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CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include pin grid array (PGA) or land grid array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and ...
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AM5 Socket Open
AM5 can refer to: * Socket AM5 Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 was launched in September 2022 and is the su ..., a CPU socket for AMD processors * Sega AM5, a video game development studio {{Letter-number combination disambiguation ...
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Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'', Wiley VCH, 2000, , page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms a ...
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80186
The Intel 80186, also known as the iAPX 186, or just 186, is a microprocessor and microcontroller introduced in 1982. It was based on the Intel 8086 and, like it, had a 16-bit external data bus multiplexed with a 20-bit address bus. The 80188 variant, with an 8-bit external data bus was also available. Description The 80186 series was designed to reduce the number of integrated circuits required. It included features such as clock generator, interrupt controller, timers, wait state generator, DMA channels, and external chip select lines. It was used in numerous embedded systems, as microcontrollers with external memory. The initial clock rate of the 80186 was 6 MHz, but due to more hardware available for the microcode to use, especially for address calculation, many individual instructions completed in fewer clock cycles than on an 8086 at the same clock frequency. For instance, the common ''register+immediate'' addressing mode was significantly faster than on the 8 ...
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Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'', Wiley VCH, 2000, , page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms a ...
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8088
The Intel 8088 ("''eighty-eighty-eight''", also called iAPX 88) microprocessor is a variant of the Intel 8086. Introduced on June 1, 1979, the 8088 has an eight-bit external data bus instead of the 16-bit bus of the 8086. The 16-bit registers and the one megabyte address range are unchanged, however. In fact, according to the Intel documentation, the 8086 and 8088 have the same execution unit (EU)—only the bus interface unit (BIU) is different. The 8088 was used in the original IBM PC and in IBM PC compatible clones. History and description The 8088 was designed at Intel's laboratory in Haifa, Israel, as were a large number of Intel's processors. The 8088 was targeted at economical systems by allowing the use of an eight-bit data path and eight-bit support and peripheral chips; complex circuit boards were still fairly cumbersome and expensive when it was released. The prefetch queue of the 8088 was shortened to four bytes, from the 8086's six bytes, and the prefetch ...
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8086
The 8086 (also called iAPX 86) is a 16-bit microprocessor chip designed by Intel between early 1976 and June 8, 1978, when it was released. The Intel 8088, released July 1, 1979, is a slightly modified chip with an external 8-bit data bus (allowing the use of cheaper and fewer supporting ICs),Fewer TTL buffers, latches, multiplexers (although the amount of TTL logic was not drastically reduced). It also permits the use of cheap 8080-family ICs, where the 8254 CTC, 8255 PIO, and 8259 PIC were used in the IBM PC design. In addition, it makes PCB layout simpler and boards cheaper, as well as demanding fewer (1- or 4-bit wide) DRAM chips. and is notable as the processor used in the original IBM PC design. The 8086 gave rise to the x86 architecture, which eventually became Intel's most successful line of processors. On June 5, 2018, Intel released a limited-edition CPU celebrating the 40th anniversary of the Intel 8086, called the Intel Core i7-8086K. History Background In 1972 ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ...
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Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL) is an Semiconductor package, electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole technology, through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild Semiconductor, Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually refer ...
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Transfer (computing)
In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that occur in each second in some given data-transfer channel. It is also known as sample rate, i.e. the number of data samples captured per second, each sample normally occurring at the clock edge. The terms are neutral with respect to the method of physically accomplishing each such data-transfer operation; nevertheless, they are most commonly used in the context of transmission of digital data. is 106 or one million transfers per second; similarly, means 109, or equivalently in the US/ short scale, one billion transfers per second. Units These terms alone do not specify the bit rate at which binary data is being transferred because they do not specify the number of bits transferred in each transfer operation (known as the channel width ...
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Clock Rate
Clock rate or clock speed in computing typically refers to the frequency at which the clock generator of a processor can generate pulses used to synchronize the operations of its components. It is used as an indicator of the processor's speed. Clock rate is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers from the 1970s through the 1980s had clock rates measured in megahertz (MHz). In the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz). This metric is most useful when comparing processors within the same family, holding constant other features that may affect performance. Determining factors Binning Manufacturers of modern processors typically charge higher prices for processors that operate at higher clock rates, a practice called binning. For a given CPU, the clock rates are determined at the end of the manufact ...
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Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is thermal management (electronics), dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks computer cooling, are used to cool central processing unit, CPUs, graphics processing unit, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as Transistor#Other transistor types, power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are fact ...
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Signal Integrity
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage (or current) waveform. However, digital signals are fundamentally analog signal, analog in nature, and all signals are subject to effects such as electrical noise, noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), A survey of the field of electronic design automation. Portions of IC section of this article were derived (with permission) fro ...
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