|
Joint Electron Device Engineering Council
The Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association is a consortium of the semiconductor industry headquartered in Arlington, United States. It has over 300 members and is focused on standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased operations in 2011. History The origin of JEDEC can be traced back to 1944, when the Radio M ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Arlington County, Virginia
Arlington County, or simply Arlington, is a County (United States), county in the U.S. state of Virginia. The county is located in Northern Virginia on the southwestern bank of the Potomac River directly across from Washington, D.C., the national capital. Arlington County is coextensive with the United States Census Bureau, U.S. Census Bureau's census-designated place of Arlington. Arlington County is the eighth-most populous county in the Washington metropolitan area with a population of 238,643 as of the 2020 United States census, 2020 census. If Arlington County were incorporated as a city, it would rank as the third-most populous city in the state. With a land area of , Arlington County is the geographically smallest Administrative divisions of Virginia, self-governing county in the nation. Arlington County is home to the Pentagon, the world's second-largest office structure, which houses the headquarters of the United States Department of Defense, U.S. Department of Defe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reasonable And Non-discriminatory Licensing
Reasonable and non-discriminatory (RAND) terms, also known as fair, reasonable, and non-discriminatory (FRAND) terms, denote a voluntary licensing commitment that standards organizations often request from the owner of an intellectual property right (usually a patent) that is, or may become, essential to practice a technical standard. Put differently, a F/RAND commitment is a voluntary agreement between the standard-setting organization and the holder of essential patent, standard-essential patents. U.S. courts, as well as courts in other jurisdictions, have found that, in appropriate circumstances, the implementer of a standard—that is, a firm or entity that uses a standard to render a service or manufacture a product—is an intended third-party beneficiary of the FRAND agreement, and, as such, is entitled to certain rights conferred by that agreement. A standard-setting organization is an industry group that sets common standards for its particular industry to ensure compati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-3
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. ''TO'' stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC. The TO-3 case has a flat surface which can be attached to a heatsink, normally via a thermally conductive but electrically insulating washer. The design originated at Motorola around 1955 from a group headed by Virgil E. Bottom, Dr. Virgil E. Bottom. who was director of research of the Motorola Semiconductor Division. The first use of this design was for the germanium alloy-junction transistor, alloy-junction power transistor 2N176 – the first power transistor to be put into quantity production. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. Typical applications The metal package can be attached to a heat sink, making it suitabl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR SDRAM
Double Data Rate Synchronous Dynamic Random-Access Memory (DDR SDRAM) is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work on DDR1-equipped motherboards, and vice versa. Compared to single data rate ( SDR) SDRAM, the DDR SDRAM interface makes higher transfer rates possible through more strict control of the timing of the electrical data and clock signals. Implementations often have to use schemes such as phase-locked loops and self-calibration to reach the required timing accuracy. The interface uses double pumping (transferring data on both the rising and falling edges of the clock signal) to double data bus bandwidth without a cor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Random Access Memory
Random-access memory (RAM; ) is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code. A random-access memory device allows data items to be read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks and magnetic tape), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement. In today's technology, random-access memory takes the form of integrated circuit (IC) chips with MOS (metal–oxide–semiconductor) memory cells. RAM is normally associated with volatile types of memory where stored information is lost if power is removed. The two main types of volatile random-access semiconductor memory are static ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JEDEC Memory Standards
