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Electron Beam Prober
The electron beam prober (e-beam prober) is a specialized adaption of a standard scanning electron microscope (SEM) that is used for semiconductor failure analysis. While a conventional SEM may be operated in a voltage range of 10–30 keV, the e-beam Prober typically operates at 1 keV. The e-beam prober is capable of measuring voltage and timing waveforms on internal semiconductor signal structures. Waveforms may be measured on metal line, polysilicon and diffusion structures that have an electrically active, changing signal. The operation of the prober is similar to that of a sampling oscilloscope An oscilloscope (informally a scope) is a type of electronic test instrument that graphically displays varying electrical voltages as a two-dimensional plot of one or more signals as a function of time. The main purposes are to display repetiti .... A continuously looping, repeating test pattern must be applied to the device-under-test (DUT). E-beam probers are used primari ...
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Semiconductor
A semiconductor is a material which has an electrical resistivity and conductivity, electrical conductivity value falling between that of a electrical conductor, conductor, such as copper, and an insulator (electricity), insulator, such as glass. Its electrical resistivity and conductivity, resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities ("doping (semiconductor), doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common s ...
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Failure Analysis
Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability. According to Bloch and Geitner, ”machinery failures reveal a reaction chain of cause and effect… usually a deficiency commonly referred to as the symptom…”. failure analysis can save money, lives, and resources if done correctly and acted upon. It is an important discipline in many branches of manufacturing industry, such as the electronics industry, where it is a vital tool used in the development of new products and for the improvement of existing products. The failure analysis process relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods, especially microscopy and spectroscopy. Nondestructive testing (NDT) methods (such as industrial computed tomography scanning) are valuable because the failed products are unaffected by analysis, ...
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Oscilloscope
An oscilloscope (informally a scope) is a type of electronic test instrument that graphically displays varying electrical voltages as a two-dimensional plot of one or more signals as a function of time. The main purposes are to display repetitive or single waveforms on the screen that would otherwise occur too briefly to be perceived by the human eye. The displayed waveform can then be analyzed for properties such as amplitude, frequency, rise time, time interval, distortion, and others. Originally, calculation of these values required manually measuring the waveform against the scales built into the screen of the instrument. Modern digital instruments may calculate and display these properties directly. Oscilloscopes are used in the sciences, medicine, engineering, automotive and the telecommunications industry. General-purpose instruments are used for maintenance of electronic equipment and laboratory work. Special-purpose oscilloscopes may be used to analyze an automotive ign ...
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Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ...
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Electron Beam
Cathode rays or electron beam (e-beam) are streams of electrons observed in discharge tubes. If an evacuated glass tube is equipped with two electrodes and a voltage is applied, glass behind the positive electrode is observed to glow, due to electrons emitted from the cathode (the electrode connected to the negative terminal of the voltage supply). They were first observed in 1859 by German physicist Julius Plücker and Johann Wilhelm Hittorf, and were named in 1876 by Eugen Goldstein ''Kathodenstrahlen'', or cathode rays. In 1897, British physicist J. J. Thomson showed that cathode rays were composed of a previously unknown negatively charged particle, which was later named the ''electron''. Cathode-ray tubes (CRTs) use a focused beam of electrons deflected by electric or magnetic fields to render an image on a screen. Description Cathode rays are so named because they are emitted by the negative electrode, or cathode, in a vacuum tube. To release electrons into the tube, th ...
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Reliability Engineering
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability describes the ability of a system or component to function under stated conditions for a specified period of time. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time. The reliability function is theoretically defined as the probability of success at time t, which is denoted R(t). This probability is estimated from detailed (physics of failure) analysis, previous data sets or through reliability testing and reliability modelling. Availability, testability, maintainability and maintenance, repair and operations, maintenance are often defined as a part of "reliability engineering" in reliability programs. Reliability often plays the key role in the cost-effectiveness of systems. Reliability engineering deals with the p ...
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