Chiplet
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC): * Reusable IP (Intellectual Property): the same chiplet can be used in many different devices * Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function * Known good die: chiplets can be tested before assembly, improving the yield of the final device Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, 2.5D IC, or an advanced package. Chiplets may be connected with standards such as UCIe, Bunch of Wires (BoW), OpenHBI, and OIF XSR. See also * UCIe Universal Chiplet Interconnect Express (UCIe) ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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UCIe
Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets. It is co-developed by AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC. In August 2022, Alibaba Group and NVIDIA joined as board members. Overview A common chiplet interconnect specification enables construction of large System-on-Chip (SoC) packages that exceed maximum reticle size. It allows intermixing components from different silicon vendors within the same package and improves manufacturing yields by using smaller dies. Each chiplet can use different silicon manufacturing process suitable for a specific device type or computing performance and power draw requirements. Specifications The UCIe 1.0 specification was released on March 2, 2022. It defines physical layer, protocol stack and software model, as well as procedures for compliance testing. The physical layer supports up to 32 GT/s with 16 to 64 la ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Integrated Circuits
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern compute ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Interposer
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. Interposer comes from the Latin word "interpōnere", meaning "to put between". They are often used in BGA packages, multi-chip modules and high bandwidth memory. A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II. This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible. Silicon and glass are also evaluated as an integration method. Interposer stacks are also a widely accepted, cost-effective alternative to 3D ICs. There are already several products with interposer technology in the market, notably the AMD Fiji/Fury GPU, and the Xilinx Virtex-7 FPGA. In 2016, CEA Leti demonstrated their second generation 3D- NoC technology which combines small ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Advanced Packaging (semiconductors)
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be merged and packaged as a single electronic device. Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques that are performed at semiconductor fabrication facilities. Advanced packaging thus sits between fabrication and traditional packaging -- or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, several chiplet A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single pack ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Electronic Packaging
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering. Design Electronic packaging can be organized by levels: * Level 0 - "Chip", protecting a bare semiconductor die from contamination and damage. * Level 1 - ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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LEGO
Lego ( , ; stylized as LEGO) is a line of plastic construction toys that are manufactured by The Lego Group, a privately held company based in Billund, Denmark. The company's flagship product, Lego, consists of variously colored interlocking plastic bricks accompanying an array of gears, figurines called minifigures, and various other parts. Lego pieces can be assembled and connected in many ways to construct objects, including vehicles, buildings, and working robots. Anything constructed can be taken apart again, and the pieces reused to make new things. The Lego Group began manufacturing the interlocking toy bricks in 1949. Movies, games, competitions and eight Legoland amusement parks have been developed under the brand. , 600 billion Lego parts had been produced. History The Lego Group began in the workshop of Ole Kirk Christiansen (1891–1958), a carpenter from Billund, Denmark, who began making wooden toys in 1932. In 1934, his company came to be called ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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System On A Chip
A system on a chip or system-on-chip (SoC ; pl. ''SoCs'' ) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memory interfaces, on-chip input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. It may contain digital, analog, mixed-signal, and often radio frequency signal processing functions (otherwise it is considered only an application processor). Higher-performance SoCs are often paired with dedicated and physically separate memory and secondary storage (such as LPDDR and eUFS or eMMC, respectively) chips, that may be layered on top of the SoC in what's known as a package on package (PoP) configuration, or be placed close to the SoC. Additionally, SoCs may use separate wireless modems. ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Node
In general, a node is a localized swelling (a "knot") or a point of intersection (a vertex). Node may refer to: In mathematics *Vertex (graph theory), a vertex in a mathematical graph *Vertex (geometry), a point where two or more curves, lines, or edges meet. *Node (autonomous system), behaviour for an ordinary differential equation near a critical point *Singular point of an algebraic variety, a type of singular point of a curve In science and engineering Astronomy *Orbital node, the points where an orbit crosses a plane of reference ** Lunar node, where the orbits of the sun and moon intersect ** Longitude of the ascending node, how orbital nodes are parameterized Biology *Lymph node, an immune system organ used to store white blood cells *Node of Ranvier, periodic gaps in the insulating myelin sheaths of myelinated axons *Sinoatrial node and atrioventricular node, specialized tissues in the heart responsible for initiating and coordinating the heartbeat *Primitive knot or p ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |
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Hybrid Integrated Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit" as the term is currently used refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hybrid circuits could be enc ... [...More Info...]       [...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]   |