Features overview

CPUs

CPU features table

APUs

APU features table

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

'' MMX, SSE,

SSE2 SSE2 (Streaming SIMD Extensions 2) is one of the Intel SIMD (Single Instruction, Multiple Data) processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2000. It extends the earlier Streamin ...

, Enhanced 3DNow!, NX bit''

"Dublin" (Socket 754, CG, 130 nm, Low power)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit''

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit''

"Sonora" (Socket 754, D0, 90 nm, Low power)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit''

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit''

"Roma" (Socket 754, E6, 90 nm, Low power)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit''

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"ClawHammer" (CG, 130 nm, 35 W TDP)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Odessa" (CG, 130 nm, Desktop replacement)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Odessa" (CG, 130 nm, 35 W TDP)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Newark" (E5, 90 nm, 62 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

Turion 64

"Lancaster" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!''

Kite platform (2006)

Introduced in 2006, the ''Kite'' platform consists of:

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!''

Turion 64

"Richmond" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!,

AMD-V x86 virtualization is the use of hardware-assisted virtualization capabilities on an x86/x86-64 CPU. In the late 1990s x86 virtualization was achieved by complex software techniques, necessary to compensate for the processor's lack of hardware-as ...

Turion 64 X2

"Taylor" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

"Trinidad" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Kite Refresh platform (2007)

AMD used ''Kite Refresh'' as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64''

Athlon 64 X2

"Tyler" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion 64 X2

"Tyler" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Puma platform (2008)

The ''Puma'' platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

Mobile Sempron

"Sable" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!''

Athlon X2

"Lion" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion X2

"Lion" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion X2 Ultra

"Lion" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Yukon platform (2009)

The ''Yukon'' platform was introduced on January 8, 2009 with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

Sempron

"Huron" (65 nm, Low power)

* Both models support: ''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64'' * Sempron 210U supports extra AMD-V

Athlon Neo

"Huron" (65 nm, 15 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V''

"Sherman" (65 nm, 15 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Congo" (65 nm, 13 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

Turion

"Congo" (65 nm, 20 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

Congo platform (2009)

The ''Congo'' platform was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

Athlon Neo X2

"Conesus" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V''

Turion Neo X2

"Conesus" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!''

Tigris platform (2009)

The ''Tigris'' platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

Sempron

"Caspian" (45 nm)

Single-core mobile processor ''MMX, SSE, SSE2, SSE3,

SSE4a SSE4 (Streaming SIMD Extensions 4) is a SIMD CPU instruction set used in the Intel Core microarchitecture and AMD K10 (K8L). It was announced on September 27, 2006, at the Fall 2006 Intel Developer Forum, with vague details in a white paper; more ...

ABM ABM or Abm may refer to: Companies * ABM Industries, a US facility management provider * ABM Intelligence, a UK software company * Advantage Business Media, a US digital marketing and information services company * Associated British Maltsters, ac ...

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Athlon II

"Caspian" (45 nm)

Dual-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion II

"Caspian" (45 nm)

Dual-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Nile platform (2010)

The ''Nile'' platform introduced on May 12, 2010 for the third AMD Ultrathin Platform consists of: * ''MMX, SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support:

DDR3 SDRAM Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth (" double data rate") interface, and has been in use since 2007. It is the higher-speed ...

, DDR3L SDRAM (Up to 1066)

V series

"Geneva" (45 nm)

Single-core mobile processor

Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor Dual-core mobile processor

Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor

Danube platform (2010)

The ''Danube'' platform introduced on May 12, 2010 for the AMD Mainstream Notebook Platform consists of: * ''MMX, SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

Champlain (45 nm)

Single-core mobile processor

Athlon II

Champlain (45 nm)

Dual-core mobile processor

Turion II

Champlain (45 nm)

Dual-core mobile processor

Phenom II

* ''MMX, SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V'' * Unlike desktop models, mobile Phenom II-based models do not have L3 cache * Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

Dual-core mobile processor Triple-core mobile processors Quad-core mobile processors

Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt

APU APU or Apu may refer to: Film and television * ''The Apu Trilogy'', a series of three Bengali films, directed by Satyajit Ray, with the fictional character Apu Roy, comprising: ** ''Pather Panchali'' (''Song of the Little Road'') (1955), the first ...

for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two

Bobcat The bobcat (''Lynx rufus''), also known as the red lynx, is a medium-sized cat native to North America. It ranges from southern Canada through most of the contiguous United States to Oaxaca in Mexico. It is listed as Least Concern on the IUC ...

x86 cores and fully support DirectX11,

DirectCompute Microsoft DirectCompute is an application programming interface (API) that supports running compute kernels on general-purpose computing on graphics processing units on Microsoft's Windows Vista, Windows 7 and later versions. DirectCompute is part ...

( Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:

"''Ontario''" (40 nm)

* ''SSE, SSE2, SSE3, SSSE3, SSE4a,

, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz) * 2.5 GT/s UMI. * Config GPU are Unified shaders : Texture mapping units : Render output units * Socket FT1 (BGA-413)

"''Zacate''" (40 nm)

* ''SSE, SSE2, SSE3, SSSE3, SSE4a,

Sabine (Fusion) platform (2011)

The ''Sabine'' platform introduced on June 30, 2011 for the AMD Mainstream Notebook Platform consists of:

"''Llano''" (32 nm)

* ''SSE, SSE2, SSE3, SSE4a,

, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core'' * Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel) * 2.5 GT/s UMI. * Transistors: 1.148 billion *

Die Die, as a verb, refers to death, the cessation of life. Die may also refer to: Games * Die, singular of dice, small throwable objects used for producing random numbers Manufacturing * Die (integrated circuit), a rectangular piece of a semicondu ...

size: 228 mm² ¹ Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

"''Ontario''", "''Zacate''" (40 nm)

* ''SSE, SSE2, SSE3, SSSE3, SSE4a,

, NX bit, AMD64, PowerNow!, AMD-V'' * Single-channel DDR3 SDRAM, DDR3L SDRAM * 2.5 GT/s UMI. * Config GPU are Unified shaders : Texture mapping units : Render output units * Socket FT1 (BGA-413)

Comal (Fusion) platform (2012)

The ''Comal'' platform introduced on May 15, 2012 for the AMD Mainstream Notebook Platform consists of:

"''Trinity''" (2012, 32 nm)

* ''MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1 SSE4 (Streaming SIMD Extensions 4) is a SIMD CPU instruction set used in the Intel Core microarchitecture and AMD K10 (K8L). It was announced on September 27, 2006, at the Fall 2006 Intel Developer Forum, with vague details in a white paper; more ...

SSE4.2 SSE4 (Streaming SIMD Extensions 4) is a SIMD CPU instruction set used in the Intel Core microarchitecture and AMD K10 (K8L). It was announced on September 27, 2006, at the Fall 2006 Intel Developer Forum, with vague details in a white paper; more ...

, SSE4a, NX bit, AMD64, AMD-V,

AES AES may refer to: Businesses and organizations Companies * AES Corporation, an American electricity company * AES Data, former owner of Daisy Systems Holland * AES Eletropaulo, a former Brazilian electricity company * AES Andes, formerly AES Gener ...

, CLMUL,

AVX AVX may refer to: Technology * Advanced Vector Extensions, an instruction set extension in the x86 microprocessor architecture ** AVX2, an expansion of the AVX instruction set ** AVX-512, 512-bit extensions to the 256-bit AVX * AVX Corporation, a m ...

, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core'' * Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel) * 2.5 GT/s UMI. * Transistors: 1.303 billion *

size: 246 mm² ¹ Config GPU are Unified shaders : Texture mapping units : Render output units

"''Richland''" (2013, 32 nm)

* ''Elite Performance APU''. * ''MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core'' * Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel) * 2.5 GT/s UMI. * Transistors: 1.303 billion *

size: 246 mm² ¹ Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

''"Temash"'' (2013, 28 nm)

Elite Mobility APU: ¹ Unified shaders : Texture mapping units : Render output units

''"Kabini"'' (2013, 28 nm)

Mainstream APU: ¹ Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

Beema, Notebook APU

Kaveri (2014)

Carrizo-L (2015)

Carrizo (2015)

Bristol Ridge (2016)

References

External links

AMD Platforms for Notebook PCs

Compare AMD Notebook Processors

Technical specification AMD products

AMD products and technologies

{{DEFAULTSORT:Amd Mobile Microprocessors AMD Phenom *Phenom