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Socket SP5
Socket SP5 (LGA 6096) is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen 4-based Epyc server processors that launched on November 10, 2022. History In June 2017, with the launch of the first generation Epyc server processors, AMD introduced the SP3 socket. The SP3 socket covered three generations of Epyc processors, including Naples, Rome and Milan. AMD's Genoa processors contain up to 96 Zen 4 cores compared to Milan's maximum of 64 cores. In support of Genoa's 96 cores, AMD introduced the SP5 socket with 2002 more contact pins than the SP3 socket to provide greater power delivery and signal integrity. SP5 can provide a peak power of up to 700W. The SP5 socket will support future Epyc processors, codenamed Bergamo, which has up to 128 Zen 4c cores and are set to debut in the first half of 2023. Additionally, some Bergamo processors will use SP5's successor, Socket SP6. Features * Supports 12 channels of DDR5 ECC RAM with 6TB maximum ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip-chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both directions. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
HyperTransport
HyperTransport (HT), formerly known as Lightning Data Transport, is a technology for interconnection of computer processors. It is a bidirectional serial/parallel high-bandwidth, low- latency point-to-point link that was introduced on April 2, 2001. The HyperTransport Consortium is in charge of promoting and developing HyperTransport technology. HyperTransport is best known as the system bus architecture of AMD central processing units (CPUs) from Athlon 64 through AMD FX and the associated motherboard chipsets. HyperTransport has also been used by IBM and Apple for the Power Mac G5 machines, as well as a number of modern MIPS systems. The current specification HTX 3.1 remained competitive for 2014 high-speed (2666 and 3200 MT/s or about 10.4 GB/s and 12.8 GB/s) DDR4 RAM and slower (around 1 GB/similar to high end Solid-state drive#Standard card form factors, PCIe SSDs ULLtraDIMM flash RAM) technology—a wider range of RAM speeds on a common CPU bus ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Epyc
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets. Epyc processors share the same microarchitecture as their regular desktop-grade counterparts, but have enterprise-grade features such as higher core counts, more PCI Express lanes, support for larger amounts of RAM, and larger cache memory. They also support multi-chip and dual-socket system configurations by using the Infinity Fabric interconnect. History In March 2017, AMD announced plans to re-enter the server market with a platform based on the Zen microarchitecture, codenamed Naples, and officially revealed it under the brand name Epyc in May. That June, AMD officially launched Epyc 7001 series processors, offering up to 32 cores per socket, and enabling performance that allowed Epyc to be competitive with the competing Intel Xeon product line. Two years ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket SP3
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as Socket TR4, and Socket sTRX4, users can use CPU coolers designed for not only those sockets, but CPU coolers designed for sTR4 and sTRX4. Socket SP3 is a system in a package socket - that means most features required to make the system fully functional (such as memory, PCI Express, SATA controllers etc.) are fully integrated into the processor, eliminating the need for a chipset to be placed on a motherboard. Variants for desktop platforms (as said below) are, eventually, requiring additional chipset to provide improved functionality of the system. A processor using socket SP3 is mounted by inserting the CPU into a slide and fixing the slide assembly by tightening three screws using the torque wrenches normally provided alongside the motherboard. Automated processor mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR5 SDRAM
Double Data Rate 5 Synchronous Dynamic Random-Access Memory (DDR5 SDRAM) is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020. A new feature called Decision Feedback Equalization (DFE) enables I/O speed scalability for higher bandwidth and performance improvement. DDR5 supports more bandwidth than its predecessor, DDR4, with 4.8 gigabits per second possible, but not shipping at launch. DDR5 has about the same latency as DDR4 and DDR3. DDR5 octuples the maximum DIMM capacity from 64 GB to 512 GB. DDR5 also has higher frequencies than DDR4. Rambus announced a working DDR5 DIMM in September 2017. On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; it runs at 5200 MT/s at 1.1 V. In February 2019, SK Hynix announced a 6400 MT/s chip, the highest speed specified by the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and serv ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Micro Devices
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
