the Xilinx ISE or Vivado Design Suite computer software.Brian Bailey, EE Times.Second generation for FPGA software" Apr 25, 2012. Retrieved Dec 21, 2012. Xilinx FPGA products have been recognized by EE Times, EDN and others for innovation and market impact.EE Times, EE Times 2010 ACE Award for Design Innovation.” April 27, 2010. Retrieved June 17, 2010.EDN, EDN Hot 100 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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