Inverse Lithography Technology
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Inverse Lithography Technology
In semiconductor device fabrication, the inverse lithography technology (ILT) is an approach to photomask design. This is basically an approach to solve an inverse imaging problem: to calculate the shapes of the openings in a photomask ("source") so that the passing light produces a good approximation of the desired pattern ("target") on the illuminated material, typically a photoresist. As such, it is treated as a mathematical optimization problem of a special kind, because usually an analytical solution does not exist. In conventional approaches known as the optical proximity correction (OPC) a "target" shape is augmented with carefully tuned rectangles to produce a "Manhattan shape" for the "source", as shown in the illustration. The ILT approach generates curvilinear shapes for the "source", which deliver better approximations for the "target". The ILT was proposed in 1980s, however at that time it was impractical due to the huge required computational power and complicated "s ...
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Optical Proximity Correction
Optical proximity correction (OPC) is a photolithography enhancement technique commonly used to compensate for image errors due to diffraction or process effects. The need for OPC is seen mainly in the making of semiconductor devices and is due to the limitations of light to maintain the edge placement integrity of the original design, after processing, into the etched image on the silicon wafer. These projected images appear with irregularities such as line widths that are narrower or wider than designed, these are amenable to compensation by changing the pattern on the photomask used for imaging. Other distortions such as rounded corners are driven by the resolution of the optical imaging tool and are harder to compensate for. Such distortions, if not corrected for, may significantly alter the electrical properties of what was being fabricated. Optical proximity correction corrects these errors by moving edges or adding extra polygons to the pattern written on the photomask. This ...
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Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ...
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Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography and the production of integrated circuits (ICs or "chips") in particular. Masks are used to produce a pattern on a substrate, normally a thin slice of silicon known as a wafer in the case of chip manufacturing. Several masks are used in turn, each one reproducing a layer of the completed design, and together they are known as a mask set. Previously, photomasks used to be produced manually by using rubylith and mylar. As complexity continued to grow, manual processing of any sort became difficult. This was solved with the introduction of the optical pattern generator which automated the process of producing the initial large-scale pattern, and the step-and-repeat cameras that automated the copying of the pattern into a multiple-IC mask. The intermediate masks are known as reticles, and were initially copied to production mas ...
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Inverse Problem
An inverse problem in science is the process of calculating from a set of observations the causal factors that produced them: for example, calculating an image in X-ray computed tomography, source reconstruction in acoustics, or calculating the density of the Earth from measurements of its gravity field. It is called an inverse problem because it starts with the effects and then calculates the causes. It is the inverse of a forward problem, which starts with the causes and then calculates the effects. Inverse problems are some of the most important mathematical problems in science and mathematics because they tell us about parameters that we cannot directly observe. They have wide application in system identification, optics, radar, acoustics, communication theory, signal processing, medical imaging, computer vision, geophysics, oceanography, astronomy, remote sensing, natural language processing, machine learning, nondestructive testing, slope stability analysis and man ...
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Photoresist
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronic industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas w ...
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Optimization Problem
In mathematics, computer science and economics, an optimization problem is the problem of finding the ''best'' solution from all feasible solutions. Optimization problems can be divided into two categories, depending on whether the variables are continuous or discrete: * An optimization problem with discrete variables is known as a ''discrete optimization'', in which an object such as an integer, permutation or graph must be found from a countable set. * A problem with continuous variables is known as a ''continuous optimization'', in which an optimal value from a continuous function must be found. They can include constrained problems and multimodal problems. Continuous optimization problem The '' standard form'' of a continuous optimization problem is \begin &\underset& & f(x) \\ &\operatorname & &g_i(x) \leq 0, \quad i = 1,\dots,m \\ &&&h_j(x) = 0, \quad j = 1, \dots,p \end where * is the objective function to be minimized over the -variable vector , * are called ine ...
