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UniDIMM
UniDIMM (short for Universal DIMM) is a specification for dual in-line memory modules (DIMMs), which are printed circuit boards (PCBs) designed to carry dynamic random-access memory (DRAM) chips. UniDIMMs can be populated with either DDR3 or DDR4 chips, with no support for any additional memory control logic; as a result, the computer's memory controller must support both DDR3 and DDR4 memory standards. The UniDIMM specification was created by Intel for its Skylake microarchitecture, whose integrated memory controller (IMC) supports both DDR3 (more specifically, the DDR3L low-voltage variant) and DDR4 memory technologies. UniDIMM is a SO-DIMM form factor available in two dimensions: for the standard UniDIMM version (the same size as DDR4 SO-DIMMs), and for the low-profile version. UniDIMMs have a 260-pin edge connector, which has the same pin count as the one on DDR4 SO-DIMMs, with the keying notch in a position that prevents incompatible installation by making UniDIMMs phy ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UniDIMM And SO-DIMM Comparison
UniDIMM (short for Universal DIMM) is a specification for dual in-line memory modules (DIMMs), which are printed circuit boards (PCBs) designed to carry dynamic random-access memory (DRAM) chips. UniDIMMs can be populated with either DDR3 or DDR4 chips, with no support for any additional memory control logic; as a result, the computer's memory controller must support both DDR3 and DDR4 memory standards. The UniDIMM specification was created by Intel for its Skylake microarchitecture, whose integrated memory controller (IMC) supports both DDR3 (more specifically, the DDR3L low-voltage variant) and DDR4 memory technologies. UniDIMM is a SO-DIMM form factor available in two dimensions: for the standard UniDIMM version (the same size as DDR4 SO-DIMMs), and for the low-profile version. UniDIMMs have a 260-pin edge connector, which has the same pin count as the one on DDR4 SO-DIMMs, with the keying notch in a position that prevents incompatible installation by making UniDIMMs phy ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR3
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth ("double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance. The primary benefit of DDR3 SDRAM over its immediate predecessor DDR2 SDRAM, is its ability to transfer data at twice the rate (eight times the speed of its internal memory arrays), enabling higher bandwidth or peak data rates. The DDR3 standard permits DRAM chip capacities of up to 8 gigabits (Gbit), and up to four ranks o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR4
Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high bandwidth ("double data rate") interface. Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), of which some have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies. DDR4 is not compatible with any earlier type of random-access memory (RAM) due to different signaling voltage and physical interface, besides other factors. DDR4 SDRAM was released to the public market in Q2 2014, focusing on ECC memory, while the non-ECC DDR4 modules became available in Q3 2014, accompanying the launch of Haswell-E processors that require DDR4 memory. Features The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs of up t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR3L
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth ("double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance. The primary benefit of DDR3 SDRAM over its immediate predecessor DDR2 SDRAM, is its ability to transfer data at twice the rate (eight times the speed of its internal memory arrays), enabling higher bandwidth or peak data rates. The DDR3 standard permits DRAM chip capacities of up to 8 gigabits (Gbit), and up to four ranks o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Skylake (microarchitecture)
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Cannon Lake, Whiskey Lake, and Comet Lake CPUs. Skylake is the last Intel platform on which Windows earlier than Windows 10 will be officially supported by Microsoft, although enthusiast-created modifications exist that allow Windows 8.1 and earlier to continue to receive Windows Updates on later platforms. Some of the processors based on the Skylake microarchitecture are marketed as 6th-generation Core. Intel officially declared end of life and discontinued Sk ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SO-DIMM
A DIMM () (Dual In-line Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are and laptop (SO-DIMM) which are about half the size at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were intr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Memory Module
A DIMM () (Dual In-line Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are and laptop (SO-DIMM) which are about half the size at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were intr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SDRAM
Synchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal. DRAM integrated circuits (ICs) produced from the early 1970s to early 1990s used an ''asynchronous'' interface, in which input control signals have a direct effect on internal functions only delayed by the trip across its semiconductor pathways. SDRAM has a ''synchronous'' interface, whereby changes on control inputs are recognised after a rising edge of its clock input. In SDRAM families standardized by JEDEC, the clock signal controls the stepping of an internal finite-state machine that responds to incoming commands. These commands can be pipelined to improve performance, with previously started operations completing while new commands are received. The memory is divided into several equally sized but independent sections called ''banks'', allowing the device to operate on a memory a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Corsair Gaming
Corsair Gaming, Inc. is an American computer peripherals and hardware company headquartered in Milpitas, California. Previously Corsair Components and Corsair Memory, it was incorporated in California in January 1994 as Corsair Microsystems and reincorporated in Delaware in 2007. It designs and sells a range of computer products, including high-speed DRAM modules, ATX power supplies (PSUs), USB flash drives (UFDs), CPU/GPU and case cooling, gaming peripherals (such as keyboards and computer mice), computer cases, solid-state drives (SSDs), and speakers. It leases a production facility in Taoyuan City, Taiwan for assembly, testing and packaging of select products, with distribution centers in North America, Europe, and Asia and sales and marketing offices in major markets worldwide. It trades under the ticker symbol CRSR on the NASDAQ stock exchange. Lockdown orders associated with the COVID-19 pandemic, and a rise in demand for computing equipment, including the computer gaming ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Memory Geometry
In the design of modern computers, memory geometry describes the internal structure of random-access memory. Memory geometry is of concern to consumers upgrading their computers, since older memory controllers may not be compatible with later products. Memory geometry terminology can be confusing because of the number of overlapping terms. The geometry of a memory system can be thought of as a multi-dimensional array. Each dimension has its own characteristics and physical realization. For example, the number of data pins on a memory module is one dimension. Physical features Memory geometry describes the logical configuration of a RAM module, but consumers will always find it easiest to grasp the physical configuration. Much of the confusion surrounding memory geometry occurs when the physical configuration obfuscates the logical configuration. The first defining feature of RAM is form factor. RAM modules can be in compact SO-DIMM form for space constrained applications li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Centaur (computing)
POWER8 is a family of superscalar multi-core microprocessors based on the Power ISA, announced in August 2013 at the Hot Chips conference. The designs are available for licensing under the OpenPOWER Foundation, which is the first time for such availability of IBM's highest-end processors. Systems based on POWER8 became available from IBM in June 2014. Systems and POWER8 processor designs made by other OpenPOWER members were available in early 2015. Design POWER8 is designed to be a massively multithreaded chip, with each of its cores capable of handling eight hardware threads simultaneously, for a total of 96 threads executed simultaneously on a 12-core chip. The processor makes use of very large amounts of on- and off-chip eDRAM caches, and on-chip memory controllers enable very high bandwidth to memory and system I/O. For most workloads, the chip is said to perform two to three times as fast as its predecessor, the POWER7. POWER8 chips comes in 6- or 12-core variants; ea ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Kingston Technology
Kingston Technology Corporation is an American multinational computer technology corporation that develops, manufactures, sells and supports flash memory products, other computer-related memory products, as well as the HyperX gaming division (now owned by HP Inc., HP). Headquartered in Fountain Valley, California, United States, Kingston Technology employs more than 3,000 employees worldwide as of Q1 2016. The company has manufacturing and logistics facilities in the United States, United Kingdom, Ireland, Taiwan, and China. It is the largest independent producer of Dynamic random access memory, DRAM memory modules, owning approximately 68% of the third-party worldwide DRAM module market share in 2017, according to DRAMeXchange. In 2018 the company generated $7.5 billion in revenue and made #53 on the Forbes Lists of "America's Largest Private Companies 2019." Kingston serves an international network of distributors, resellers, retailers and OEM customers on six continents. T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
