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Socket FS1
The Socket FS1 is for notebooks using AMD APU processors codenamed ''Llano'', ''Trinity'' and ''Richland'' (Socket FS1r2). "Llano"-branded products combine K10 with Cedar (VLIW5), UVD 3 video acceleration and AMD Eyefinity-based multi-monitor support of up to three DisplayPort-monitors. "Trinity"- and "Richland"-branded products Piledriver with Northern Islands (VLIW4), UVD 3 and VCE 1 video acceleration and AMD Eyefinity-based multi-monitor support of up to four DisplayPort-monitors. While the AMD desktop CPUs are available in a 722-pin package Socket AM1 (FS1b), it is not clear whether these desktop CPUs will be compatible with Socket FS1 or vice versa. It is the last pin grid array socket for AMD's mobile processors - all mobile processors in microarchitectures succeeding Piledriver are exclusively available in BGA packaging, for example Steamroller-based mobile processors uses Socket FP3 socket, which is a μBGA socket. Intel also adopted same practice, starting wit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). PGA variants Plastic Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA. Flip chip A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Piledriver (microarchitecture)
AMD Piledriver Family 15h is a microarchitecture developed by AMD as the second-generation successor to Bulldozer. It targets desktop, mobile and server markets. It is used for the AMD Accelerated Processing Unit (formerly Fusion), AMD FX, and the Opteron line of processors. The changes over Bulldozer are incremental. Piledriver uses the same "module" design. Its main improvements are to branch prediction and FPU/integer scheduling, along with a switch to hard-edge flip-flops to improve power consumption. This resulted in clock speed gains of 8–10% and a performance increase of around 15% with similar power characteristics. FX-9590 is around 40% faster than Bulldozer-based FX-8150, mostly because of higher clock speed. Products based on Piledriver were first released on 15 May 2012 with the AMD Accelerated Processing Unit (APU), code-named Trinity, series of mobile products. APUs aimed at desktops followed in early October 2012 with Piledriver-based FX-series CPUs released l ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of AMD Accelerated Processing Unit Microprocessors
This is a list of microprocessors designed by AMD, under the AMD Accelerated Processing Unit product series. Features overview Graphics API overview Desktop APUs Lynx: "Llano" (2011) * Socket FM1 * CPU: K10 (or ''Husky'' or K10.5) with no L3 cache cores with an upgraded architecture known as ''Stars'' ** L1 Cache: 64 KB Data per core and 64 KB Instructions per core * ''MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet'', ''AMD-V'' * GPU: TeraScale 2 (Evergreen); all A and E series models feature ''Redwood''-class integrated graphics on die (''BeaverCreek'' for the dual-core variants and ''WinterPark'' for the quad-core variants). Sempron and Athlon models exclude integrated graphics. * List of embedded GPU's * Support for up to four DIMMs of up to DDR3-1866 memory * Fabrication 32 nm on GlobalFoundries SOI process; Die size: , with 1.178 billion transistors * 5 GT/s UMI * Integrated PCIe 2.0 controller * Select models suppo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Broadwell (microarchitecture)
Broadwell is the fifth generation of the Intel Core Processor. It is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication. Like some of the previous tick-tock iterations, Broadwell did not completely replace the full range of CPUs from the previous microarchitecture ( Haswell), as there were no low-end desktop CPUs based on Broadwell. Some of the processors based on the Broadwell microarchitecture are marketed as "5th-generation Core" i3, i5 and i7 processors. This moniker is however not used for marketing of the Broadwell-based Celeron, Pentium or Xeon chips. This microarchitecture also introduced the Core M processor branding. Broadwell is the last Intel platform on which Windows 7 is supported by either Intel or Microsoft; however, third-party hardware vendors have offered limited Windows 7 support on more recent platforms. Broadwell's ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket FP3
The Socket FP3 or μBGA906 is a CPU socket for laptops that was released in June 2014 by AMD with its mobility APU products codenamed ''Kaveri''. ''"Kaveri"''-branded products combine Steamroller with Crystal Series (GCN), UVD 4.2 and VCE 2 video acceleration, AMD TrueAudio audio acceleration and AMD Eyefinity-based multi-monitor support of up to two non-DisplayPort- or up to four DisplayPort monitors. * ECC DIMMs are supported on Socket FP3, mixing of ECC and non-ECC DIMMs within a system is not supported. * There are 3 PCI Express cores: one 2 x16 core and two 5 x8 cores, for a total of 64 lanes. There are 8 configurable ports, which can be divided into 2 groups: ** Gfx-group: contains 2 x8 ports. Each port can be limited to lower link widths for applications that require fewer lanes. Additionally, the two ports can be combined to create a single x16 link. ** GPP-group: contains 1 x4 UMI and 5 General Purpose Ports (GPP). All PCIe links are capable of supporting PCIe 2.x d ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Steamroller (microarchitecture)
