Advanced packaging is the aggregation and interconnection of components before traditional
integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. ...
. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be merged and packaged as a single electronic device. Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques that are performed at
semiconductor fabrication facilities. Advanced packaging thus sits between
fabrication and traditional packaging -- or, in other terminology, between
BEoL
The back end of line (BEOL) is the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer, the metalization layer. Common metals are copper and alumi ...
and post-fab. Advanced packaging includes
multi-chip module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are int ...
s,
3D ICs,
2.5D ICs,
heterogeneous integration
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are in ...
,
fan-out wafer-level packaging
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
In c ...
,
system-in-package,
quilt packaging
Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “ nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically ro ...
, combining logic (processors) and memory in a single package, die stacking, several
chiplet
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO ...
s or dies in a package, combinations of these techniques, and others.
Advanced packaging can help achieve performance gains through the integration of several devices in one package and associated efficiency gains (by reducing the distances signals have to travel, in other words reducing signal paths), and allowing for high numbers of connections between devices, without having to resort to smaller transistors which have become increasingly more difficult to manufacture.
[https://semiengineering.com/advanced-packagings-next-wave/]
References
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Semiconductor technology