The JEDEC memory standards are the specifications for semiconductor memory circuits and similar storage devices promulgated by the Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association, a semiconductor trade and engineering standardization organization. JEDEC Standard 100B.01 specifies common terms, units, and other definitions in use in the semiconductor industry. JESC21-C specifies semiconductor memories from the 256 bit static RAM to DDR4 SDRAM modules. JEDEC standardization goals The Joint Electron Device Engineering Council characterizes its standardization efforts as follows: JEDEC Standard 100B.01 The December 2002 JEDEC Standard 100B.01 is entitled ''Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits''. The purpose of the standard is to promote the uniform use of symbols, abbreviations, terms, and definitions throughout the semiconductor industry. Units of information T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mullard–Philips Tube Designation
In Europe, the principal method of numbering vacuum tubes ("thermionic valves") was the nomenclature used by the Philips company and its subsidiaries Mullard in the UK, Valvo( de, it) in Germany, Radiotechnique (''Miniwatt-Dario'' brand) in France, and Amperex in the United States, from 1934 on. Adhering manufacturers include AEG (de), CdL (1921, ''French Mazda'' brand), CIFTE (fr, ''Mazda-Belvu'' brand), EdiSwan (''British Mazda'' brand), Lorenz (de), MBLE( fr, nl) (be, ''Adzam'' brand), RCA (us), RFT( de, sv) (de), Siemens (de), Telefunken (de), Tesla (cz), Toshiba (ja), Tungsram (hu), and Unitra (pl; ''Dolam'', ''Polam'', ''Telam'' brands). This system allocated meaningful codes to tubes based on their function and became the starting point for the Pro Electron naming scheme for active devices (including tubes and transistors). Nomenclatur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pro Electron
Pro Electron or EECA is the European type designation and registration system for active devices (such as semiconductors, liquid crystal displays, sensor devices, electronic tubes and cathode-ray tubes). Pro Electron was set up in 1966 in Brussels, Belgium. In 1983 it was merged with the European Electronic Component Manufacturers Association (EECA) and since then operates as an agency of the EECA. The goal of Pro Electron is to allow unambiguous identification of electronic parts, even when made by several different manufacturers. To this end, manufacturers register new devices with the agency and receive new type designators for them. Designation system Examples of Pro Electron type designators are: * AD162 – Germanium power transistor for audio frequency use * BY133 – Silicon rectifier * BZY88C5V1 – Silicon 5.1 volt Zener diode * CQY97 – light emitting diode * ECC83 – 6.3 volt heater noval dual triode * A63EAA00XX01 – Color TV pic ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JIS Semiconductor Designation
Japanese Industrial Standards (JIS) has standard JIS-C-7012 for semiconductor part numbers. The first digit denotes the ''p-n junction count'' ("3" may also denote a dual-gate FET); then follows the letter "S", then: Then follows the ''Japan Electronics and Information Technology Industries Association's Electronic DEvice REgistration Center'' (JEITA-EDEREC)-assigned part number, optionally followed by suffixes (such as "A", "B", "C", or "R", "O", "BL", standing for "Red", "Orange", "Blue" etc.) to denote variants, such as tighter hFE (gain) groupings. Example: 2SD965, but sometimes the "2S" prefix is not marked on the package – a 2SD965 might only be marked "D965"; a 2SC1815 might be listed by a supplier as simply "C1815", thus possibly creating confusion with Pro Electron abbreviated markings, because a transistor marked "D965" might either be a 2SD965 or a BD965. References See also *JEDEC * Pro Electron *Mullard–Philips tube designation *RMA tube designation *RETMA tub ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a multiple-step Photolithography, photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer (electronics), wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the cen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
2N2222
The 2N2222 is a common NPN bipolar junction transistor (BJT) used for general purpose low-power amplifying or switching applications. It is designed for low to medium current, low power, medium voltage, and can operate at moderately high speeds. It was originally made in the TO-18 metal can as shown in the picture. The 2N2222 is considered a very common transistor, and is used as an exemplar of an NPN transistor. It is frequently used as a small-signal transistor, and it remains a small general purpose transistor of enduring popularity. The 2N2222 was part of a family of devices described by Motorola at a 1962 IRE convention. Since then it has been made by many semiconductor companies, for example, Texas Instruments.''The Transistor and Diode Data Book for Design Engineers'', Texas Instruments Incorporated, no date, TI publication number CC413 71242-73-CSS, page 4-93 Specifications The JEDEC registration of a device number ensures particular rated values will be met by a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