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Optics Express
''Optics Express'' is a biweekly peer-reviewed scientific journal published by Optica. It was established in 1997. The journal reports on scientific and technology innovations in all aspects of optics and photonics. The Energy Express supplement reports research on the science and engineering of light and its impact on sustainable energy development, the environment, and green technologies. The editor-in-chief is James Leger (University of Minnesota). According to the ''Journal Citation Reports'', the journal has a 2021 impact factor The impact factor (IF) or journal impact factor (JIF) of an academic journal is a scientometric index calculated by Clarivate that reflects the yearly mean number of citations of articles published in the last two years in a given journal, as i ... of 3.833, ranking it 28th out of 101 journals in the category "Optics". References External links * Open access journals Optics journals Optica (society) academic journals Publications estab ...
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Optical Proximity Correction
Optical proximity correction (OPC) is a photolithography enhancement technique commonly used to compensate for image errors due to diffraction or process effects. The need for OPC is seen mainly in the making of semiconductor devices and is due to the limitations of light to maintain the edge placement integrity of the original design, after processing, into the etched image on the silicon wafer. These projected images appear with irregularities such as line widths that are narrower or wider than designed, these are amenable to compensation by changing the pattern on the photomask used for imaging. Other distortions such as rounded corners are driven by the resolution of the optical imaging tool and are harder to compensate for. Such distortions, if not corrected for, may significantly alter the electrical properties of what was being fabricated. Optical proximity correction corrects these errors by moving edges or adding extra polygons to the pattern written on the photomask. This ...
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Manhattan Shape
A taxicab geometry or a Manhattan geometry is a geometry whose usual distance function or metric of Euclidean geometry is replaced by a new metric in which the distance between two points is the sum of the absolute differences of their Cartesian coordinates. The taxicab metric is also known as rectilinear distance, ''L''1 distance, ''L''1 distance or \ell_1 norm (see ''Lp'' space), snake distance, city block distance, Manhattan distance or Manhattan length. The latter names refer to the rectilinear street layout on the island of Manhattan, where the shortest path a taxi travels between two points is the sum of the absolute values of distances that it travels on avenues and on streets. The geometry has been used in regression analysis since the 18th century, and is often referred to as LASSO. The geometric interpretation dates to non-Euclidean geometry of the 19th century and is due to Hermann Minkowski. In \mathbb^2 , the taxicab distance between two points (x_1, y_1) and (x_2, y_ ...
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Design Rule Checking
In electronic design automation, a design rule is a geometric constraint imposed on circuit board, semiconductor device, and integrated circuit (IC) designers to ensure their designs function properly, reliably, and can be produced with acceptable yield. Design rules for production are developed by process engineers based on the capability of their processes to realize design intent. Electronic design automation is used extensively to ensure that designers do not violate design rules; a process called design rule checking (DRC). DRC is a major step during physical verification signoff on the design, which also involves LVS (layout versus schematic) checks, XOR checks, ERC ( electrical rule check), and antenna checks. The importance of design rules and DRC is greatest for ICs, which have micro- or nano-scale geometries; for advanced processes, some fabs also insist upon the use of more restricted rules to improve yield. Design rules Design rules are a series of parameters provi ...
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Lithography (microfabrication)
Lithography () is a planographic method of printing originally based on the immiscibility of oil and water. The printing is from a stone (lithographic limestone) or a metal plate with a smooth surface. It was invented in 1796 by the German author and actor Alois Senefelder and was initially used mostly for musical scores and maps.Meggs, Philip B. A History of Graphic Design. (1998) John Wiley & Sons, Inc. p 146 Carter, Rob, Ben Day, Philip Meggs. Typographic Design: Form and Communication, Third Edition. (2002) John Wiley & Sons, Inc. p 11 Lithography can be used to print text or images onto paper or other suitable material. A lithograph is something printed by lithography, but this term is only used for fine art prints and some other, mostly older, types of printed matter, not for those made by modern commercial lithography. Originally, the image to be printed was drawn with a greasy substance, such as oil, fat, or wax onto the surface of a smooth and flat limestone plat ...
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