|
Socket SP3
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as Socket TR4, and Socket sTRX4, users can use CPU coolers designed for not only those sockets, but CPU coolers designed for sTR4 and sTRX4. Socket SP3 is a system in a package socket - that means most features required to make the system fully functional (such as memory, PCI Express, SATA controllers etc.) are fully integrated into the processor, eliminating the need for a chipset to be placed on a motherboard. Variants for desktop platforms (as said below) are, eventually, requiring additional chipset to provide improved functionality of the system. A processor using socket SP3 is mounted by inserting the CPU into a slide and fixing the slide assembly by tightening three screws using the torque wrenches normally provided alongside the motherboard. Automated processor mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Amd Socket Sp3 IMGP3469 Smial Wp
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within the co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 3647
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"), Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors. The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place. Variants There are two sub-versions of this socket with differences also in the ILM (Independent Loading Mechanism, pitch of center screws changed slightly and a more visible one being that the guiding pins are in other corners). The processor socket and the matching notches on the processor are at different location, preventing insertion of an incompatible processor and preventing use of the wrong heatsink in a system. The more common P0 variant ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket AM4
Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen (including Zen+, Zen 2 and Zen 3) and Excavator microarchitectures. ''AM4'' was launched in September 2016 and was designed to replace the sockets AM3+, FM2+ and FS1b as a single platform. It has 1331 pin slots and is the first from AMD to support DDR4 memory as well as achieve unified compatibility between high-end CPUs (previously using Socket AM3+) and AMD's lower-end APUs (on various other sockets). In 2017, AMD made a commitment to using the AM4 platform with socket 1331 until 2020. Features * Support for Zen (including Zen+, Zen 2 and Zen 3) based family of CPUs and APUs (Ryzen, Athlon), as well as for some A-Series APUs and Athlon X4 CPUs (Bristol Ridge based on the Excavator microarchitecture) * Supports PCIe 3.0 and PCIe 4.0 * Supports up to 4 modules of DDR4 RAM in dual-channel configuration Heatsink The AM4 socket specifies the 4 holes for fastening the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System In A Package
A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die. SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket STRX4
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based Castle Peak Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms Socket sTRX4 is the direct successor to Socket TR4 used in the first- and second-generation Ryzen Threadripper products. It is physically identical to, but electrically incompatible with, both TR4 and AMD's server Socket SP3. While Socket SP3 doesn't require a chipset, instead utilizing a system-on-a-chip design, Socket sTRX4 and its predecessor require a chipset to provide improved connectivity and functionality. For Socket sTRX4, the TRX40 chipset was developed, which provides a total of 88 PCIe 4.0 lanes, an increase from the 66 PCIe 3.0 lanes on its predecessor platform. Also it no longer features a built-in High Definition Audio interface; instead motherboard manufacturers are including a separate audio controller onbo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket TR4
Socket TR4, also known as ''Socket SP3r2'', is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors. Socket TR4 is AMD's second LGA socket for a consumer product after the short lived Socket 1207 FX. It is physically identical to, but electrically incompatible with both AMD's server Socket SP3, and Socket TR4's successor socket, Socket sTRX4. While Socket SP3 does not require a chipset, instead utilising a system-on-a-chip design, Socket TR4 and its successor require a chipset to provide improved functionality. For Socket TR4, the AMD X399 chipset was developed, which supports a total of 64 PCIe 4.0 lanes for quad SLI/CrossFire configurations. The socket is made by both Foxconn and Lotes. Se ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen 3
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process, 7 nm process for the chiplets and GlobalFoundries's 14 nm process, 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan"). Zen 3 is supported on motherboards with List of AMD chipsets#AM4 chipsets, 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is expected to be the last microarchitecture before AMD switches to DDR5 memory and new sockets. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2. On April 1, 2022, AMD released the new Ryzen 6000 series for the laptop, using an improved "Zen 3+" architecture, bringing RDNA 2 graphics integrated in a APU to the PC for the first time. On Apri ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen 2
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nanometer MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019. At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more than eight cores in the final lineup. At Computex 2019, AMD revealed that ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen (microarchitecture)
Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), Ryzen Threadripper (workstation/high end desktop), and Epyc (server). Comparison History First generation The first generation Zen was launched with the Ryzen 1000 series of CPUs (codenamed Summit Ridge) in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs reached the market in early March 2017, and Zen-derived Epyc server processors (codenamed "Naples") launched in June 2017 and Zen-based APUs (codenamed "Raven Ridge") arrived in November 2017. This first iteration of Zen utilized Global Foundries' 14 nm manufacturing process. First generation refresh Zen+ was first released in April 2018, powering the second ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Micro Devices
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and serv ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
