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Apple M2
The Apple M2 is an ARM-based system on a chip (SoC) designed by Apple Inc. as a central processing unit (CPU) and graphics processing unit (GPU) for its Mac notebooks and the iPad Pro tablet. It is the second generation of ARM architecture intended for Apple's Mac computers after switching from Intel Core to Apple silicon, succeeding the M1. Apple announced the M2 on June 6, 2022, at WWDC, along with models of the MacBook Air and the 13-inch MacBook Pro using the M2. It was released on June 24, 2022. The M2 is made with TSMC's "Enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the M1. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the M1. Design CPU The M2 has four high-performance "Avalanche" and four energy-efficient "Blizzard" cores, first seen in the A15 Bionic, providing a hybrid configuration similar to ARM DynamIQ, as well as Intel's Alder Lake and Raptor Lake processors. Th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
5 Nm Process
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the 5 nm process as the MOSFET technology node following the 7 nm node. In 2020, Samsung and TSMC entered volume production of 5 nm chips, manufactured for companies including Apple, Marvell, Huawei and Qualcomm. The term "5 nanometer" has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by IEEE Standards Association Industry Connection, a 5 nm node is expected to have a contacted gate pitch of 51 nanometers and a tightest metal pitch of 30 nanometers. However, in real world commercial practice, "5 nm" is used primarily as a marketing term by individual microchip manufacturers to refer to a new, improved generation of silicon semiconductor chips in terms of increased transistor density (i.e. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
WWDC
The Worldwide Developers Conference (WWDC) is an information technology conference held annually by Apple Inc. The conference is usually held at Apple Park in California. The event is usually used to showcase new software and technologies in the macOS, iOS, iPadOS, watchOS, and tvOS families as well as other Apple software. WWDC is also an event hosted for third-party software developers that work on apps for iPhones, iPads, Macs, and other Apple devices. Attendees can participate in hands-on labs with Apple engineers and attend in-depth sessions covering a wide variety of topics. The first ever WWDC was held in 1983 with the introduction of Apple Basic, but it was not until 2002 that Apple started using the conference as a major launchpad for new products. Beginning in 1987, WWDC was held in Santa Clara. After 15 years in nearby San Jose, the conference moved to San Francisco, where it eventually became Apple's primary media event of the year and regularly sold out. WWDC retur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System In A Package
A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die. SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Glossary Of Computer Graphics
This is a glossary of terms relating to computer graphics. For more general computer hardware terms, see glossary of computer hardware terms. 0–9 A B C D E F G H I K L M N O P Q R S T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LPDDR
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power and is targeted for mobile computers and devices such as mobile phones. Older variants are also known as Mobile DDR, and abbreviated as mDDR. Modern LPDDR SDRAM is distinct from DDR SDRAM, with various differences that make the technology more appropriate for the mobile application. LPDDR technology standards are developed independently of DDR standards, with LPDDR4X and even LPDDR5 for example being implemented prior to DDR5 SDRAM and offering far higher data rates than DDR4 SDRAM. Bus width In contrast with standard SDRAM, used in stationary devices and laptops and usually connected over a 64-bit wide memory bus, LPDDR also permits 16- or 32-bit wide channels. The "E" versions mark enhanced versions of the specifications. They formalize overclocking the memory array up to 266 MHz for a 33% performance boost. Memory modules impleme ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Transfer (computing)
In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that occur in each second in some given data-transfer channel. It is also known as sample rate, i.e. the number of data samples captured per second, each sample normally occurring at the clock edge. The terms are neutral with respect to the method of physically accomplishing each such data-transfer operation; nevertheless, they are most commonly used in the context of transmission of digital data. 1 MT/s is 106 or one million transfers per second; similarly, 1 GT/s means 109, or equivalently in the US/short scale, one billion transfers per second. Units The choice of the symbol ''T'' for ''transfer'' conflicts with the International System of Units, in which ''T'' stands for the tesla unit of magnetic flux density (so "Megatesla ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TFLOPS
In computing, floating point operations per second (FLOPS, flops or flop/s) is a measure of computer performance, useful in fields of scientific computations that require floating-point calculations. For such cases, it is a more accurate measure than measuring instructions per second. Floating-point arithmetic Floating-point arithmetic is needed for very large or very small real numbers, or computations that require a large dynamic range. Floating-point representation is similar to scientific notation, except everything is carried out in base two, rather than base ten. The encoding scheme stores the sign, the exponent (in base two for Cray and VAX, base two or ten for IEEE floating point formats, and base 16 for IBM Floating Point Architecture) and the significand (number after the radix point). While several similar formats are in use, the most common is ANSI/IEEE Std. 754-1985. This standard defines the format for 32-bit numbers called ''single precision'', as well as 64-b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Arithmetic Logic Unit
In computing, an arithmetic logic unit (ALU) is a Combinational logic, combinational digital circuit that performs arithmetic and bitwise operations on integer binary numbers. This is in contrast to a floating-point unit (FPU), which operates on floating point numbers. It is a fundamental building block of many types of computing circuits, including the central processing unit (CPU) of computers, FPUs, and graphics processing units (GPUs). The inputs to an ALU are the data to be operated on, called operands, and a code indicating the operation to be performed; the ALU's output is the result of the performed operation. In many designs, the ALU also has status inputs or outputs, or both, which convey information about a previous operation or the current operation, respectively, between the ALU and external status registers. Signals An ALU has a variety of input and output net (electronics), nets, which are the electrical conductors used to convey Digital signal (electronics), digi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Execution Unit
In computer engineering, an execution unit (E-unit or EU) is a part of the central processing unit (CPU) that performs the operations and calculations as instructed by the computer program. It may have its own internal control sequence unit (not to be confused with the CPU's main control unit), some registers, and other internal units such as an arithmetic logic unit (ALU), address generation unit (AGU), floating-point unit (FPU), load-store unit (LSU), branch execution unit (BEU) or some smaller and more specific components. archived on the |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit (MMU) w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Raptor Lake (microprocessor)
Raptor Lake is Intel's codename for the 13th-generation of Intel Core processors based on a hybrid architecture, utilizing Raptor Cove performance cores and Gracemont efficient cores. Raptor Lake launched on October 20, 2022. Mobile versions are expected to be released by the end of the year. Like Alder Lake, Raptor Lake is fabricated using Intel's Intel 7 process. At Intel's Investor Meeting 2022, it was confirmed that Raptor Lake would feature up to 24 cores (8 performance cores plus 16 efficient cores) and 32 threads and is socket compatible with Alder Lake systems (LGA 1700). The company spokesman revealed that Raptor Lake was conjured in the last-minute, to benefit from all the process improvements before Meteor Lake arrives since the next microarchitecture was not ready on time. Raptor Lake competes with the AMD Ryzen 7000 series that was launched about one month earlier on September 27, 2022. Features CPU * Cores ** Raptor Cove performance cores (P-core) ** U ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Alder Lake (microprocessor)
Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021. Intel officially announced 12th Gen Intel Core mobile CPUs and non-K series desktop CPUs on January 4, 2022. Intel officially announced the launch of Alder Lake-P and -U series on February 23, 2022, and Alder Lake-HX series on May 10, 2022. History Fabricated using Intel's Intel 7 process, which was previously referred to as Intel 10 nm Enhanced SuperFin (10ESF), Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021. Intel then officially announced 12th Gen Intel Core mobile CPUs and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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