|
NanoFoil
Reactive multi-layer foils are a class of reactive materials, sometimes referred to as a pyrotechnic initiator of two mutually reactive metals, sputtered to form thin layers that create a laminated foil. On initiation by a heat pulse, delivered by a bridge wire, a laser pulse, an electric spark, a flame, or by other means, the metals undergo self-sustaining exothermic reaction, producing an intermetallic compound. The reaction occurs in solid and liquid phase only, without releasing any gas. One particular type of such materials is aluminum-nickel multilayered foil, that produces (NiAl). Other similar materials are composed of aluminium-titanium, or titanium-amorphous silicon, are used for joining materials by reactive bonding. Other similar intermetallic compositions used in pyrotechnics are titanium-boron and aluminium-palladium ("Pyrofuze"). These foils are made in a range of thicknesses, e.g. 60, 80, 100, and 150 micrometers. The flame front propagation rate ranges generally ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reactive Bonding
Reactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two alternating different thin metallic films. The self-propagating exothermic reaction within the multilayer system contributes the local heat to bond the solder films. Based on the limited temperature the substrate material is exposed, temperature-sensitive components and materials with different CTEs, i.e. metals, polymers and ceramics, can be used without thermal damage. Overview ] The bonding is based on reactive nano scale multilayers providing an internal heat source. These foils are combined with additional solder layers to achieve bonding. The heat that is required for the bonding is created by a self-propagating exothermic reaction of the multilayer system. This reaction is ignited by an energy pulse, i.e. temperature, mechanical pressure, electrical spark or laser pulse. The g ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reactive Material
In the United States Department of Defense, U.S. military, reactive materials (RM) are a new class of materials currently being investigated by the Office of Naval Research and others as a means to increase the lethality of direct-hit or fragmentation warheads. Reactive materials are similar to insensitive munitions#Insensitive high explosives, insensitive high explosives, but are usually thermite-like pyrotechnic compositions of two or more nonexplosive solid materials, which stay inert and do not react with each other until subjected to a sufficiently strong mechanical, electrical or laser stimulus, after which they undergo fast burning or explosion with release of high amount of chemical energy in addition to their kinetic energy. Fragments or projectiles made of such materials have therefore greater damaging effect than inert ones, with expected lethality increase up to 500%. The material classes under investigation are thermites, intermetallic compounds, metal-polymer mixtures ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Palladium
Palladium is a chemical element with the symbol Pd and atomic number 46. It is a rare and lustrous silvery-white metal discovered in 1803 by the English chemist William Hyde Wollaston. He named it after the asteroid Pallas, which was itself named after the epithet of the Greek goddess Athena, acquired by her when she slew Pallas. Palladium, platinum, rhodium, ruthenium, iridium and osmium form a group of elements referred to as the platinum group metals (PGMs). They have similar chemical properties, but palladium has the lowest melting point and is the least dense of them. More than half the supply of palladium and its congener platinum is used in catalytic converters, which convert as much as 90% of the harmful gases in automobile exhaust (hydrocarbons, carbon monoxide, and nitrogen dioxide) into nontoxic substances (nitrogen, carbon dioxide and water vapor). Palladium is also used in electronics, dentistry, medicine, hydrogen purification, chemical applications, groundwate ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solar Panel
A solar cell panel, solar electric panel, photo-voltaic (PV) module, PV panel or solar panel is an assembly of photovoltaic solar cells mounted in a (usually rectangular) frame, and a neatly organised collection of PV panels is called a photovoltaic system or solar array. Solar panels capture sunlight as a source of radiant energy, which is converted into electric energy in the form of direct current (DC) electricity. Arrays of a photovoltaic system can be used to generate solar electricity that supplies electrical equipment directly, or grid-connected photovoltaic system, feeds power back into an alternate current (AC) electric grid, grid via an solar inverter, inverter system. History In 1839, the ability of some materials to create an electrical charge from light exposure was first observed by the French physicist Edmond Becquerel. Though these initial solar panels were too inefficient for even simple electric devices, they were used as an instrument to measure light. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Concentrated Photovoltaics
