|
Socket S1
Socket S1 is the CPU socket type used by AMD for their Turion 64, Athlon 64 Mobile, Phenom II Mobile and later Sempron processors, which debuted with the dual-core Turion 64 X2 CPUs on May 17, 2006. Technical specifications Socket S1 is a 638 pin, low profile, ZIF, 1.27mm pitch socket. It replaces the existing Socket 754 in the mobile computing segment (e.g. laptops) as well as the microPGA Socket 563 form factor. Socket S1 CPUs can include support for dual-channel DDR2 SDRAM Double Data Rate 2 Synchronous Dynamic Random-Access Memory (DDR2 SDRAM) is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeed ..., dual-core mobile CPUs, and virtualization technology, and compete with the mobile Intel Core 2 processor series. Socket S1 revisions Different generations of processors used various pinouts of the S1 socket; processors were not necessarily electrically- ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include pin grid array (PGA) or land grid array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Core 2
Intel Core 2 is a processor family encompassing a range of Intel's mainstream 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single- die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range is the last flagship range of Intel desktop processors to use a front-side bus (FSB). The introduction of Core 2 relegated the Pentium brand to the mid-range market, and reunified laptop and desktop CPU lines for marketing purposes under the same product name, which were formerly divided into the Pentium 4, Pentium D, and Core Solo/Duo brands. The ''Core 2'' processor line was introduced on July 27, 2006, comprising the ''Duo'' (dual-core) and ''Extreme'' (dual- or quad-core CPUs for enthusiasts), and in 2007, the ''Quad'' ( quad-core) and ''Solo'' ( single-core) sub-brands. Intel Core 2 processors with vPro technology (designed f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR2 SDRAM
Double Data Rate 2 Synchronous Dynamic Random-Access Memory (DDR2 SDRAM) is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007. DDR2 DIMMs are neither forward compatible with DDR3 nor backward compatible with DDR. In addition to double pumping the data bus as in DDR SDRAM (transferring data on the rising and falling edges of the bus clock signal), DDR2 allows higher bus speed and requires lower power by running the internal clock at half the speed of the data bus. The two factors combine to produce a total of four data transfers per internal clock cycle. Since the DDR2 internal clock runs at half the DDR external clock rate, DDR2 memory operating at the same external data bus clock rate as DDR results in DDR2 being able to provide the same bandwidth but with better la ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD AMP320SGR22GM Pins (15502936987)
Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and technology company headquartered in Santa Clara, California and maintains significant operations in Austin, Texas. AMD is a hardware and fabless company that designs and develops central processing units (CPUs), graphics processing units (GPUs), field-programmable gate arrays (FPGAs), system-on-chip (SoC), and high-performance computer solutions. AMD serves a wide range of business and consumer markets, including gaming, data centers, artificial intelligence (AI), and embedded systems. AMD's main products include microprocessors, motherboard chipsets, embedded processors, and graphics processors for servers, workstations, personal computers, and embedded system applications. The company has also expanded into new markets, such as the data center, gaming, and high-performance computing markets. AMD's processors are used in a wide range of computing devices, including personal computers, servers, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-core Processor
A multi-core processor (MCP) is a microprocessor on a single integrated circuit (IC) with two or more separate central processing units (CPUs), called ''cores'' to emphasize their multiplicity (for example, ''dual-core'' or ''quad-core''). Each core reads and executes Instruction set, program instructions, specifically ordinary Instruction set, CPU instructions (such as add, move data, and branch). However, the MCP can run instructions on separate cores at the same time, increasing overall speed for programs that support Multithreading (computer architecture), multithreading or other parallel computing techniques. Manufacturers typically integrate the cores onto a single IC Die (integrated circuit), die, known as a ''chip multiprocessor'' (CMP), or onto multiple dies in a single Chip carrier, chip package. As of 2024, the microprocessors used in almost all new personal computers are multi-core. A multi-core processor implements multiprocessing in a single physical package. Des ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sempron
