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Socket 603
Socket 603 is a motherboard socket for Intel's Xeon processor. Technical specifications Socket 603 was designed by Intel as a zero insertion force socket intended for workstations and server platforms. It contains 603 contacts arrayed in a grid about the center of the socket, each contact has a 1.27mm pitch with regular pin array, to mate with a 603-pin processor package. Intel's design notes distinguish Socket 603 from Socket 604 as low cost, low risk, robust, high volume manufacturable, and multi-sourceable.Microsoft Word - 603 Pin Socket DG.doc
All Socket 603 processors have a bus speed of 400 MHz and were manufactured in either a 180 nm process, or 130 nm process. Socket 603 processors can be inserted into



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Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexagonal ends of an Allen wrench will fit * Socket termination, a termination used at the ends of wire rope * Socket, the receptacle into which a tapered tool is inserted * Socket, an opening in any fitting that matches the outside diameter of a pipe or tube Biology * Eye socket, a region in the skull where the eyes are positioned * Tooth socket, a cavity containing a tooth, in those bones that bear teeth * Dry socket, an opening as a result of the blood not clotting after a tooth is pulled * Ball and socket joint Computing * Network socket, an end-point in a communication across a network or the Internet * Unix domain socket, an end-point in local inter-process communication * socket(), a system call defined by the Berkeley sockets API * C ...
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Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). PGA variants Plastic Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA. Flip chip A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ...
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Xeon
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ...
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Slot 2
Slot 2 refers to the physical and electrical specification for the 330-lead Single Edge Contact Cartridge (or edge-connector) used by Intel's Pentium II Xeon and Pentium III Xeon. When first introduced, Slot 1 Pentium IIs were intended to replace the Pentium and Pentium Pro processors in the home, desktop, and low-end symmetric multiprocessing (SMP) markets. The Pentium II Xeon, which was aimed at multiprocessor workstations and servers, was largely similar to the ordinary Pentium II, being based on the same P6 Deschutes core, differing by offering the choice of L2 cache capacity of 1024 or 2048 KB besides 512 KB,In the context to semiconductor memory such as cache, KB refers to 210 bytes and by operating it at the core frequency (the Pentium II used cheaper third-party SRAM chips, running at 50% of CPU speed, to reduce cost). Because the design of the 242-lead Slot 1 connector did not support the full-speed L2 cache of the Xeon, an extended 330-lead connector was ...
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Socket 604
Socket 604 is a 604-pin microprocessor socket designed to interface an Intel's Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink. Launched at November 18, 2002, over the year after Socket 603, it was originally used to accommodate most Xeons introduced at the time. It was succeeded by LGA 771 in 2006 for low- and mid-end server ranges, but still staying in high-end server range, including 4- and 8-processor configurations, in which the successor - LGA 1567 - appeared in 2010. At the time, LGA 1366 was the primary socket for Xeons in low- and mid-end server ranges, with cheaper configurations still sometimes using LGA 771 socket. The socket had an unusually long life span, lasting 9 years (2 years longer than consumer-grade LGA 775) until the last processors supporting it ceased production in the 3rd quarter of 2011. Technical specifications Socket 604 was designed by Intel ...
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Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ...
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