|
Chiplet
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package to create a complex component such as a computer processor. Each chiplet in a computer processor provides only a portion of the processor's total functionality. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC) which is monolithic as it comprises a single silicon die: * Reusable IP (intellectual property): the same chiplet can be used in many different devices * Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function * Known good die: chiplets can be tested before assembly, improving the yield of the final device. Multiple chiplets working together in a single integrated circuit may be called a multi-chip modul ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UCIe
Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets. It is co-developed by AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC. In August 2022, Alibaba Group and Nvidia joined as board members. Overview A common chiplet interconnect specification enables construction of large System-on-Chip (SoC) packages that exceed maximum reticle size. It allows intermixing components from different silicon vendors within the same package and improves manufacturing yields by using smaller dies. Each chiplet can use a different silicon manufacturing process, suitable for a specific device type, or computing performance and power draw requirements. Specifications 1.0 The UCIe 1.0 specification was released on March 2, 2022. It defines physical layer, protocol stack and software model, as well as procedures for compliance testing. The physical layer supports up to 32 GT/s with ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or Lead (electronics), "pins") where multiple integrated circuits (ICs or "chips"), semiconductor Die (integrated circuit), dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Packaging (semiconductors)
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. Advanced packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities, unlike traditional integrated circuit packaging, which does not. Advanced packaging thus sits between fabrication and traditional packaging -- or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplet A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System On A Chip
A system on a chip (SoC) is an integrated circuit that combines most or all key components of a computer or Electronics, electronic system onto a single microchip. Typically, an SoC includes a central processing unit (CPU) with computer memory, memory, input/output, and computer data storage#Secondary storage, data storage control functions, along with optional features like a graphics processing unit (GPU), Wi-Fi connectivity, and radio frequency processing. This high level of integration minimizes the need for separate, discrete components, thereby enhancing Performance per watt, power efficiency and simplifying device design. High-performance SoCs are often paired with dedicated memory, such as LPDDR, and flash storage chips, such as Universal Flash Storage, eUFS or eMMC, which may be stacked directly on top of the SoC in a Package on a package, package-on-package (PoP) configuration or placed nearby on the motherboard. Some SoCs also operate alongside specialized chips, such ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Ryzen
Ryzen ( ) is a brand of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments, and accelerated processing units (APUs), marketed for mainstream and entry-level segments, and embedded systems applications. A majority of AMD's consumer Ryzen products use the AM4 and AM5 platforms. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast and workstation markets. Ryzen Threadripper uses different, larger sockets such as TR4, sTRX4, sWRX8, and sTR5, which support additional memory channels and PCI Express lanes. AMD has moved to the new AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022. History Background Ryzen uses the "Zen" CPU microarchitecture, a redesign that returned AMD to the high-en ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen 2
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019. At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more than eight cores in the final lineup. At Computex 2019, AMD revealed that the Ze ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Meteor Lake
Meteor Lake is the codename for Core Ultra Series 1 mobile processors, designed by Intel and officially released on December 14, 2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Meteor Lake's design effort was led by Tim Wilson. Background In July 2021, Meteor Lake was initially announced to be coming with a 5–125W TDP range for various segments ranging from ultra low power mobile to enthusiast desktop. The initial tape-in process for Meteor Lake took place in May 2021. The CPU compute tile was confirmed to be fabricated on Intel's 7nm process (since rebranded to "Intel 4"). In October 2021, Intel said in an earnings call that it had taped out the CPU compute tile for Meteor Lake and after it was received it had powered on within 30 minutes and with expected performance levels. In April 2022, Intel announced that an assembled Meteor Lake mobile processor had been powered-on for th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Process Node
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as RAM and flash memory). It is a multiple-step photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the central part being the "clean room". In more advanced semiconduc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Integrated Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or Integrated circuits, monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed wiring board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit", as the term is currently used, usually refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hyb ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