Sempron has been the marketing name used by AMD for several different budget desktop CPUs, using several different technologies and CPU socket formats. The Sempron replaced the AMD Duron processor and competed against Intel's Celeron#Celeron D (Prescott-256), Celeron series of processors. AMD coined the name from the Latin ''wikt:semper, semper'', which means "always", to suggest the Sempron is suitable for "daily use, practical, and part of everyday life". The last Semprons were launched in April 2014. The brand was retired with the launch of the AMD Accelerated Processing Unit, AMD A-Series APUs. History and features The first Sempron CPUs were based on the Athlon#Athlon XP/MP, Athlon XP architecture using the ''Thoroughbred'' or ''Thorton'' core. These models were equipped with the Socket A interface, 256 KiB L2 cache and 166 MHz Front side bus (FSB 333). Thoroughbred cores natively had 256 KiB L2 cache, but Thortons had 512 KiB L2 cache, half of which was disa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Phenom II
Phenom II is a family of AMD's multi-core 45 nm central processing unit, processors using the AMD K10 microarchitecture, succeeding the original AMD Phenom, Phenom. Advanced Micro Devices released the Socket AM2+ version of Phenom II in December 2008, while Socket AM3 versions with DDR3 support, along with an initial batch of triple- and quad-core processors were released on February 9, 2009. Dual-processor systems require Socket F+ for the AMD Quad FX platform, Quad FX platform. The next-generation Phenom II X6 was released on April 27, 2010. The Phenom II X4 operates as the processor component of AMD's AMD Dragon, Dragon Platform, which also includes the AMD 700 chipset series, 790 series chipset and Radeon hd 4870, Radeon HD 4800 series graphics. The Thuban Phenom II X6 is the CPU in the Leo Platform which also includes the AMD 800 chipset series, AMD 890 chipset and the Evergreen (GPU family), Radeon HD 5800 series graphics. Features The Phenom II triples the shared L3 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Athlon 64
The Athlon 64 is a ninth-generation, AMD64-architecture microprocessor produced by Advanced Micro Devices (AMD), released on September 23, 2003. It is the third processor to bear the name ''Athlon'', and the immediate successor to the Athlon XP. The Athlon 64 was the second processor to implement the AMD64 architecture (after the Opteron) and the first 64-bit processor targeted at the average consumer. Variants of the Athlon 64 have been produced for Socket 754, Socket 939, Socket 940, and Socket AM2. It was AMD's primary consumer CPU, and primarily competed with Intel's Pentium 4, especially the ''Prescott'' and ''Cedar Mill'' core revisions. The Athlon 64 is AMD's first K8, eighth-generation processor core for desktop and mobile computers. Despite being natively 64-bit, the AMD64 architecture is backward-compatible with 32-bit x86 instructions. The Athlon 64 line was succeeded by the dual-core Athlon 64 X2 and Athlon X2 lines. Background The Athlon 64 was originally ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket FS1
The Socket FS1 is for notebooks using AMD APU processors codenamed ''Llano'', ''Trinity'' and ''Richland'' (Socket FS1r2). "Llano"-branded products combine K10 with Cedar (VLIW5), UVD 3 video acceleration and AMD Eyefinity-based multi-monitor support of up to three DisplayPort monitors. "Trinity"- and "Richland"-branded products Piledriver with Northern Islands (VLIW4), UVD 3 and VCE 1 video acceleration and AMD Eyefinity-based multi-monitor support of up to four DisplayPort monitors. While the AMD desktop CPUs are available in a 722-pin package Socket AM1 (FS1b), it is not clear whether these desktop CPUs will be compatible with Socket FS1 or vice versa. It is the last pin grid array socket for AMD's mobile processors - all mobile processors in microarchitectures succeeding Piledriver are exclusively available in BGA packaging, for example Steamroller-based mobile processors uses Socket FP3 socket, which is a μBGA socket. Intel also adopted same practice, starting wit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the Through-hole technology, through hole method or inserted into a CPU socket, socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). Chip mounting The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages contain multiple dies, for example Zen 2 and Zen 3 Ryzen CPUs for the Socket AM4, AM4 socket. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