Concentrator photovoltaics (CPV) (also known as concentration photovoltaics) is a photovoltaic technology that generates electricity from sunlight. Unlike conventional photovoltaic systems, it uses lenses or curved mirrors to focus sunlight onto small, highly efficient, multi-junction (MJ) solar cells. In addition, CPV systems often use solar trackers and sometimes a cooling system to further increase their efficiency. Systems using high-concentration photovoltaics (HCPV) possess the highest efficiency of all existing PV technologies, achieving near 40% for production modules and 30% for systems. They enable a smaller photovoltaic array that has the potential to reduce land use, waste heat and material, and balance of system costs. The rate of annual CPV installations peaked in 2012 and has fallen to near zero since 2018 with the faster price drop in crystalline silicon photovoltaics. In 2016, cumulative CPV installations reached 350 megawatts (MW), less than 0.2% of the g ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heatsink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die Attachment
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics
The field of electronics is a branch of physics and electrical engineering that deals with the emission, behaviour and effects of electrons using electronic devices. Electronics uses active devices to control electron flow by amplification and rectification, which distinguishes it from classical electrical engineering, which only uses passive effects such as resistance, capacitance and inductance to control electric current flow. Electronics has hugely influenced the development of modern society. The central driving force behind the entire electronics industry is the semiconductor industry sector, which has annual sales of over $481 billion as of 2018. The largest industry sector is e-commerce, which generated over $29 trillion in 2017. History and development Electronics has hugely influenced the development of modern society. The identification of the electron in 1897, along with the subsequent invention of the vacuum tube which could amplify and rectify small ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Expansion Coefficient
Thermal expansion is the tendency of matter to change its shape, area, volume, and density in response to a change in temperature, usually not including phase transitions. Temperature is a monotonic function of the average molecular kinetic energy of a substance. When a substance is heated, molecules begin to vibrate and move more, usually creating more distance between themselves. Substances which contract with increasing temperature are unusual, and only occur within limited temperature ranges (see examples below). The relative expansion (also called strain) divided by the change in temperature is called the material's coefficient of linear thermal expansion and generally varies with temperature. As energy in particles increases, they start moving faster and faster weakening the intermolecular forces between them, therefore expanding the substance. Overview Predicting expansion If an equation of state is available, it can be used to predict the values of the thermal expan ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Metallurgical Furnace
A metallurgical furnace, more commonly referred to as a furnace, is a device used to heat and melt metal ore to remove gangue, primarily in Metal, iron and steel production. The heat energy to fuel a furnace may be supplied directly by fuel combustion, by electricity such as the electric arc furnace, or through induction heating in induction furnaces. There are several different types of furnaces used in metallurgy to work with specific metal and ores. Smelting furnaces Smelting furnaces are used in smelting to extract metal from ore. Smelting furnaces include: * The blast furnace, used to Redox, reduce iron ore to pig iron ** Cold blast ** Hot blast * Steelmaking furnaces, including: ** Puddling furnace ** Reverberatory furnace ** ** Open hearth furnace ** Basic oxygen furnace ** Electric arc furnace ** Electric induction furnace Other furnaces * Furnaces used to remelt metal in Foundry, foundries. * Furnaces used to reheat and Heat treatment, heat treat metal for use in: ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder
Solder (; NA: ) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Brazing
Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal. Brazing differs from welding in that it does not involve melting the work pieces. Brazing differs from soldering through the use of a higher temperature and much more closely fitted parts than when soldering. During the brazing process, the filler metal flows into the gap between close-fitting parts by capillary action. The filler metal is brought slightly above its melting ( liquidus) temperature while protected by a suitable atmosphere, usually a flux. It then flows over the base metal (in a process known as wetting) and is then cooled to join the work pieces together. A major advantage of brazing is the ability to join the same or different metals with considerable strength. Basics High-quality brazed joints require that parts be closely fitted with base m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
2.jpg "Click for more on -> Palladium")
