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Tejas And Jayhawk
Tejas was a code name for Intel's microprocessor, which was to be a successor to the latest Pentium 4 with the Prescott core and was sometimes referred to as Pentium V. Jayhawk was a code name for its Xeon counterpart. The cancellation of the processors in May 2004 underscored Intel's historical transition of its focus on single-core processors to multi-core processors. History In early 2003, Intel showed Tejas and a plan to release it sometime in 2004, but put it off to 2005. Intel, however, canceled development on May 7, 2004. Analysts attribute these delays and cancellation to heat and power consumption problems due to their goal of reaching ever higher clock speeds, even when sacrificing work done per clock (and therefore performance per clock) in the process. This was already the case with Prescott and its mediocre performance increase over Northwood (not to mention heavy competition from Advanced Micro Devices (AMD) with their Athlon 64). Its changes were done to allow Presco ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Corporation
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–19 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Laptops
A laptop, laptop computer, or notebook computer is a small, portable personal computer (PC) with a screen and alphanumeric keyboard. Laptops typically have a clam shell form factor with the screen mounted on the inside of the upper lid and the keyboard on the inside of the lower lid, although 2-in-1 PCs with a detachable keyboard are often marketed as laptops or as having a "laptop mode". Laptops are folded shut for transportation, and thus are suitable for mobile use. They are so named because they can be practically placed on a person's lap when being used. Today, laptops are used in a variety of settings, such as at work, in education, for playing games, web browsing, for personal multimedia, and for general home computer use. As of 2022, in American English, the terms ''laptop computer'' and ''notebook computer'' are used interchangeably; in other dialects of English, one or the other may be preferred. Although the terms ''notebook computers'' or ''notebooks'' or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 775
LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU). The socket had an unusually long life span, lasting 7 years until the last processors supporting it ceased production in 2011. The socket was superseded by the LGA 1156 (Socket H) and LGA 1366 (Socket B) sockets. LGA 775 processors (some of the processors listed here might not work on newer Intel based chipsets) * Pentium 4 * Pentium 4 Extreme Edition * Pentium D * Celeron/Celeron D * Pentium Dual-Core * Pentium Extreme Edition * Core 2 Duo/Core 2 Quad Heatsink design For LGA 775, the distance between the screw-holes for the heatsink is 72 mm. Such heat-sinks are not interchangeable with heatsinks for sockets that have a distance of 75 mm, such as LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tapeout
In electronics and photonics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing. The tapeout is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility. History Historically, the term references the early days of printed circuit design, when the enlarged (for higher precision) "artwork" for the photomask was manually "taped out" using black line tape (commonly Bishop Graphics crepe) and also Rubylith sheets. In the post-war era of the 1940–50s, the techniques developed for rapid and low-cost circuit reproduction evolved to photographically replicated 2D manufacturing. The verb "to tapeout" was already widely used for the process and adopted for transistor fabrication, which evolved to full integrated-circuit approaches. Procedures involved The term ''tapeout'' currently is used to describe the creation of the p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SSSE3
Supplemental Streaming SIMD Extensions 3 (SSSE3 or SSE3S) is a SIMD instruction set created by Intel and is the fourth iteration of the SSE technology. History SSSE3 was first introduced with Intel processors based on the Core microarchitecture on June 26, 2006 with the "Woodcrest" Xeons. SSSE3 has been referred to by the codenames Tejas New Instructions (TNI) or Merom New Instructions (MNI) for the first processor designs intended to support it. Functionality SSSE3 contains 16 new discrete instructions. Each instruction can act on 64-bit MMX or 128-bit XMM registers. Therefore, Intel's materials refer to 32 new instructions. They include: * Twelve instructions that perform horizontal addition or subtraction operations. * Six instructions that evaluate absolute values. * Two instructions that perform multiply-and-add operations and speed up the evaluation of dot products. * Two instructions that accelerate packed integer multiply operations and produce integer values with ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Streaming SIMD Extensions
