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DUT Board
DUT boards are used in automated integrated circuit testing where the term DUT stands for device under test, referring to the circuit being tested. A DUT board is a printed circuit board, and is the interface between the integrated circuit and a test head, which in turn attaches to automatic test equipment (ATE). DUT boards are designed to meet both the mechanical and electrical requirements of the particular chip and the specific test equipment to be used. One type of DUT board is used in testing the individual die (or dice) of a silicon wafer before they are cut free and packaged, and another type is used for testing packaged IC's. Synonyms DUT boards are occasionally known as ''DIBs'' (Device Interface Boards), ''probecards'', or ''PIBs'' (Probecard Interface Boards). See also * Probe Card A probe card is an interface between an electronic test system and a semiconductor wafer. Typically the probe card is mechanically docked to a prober and electrically connec ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DUT Board 1
DUT is an acronym for * Da Nang University of Technology in Da Nang, Vietnam * Dalian University of Technology in Dalian, China * Delft University of Technology in Delft, the Netherlands * Device under test, especially in electronics, associated with semiconductor testing * Diplôme universitaire de technologie, a French undergraduate university degree in technology * Durban University of Technology in Durban, South Africa * DUT (gene), which encodes DUTP pyrophosphatase * Drinking-up time, a former feature of United Kingdom alcohol licensing law * DUT1 or DUT, which describes the difference between coordinated universal time (UTC) and universal time (UT) * Unalaska Airport (IATA airport code "DUT"), an airport in Unalaska, Alaska, U.S. * D.Ut., an abbreviation used for the United States District Court for the District of Utah The United States District Court for the District of Utah (in case citations, D. Utah) is the federal district court whose jurisdiction is the state of Ut ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
160pin-DUT-PCB
Sixteen or 16 may refer to: *16 (number), the natural number following 15 and preceding 17 *one of the years 16 BC, AD 16, 1916, 2016 Films * ''Pathinaaru'' or ''Sixteen'', a 2010 Tamil film * ''Sixteen'' (1943 film), a 1943 Argentine film directed by Carlos Hugo Christensen * ''Sixteen'' (2013 Indian film), a 2013 Hindi film * ''Sixteen'' (2013 British film), a 2013 British film by director Rob Brown Music *The Sixteen, an English choir *16 (band), a sludge metal band *Sixteen (Polish band), a Polish band Albums * ''16'' (Robin album), a 2014 album by Robin * 16 (Madhouse album), a 1987 album by Madhouse * ''Sixteen'' (album), a 1983 album by Stacy Lattisaw *''Sixteen'' , a 2005 album by Shook Ones * ''16'', a 2020 album by Wejdene Songs * "16" (Sneaky Sound System song), 2009 * "Sixteen" (Thomas Rhett song), 2017 * "Sixteen" (Ellie Goulding song), 2019 *"16", by Craig David from ''Following My Intuition'', 2016 *"16", by Green Day from ''39/Smooth'', 1990 *"16", by High ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Device Under Test
A device under test (DUT), also known as equipment under test (EUT) and unit under test (UUT), is a manufactured product undergoing testing, either at first manufacture or later during its life cycle as part of ongoing functional testing and calibration checks. This can include a test after repair to establish that the product is performing in accordance with the original product specification. Electronics testing In the electronics industry a DUT is any electronic assembly under test. For example, cell phones coming off of an assembly line may be given a final test in the same way as the individual chips were earlier tested. Each cell phone under test is, briefly, the DUT. For circuit boards, the DUT is often connected to the test equipment using a bed of nails tester of pogo pins. Semiconductor testing In semiconductor testing, the device under test is a die on a wafer or the resulting packaged part. A connection system is used, connecting the part to automatic or manual test ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Automatic Test Equipment
Automatic test equipment or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the device under test (DUT), equipment under test (EUT) or unit under test (UUT), using automation to quickly perform measurements and evaluate the test results. An ATE can be a simple computer-controlled digital multimeter, or a complicated system containing dozens of complex test instruments (real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on wafer testing, including system on chips and integrated circuits. Where it is used ATE is widely used in the electronic manufacturing industry to test electronic components and systems after being fabricated. ATE is also used to test avionics and the electronic modules in automobiles. It is used in military applications like radar and wireless communication. In the semiconductor industry Semiconductor ATE, named for testing se ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic table: carbon is above it; and germanium, tin, lead, and flerovium are below it. It is relatively unreactive. Because of its high chemical affinity for oxygen, it was not until 1823 that Jöns Jakob Berzelius was first able to prepare it and characterize it in pure form. Its oxides form a family of anions known as silicates. Its melting and boiling points of 1414 °C and 3265 °C, respectively, are the second highest among all the metalloids and nonmetals, being surpassed only by boron. Silicon is the eighth most common element in the universe by mass, but very rarely occurs as the pure element in the Earth's crust. It is widely distributed in space in cosmic dusts, planetoids, and planets as various forms of silicon dioxide ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor-die Cutting
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing. Wafer mounting Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ensures that the individual dies remain firmly in place during 'dicing', as the process of cutting the wafer is called. The picture on the right shows a 300 mm wafer after it was mounted and diced. The blue plastic is the adhesive tape. The wafer is the round disc in the middle. In this case, a large number of dies were already removed. Semiconductor-die cutting In the manufacturing of micro-electr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IC Packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip sign ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Probe Card
A probe card is an interface between an electronic test system and a semiconductor wafer. Typically the probe card is mechanically docked to a prober and electrically connected to a tester. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a printed circuit board (PCB) and some form of contact elements, usually metallic, but possibly of other materials as well. A semiconductor manufacturer will typically require a new probe card for each new device wafer and for device shrinks (when the manufacturer reduces the size of the device while keeping its functionality) because the probe card is effectively a custom connector that takes the universal pattern of a given tester and translates the signals to connect to electrical pads on the wafer. For testing of DRAM and FLASH memory dev ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Fabrication Equipment
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabrica ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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