AMD Steamroller Family 15h is a microarchitecture developed by AMD for AMD APUs, which succeeded Piledriver in the beginning of 2014 as the third-generation Bulldozer-based microarchitecture. Steamroller APUs continue to use two-core modules as their predecessors, while aiming at achieving greater levels of parallelism. Microarchitecture ''Steamroller'' still features two-core modules found in ''Bulldozer'' and ''Piledriver'' designs called clustered multi-thread (CMT), meaning that one module is marketed as a dual-core processor. The focus of ''Steamroller'' is for greater parallelism. Improvements center on independent instruction decoders for each core within a module, 25% more of the maximum width dispatches per thread, better instruction schedulers, improved perceptron branch predictor, larger and smarter caches, up to 30% fewer instruction cache misses, branch misprediction rate reduced by 20%, dynamically resizable L2 cache, micro-operations queue, more internal regist ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket AM1
Socket FS1b (rebranded as Socket AM1 ) is a socket designed by AMD, launched in April 2014 for desktop SoCs in the value segment. Socket AM1 is intended for a class of CPUs that contain both an integrated GPU and a chipset, essentially forming a complete SoC implementation, and as such has pins for display, PCI Express, SATA, and other I/O interfaces directly in the socket. AMD's first compatible CPUs, designated as APUs, are 4 socketable chips in the ''Kabini'' family of the Jaguar microarchitecture, marketed under the Athlon and Sempron names and announced on April 9, 2014. The brand names are Athlon and Sempron. The underlying microarchitectures are Jaguar and Puma. All products are SoCs, this means the Chipset is on the die of the APU and not on the motherboard. While the AMD mobile CPUs are available in a 722-pin package Socket FS1, it is not clear whether these notebook CPUs are compatible with Socket AM1 or vice versa. Its mobile counterpart is Socket FT3 (BGA-769). ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Video Coding Engine
Video Code Engine (VCE, was earlier referred to as Video Coding Engine, Video Compression Engine or Video Codec Engine in official AMD documentation) is AMD's video encoding application-specific integrated circuit implementing the video codec H.264/MPEG-4 AVC. Since 2012 it was integrated into all of their GPUs and APUs except Oland. VCE was introduced with the Radeon HD 7000 Series on 22 December 2011. VCE occupies a considerable amount of the die surface at the time of its introduction and is not to be confused with AMD's Unified Video Decoder (UVD). As of AMD Raven Ridge (released January 2018), UVD and VCE were succeeded by Video Core Next (VCN). Overview The handling of video data involves computation of data compression algorithms and possibly of video processing algorithms. As the template compression methods shows, lossy video compression algorithms involve the steps: motion estimation (ME), discrete cosine transform (DCT), and entropy encoding (EC). AMD Video Cod ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Radeon HD 6000 Series
The Northern Islands series is a family of GPUs developed by Advanced Micro Devices (AMD) forming part of its Radeon-brand, based on the 40 nm process. Some models are based on TeraScale 2 (VLIW5), some on the new TeraScale 3 (VLIW4) introduced with them. Starting with this family, the former ATI brand was officially discontinued in favor of making a correlation between the graphics products and the AMD branding for computing platforms (the CPUs and chipsets). Therefore, the AMD brand was used as the replacement. The logo for graphics products and technologies also received a minor makeover (using design elements of the 2010 "AMD Vision" logo). This also marks the end of the "Mobility Radeon" name in their laptop GPUs, keeping only the "M" suffix in the GPU model number to signify a Mobile variant. Its direct competitor was Nvidia's GeForce 500 Series; they were launched approximately a month apart. Architecture This article is about all products under the Radeon HD 6000 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DisplayPort
DisplayPort (DP) is a digital display interface developed by a consortium of PC and chip manufacturers and standardized by the Video Electronics Standards Association (VESA). It is primarily used to connect a video source to a display device such as a computer monitor A computer monitor is an output device that displays information in pictorial or textual form. A discrete monitor comprises a visual display, support electronics, power supply, housing, electrical connectors, and external user controls. The di .... It can also carry audio signal, audio, USB, and other forms of data. DisplayPort was designed to replace VGA connector, VGA, FPD-Link, and Digital Visual Interface (DVI). It is backward compatibility, backward compatible with other interfaces, such as HDMI and DVI, through the use of either active or passive adapters. It is the first display interface to rely on packetized data transmission, a form of digital communication found in technologies such as Ethernet, U ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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