In computing, Streaming SIMD Extensions (SSE) is a single instruction, multiple data (SIMD) instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series of Central processing units (CPUs) shortly after the appearance of Advanced Micro Devices (AMD's) 3DNow!. SSE contains 70 new instructions (65 unique mnemonics using 70 encodings), most of which work on single precision floating-point data. SIMD instructions can greatly increase performance when exactly the same operations are to be performed on multiple data objects. Typical applications are digital signal processing and graphics processing. Intel's first IA-32 SIMD effort was the MMX instruction set. MMX had two main problems: it re-used existing x87 floating-point registers making the CPUs unable to work on both floating-point and SIMD data at the same time, and it only worked on integers. SSE floating-point instructions operate on a new independent register set, the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hyper-Threading
Hyper-threading (officially called Hyper-Threading Technology or HT Technology and abbreviated as HTT or HT) is Intel's proprietary simultaneous multithreading (SMT) implementation used to improve parallelization of computations (doing multiple tasks at once) performed on x86 microprocessors. It was introduced on Xeon server processors in February 2002 and on Pentium 4 desktop processors in November 2002. Since then, Intel has included this technology in Itanium, Atom, and Core 'i' Series CPUs, among others. For each processor core that is physically present, the operating system addresses two virtual (logical) cores and shares the workload between them when possible. The main function of hyper-threading is to increase the number of independent instructions in the pipeline; it takes advantage of superscalar architecture, in which multiple instructions operate on separate data in parallel. With HTT, one physical core appears as two processors to the operating system, a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Trace Cache
In computer architecture, a trace cache or execution trace cache is a specialized instruction cache which stores the dynamic stream of instructions known as trace. It helps in increasing the instruction fetch bandwidth and decreasing power consumption (in the case of Intel Pentium 4) by storing traces of instructions that have already been fetched and decoded. A trace processor is an architecture designed around the trace cache and processes the instructions at trace level granularity. The formal mathematical theory of traces is described by trace monoids. Background The earliest academic publication of trace cache was "Trace Cache: a Low Latency Approach to High Bandwidth Instruction Fetching". This widely acknowledged paper was presented by Eric Rotenberg, Steve Bennett, and Jim Smith at 1996 International Symposium on Microarchitecture (MICRO) conference. An earlier publication is US patent 5381533, by Alex Peleg and Uri Weiser of Intel, "Dynamic flow instruction cache memory o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual Core
A multi-core processor is a microprocessor on a single integrated circuit with two or more separate Central processing unit, processing units, called cores, each of which reads and executes Instruction set, program instructions. The instructions are ordinary Instruction set, CPU instructions (such as add, move data, and branch) but the single processor can run instructions on separate cores at the same time, increasing overall speed for programs that support Multithreading (computer architecture), multithreading or other parallel computing techniques. Manufacturers typically integrate the cores onto a single integrated circuit Die (integrated circuit), die (known as a chip multiprocessor or CMP) or onto multiple dies in a single Chip carrier, chip package. The microprocessors currently used in almost all personal computers are multi-core. A multi-core processor implements multiprocessing in a single physical package. Designers may couple cores in a multi-core device tightly or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit (MMU) w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
65 Nm
The 65 nm process is an advanced lithographic node used in volume CMOS ( MOSFET) semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. For comparison, cellular ribosomes are about 20 nm end-to-end. A crystal of bulk silicon has a lattice constant of 0.543 nm, so such transistors are on the order of 100 atoms across. Toshiba and Sony announced the 65 nm process in 2002, before Fujitsu and Toshiba began production in 2004, and then TSMC began production in 2005. By September 2007, Intel, AMD, IBM, UMC and Chartered were also producing 65 nm chips. While feature sizes may be drawn as 65 nm or less, the wavelengths of light used for lithography are 193 nm and 248 nm. Fabrication of sub-wavelength features requires special imaging technologies, such as optical proximity correction and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
