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LGA 3647
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"), Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors. The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place. Variants There are two sub-versions of this socket with differences also in the ILM (Independent Loading Mechanism, pitch of center screws changed slightly and a more visible one being that the guiding pins are in other corners). The processor socket and the matching notches on the processor are at different location, preventing insertion of an incompatible processor and preventing use of the wrong heatsink in a system. The more common P0 variant ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket LGA3647-P0 IMG 20210210 145812467 Smial Wp
Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexagonal ends of an Allen wrench will fit * Socket termination, a termination used at the ends of wire rope * Socket, the receptacle into which a tapered tool is inserted * Socket, an opening in any fitting that matches the outside diameter of a pipe or tube Biology * Eye socket, a region in the skull where the eyes are positioned * Tooth socket, a cavity containing a tooth, in those bones that bear teeth * Dry socket, an opening as a result of the blood not clotting after a tooth is pulled * Ball and socket joint Computing * Network socket, an end-point in a communication across a network or the Internet * Unix domain socket, an end-point in local inter-process communication * socket(), a system call defined by the Berkeley sockets API * CP ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 4189
LGA 4189 is an Intel microprocessor compatible socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ..., used by Cooper Lake and Ice Lake-SP microprocessors. Two incompatible versions exist: Socket P5 for Cedar Island platform and Cooper Lake, and Socket P4 for Whitley platform and Ice Lake-SP. References Intel CPU sockets {{Intelsock ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Omni-Path
Omni-Path Architecture (OPA) was a high-performance communication architecture owned by Intel. It aims for low communication latency, low power consumption and a high throughput. Intel planned to develop technology based on this architecture for exascale computing. History Production of Omni-Path products started in 2015 and delivery of these products started in the first quarter of 2016. In November 2015, adapters based on the 2-port "Wolf River" ASIC were announced, using QSFP28 connectors with channel speeds up to 100 Gbit/s. Simultaneously, switches based on the 48-port "Prairie River" ASIC were announced. First models of that series were available starting in 2015. In April 2016, implementation of the InfiniBand "verbs" interface for the Omni-Path fabric was discussed. In October 2016, IBM, Hewlett Packard Enterprise, Dell, Lenovo, Samsung, Seagate Technology, Micron Technology, Western Digital and SK Hynix announced a joint consortium called Gen-Z to develop an open spec ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel QuickPath Interconnect
The Intel QuickPath Interconnect (QPI) is a point-to-point microprocessor, processor electrical connection, interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon, Itanium, and certain desktop platforms starting in 2008. It increased the scalability and available bandwidth. Prior to the name's announcement, Intel referred to it as Common System Interface (CSI). Earlier incarnations were known as Yet Another Protocol (YAP) and YAP+. QPI 1.1 is a significantly revamped version introduced with Sandy Bridge-EP (Romley platform). QPI was replaced by Intel Ultra Path Interconnect (UPI) in Skylake (microarchitecture), Skylake-SP Xeon processors based on LGA 3647 socket. Background Although sometimes called a "bus", QPI is a point-to-point interconnect. It was designed to compete with HyperTransport that had been used by Advanced Micro Devices (AMD) since around 2003. Intel developed QPI at its Massachusetts Microprocessor Design Center (MMDC) by members of what ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3D XPoint
3D XPoint (pronounced ''three-D cross point'') is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and is available on the open market under the brand name Optane (Intel) from April 2017 until July 2022. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-grid data access array. Initial prices are less than dynamic random-access memory (DRAM) but more than flash memory. As a non-volatile memory, 3D XPoint has a number of features that distinguish it from other currently available RAM and NVRAM. Although the first generations of 3D XPoint were not especially large or fast, as of 2019 3D XPoint is used to create some of the fastest SSDs available, with small-write latency. As the memory is inherently fast, and byte-addressable, techniques such as read-modify-write and caching used to enhance traditional SSDs are not needed to obtain high performance. In add ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Socket
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and serv ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microprocessor
A microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit, or a small number of integrated circuits. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit. The integrated circuit is capable of interpreting and executing program instructions and performing arithmetic operations. The microprocessor is a multipurpose, clock-driven, register-based, digital integrated circuit that accepts binary data as input, processes it according to instructions stored in its memory, and provides results (also in binary form) as output. Microprocessors contain both combinational logic and sequential digital logic, and operate on numbers and symbols represented in the binary number system. The integration of a whole CPU onto a single or a few integrated circuits using Very-Large-Scale Integration (VLSI) greatly reduced the cost of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR4
Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high bandwidth ("double data rate") interface. Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), of which some have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies. DDR4 is not compatible with any earlier type of random-access memory (RAM) due to different signaling voltage and physical interface, besides other factors. DDR4 SDRAM was released to the public market in Q2 2014, focusing on ECC memory, while the non-ECC DDR4 modules became available in Q3 2014, accompanying the launch of Haswell-E processors that require DDR4 memory. Features The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs of up t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 2011
LGA 2011, also called ''Socket R'', is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 (Socket B) and LGA 1567. While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers. The socket has 2011 protruding pins that touch contact points on the underside of the processor. The LGA 2011 socket uses QPI to connect the CPU to additional CPUs. DMI 2.0 is used to connect the processor to the PCH. The memory controller and 40 PCI Express (PCIe) lanes are integrated on the CPU. On a secondary processor an extra ×4 PCIe interface replaces the DMI interface. As with its predecessor LGA 1366, there is no provisioning for integrated graphics. This socket supports four DDR3 or DDR4 SDRAM memory channels with up to three unbuffered or registered DIMMs per channel, as well as up to 40 PCI Express 2.0 or 3.0 lanes. LGA ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Cascade Lake (microarchitecture)
Cascade Lake is an Intel codename for a 14 nm server, workstation and enthusiast processor microarchitecture, launched in April 2019. In Intel's Process-Architecture-Optimization model, Cascade Lake is an optimization of Skylake. Intel states that this will be their first microarchitecture to support 3D XPoint-based memory modules. It also features Deep Learning Boost instructions and mitigations for Meltdown and Spectre. Intel officially launched new Xeon Scalable SKUs on February 24, 2020. Variants *Server: Cascade Lake-SP, Cascade Lake-AP *Workstation: Cascade Lake-W *Enthusiast: Cascade Lake-X List of Cascade Lake processors Cascade Lake-X (Enthusiast) Cascade Lake-AP (Advanced Performance) Cascade Lake-AP is branded as Xeon Platinum 9200 series and all SKUs are soldered to the motherboard. These CPUs will not work with Optane Memory. Xeon Platinum 9200 Series Cascade Lake-SP (Scalable) Xeon Platinum series Xeon Gold 6200 series Bolded denotes new SKUs r ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
