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5 Nm Process
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the "5 nm" process as the MOSFET technology node following the 7 nm process, "7 nm" node. In 2020, Samsung Electronics, Samsung and TSMC entered volume production of "5 nm" chips, manufactured for companies including Apple Inc., Apple, Huawei, Mediatek, Qualcomm and Marvell Technology Group, Marvell. The term "5 nm" does not indicate that any physical feature (such as gate length, metal pitch or gate pitch) of the transistors is five nanometers in size. Historically, the number used in the name of a technology node represented the gate length, but it started deviating from the actual length to smaller numbers (by Intel) around 2011. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by IEEE Standards Association Industry Connection, the 5 nm node is expected to have a gate length of 18 nm, a contact ...
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Semiconductor Manufacturing
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a multiple-step Photolithography, photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer (electronics), wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the cen ...
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Meikei Ieong
Meikei Ieong from the TSMC Europe B.V, Amsterdam, Netherlands was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2015 for ''leadership in development of advanced complementary metal-oxide-semiconductor upright=1.3, Two power MOSFETs in amperes">A in the ''on'' state, dissipating up to about 100 watt">W and controlling a load of over 2000 W. A matchstick is pictured for scale. In electronics, the metal–oxide–semiconductor field- ... device technologies''. References Fellows of the IEEE Living people Year of birth missing (living people) Place of birth missing (living people) {{netherlands-engineer-stub ...
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Huawei Mate 40
Huawei Mate 40, Huawei Mate 40 Pro, Huawei Mate 40 Pro Plus and Huawei Mate 40 RS Porsche Design is a high-end Android and HarmonyOS based phablets developed by Huawei for its Mate series, succeeding the Huawei Mate 30 range. They were released on October 22, 2020, at Huawei's Online Global Launch Event. Design The Mate 40 and Mate 40 Pro are constructed with an anodized aluminum frame and Gorilla Glass or artificial leather backing. The Mate 40 Pro+ uses ceramic for both the frame and the back. The notch on the Mate 30 series has been replaced by a cutout in the upper left hand corner. The Mate 40 has a circular cutout for the front-facing camera; the Mate 40 Pro and Mate 40 Pro+ have a larger pill-shaped cutout also accommodating the infrared facial recognition system. On the Mate 40 Pro and Mate 40 Pro+, the screen is dramatically curved like the Mate 30 Pro, but has physical volume buttons. Unlike the P40 series, the Mate 40 series uses a traditional earpiece speaker ...
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IPhone 12
The iPhone 12 and iPhone 12 Mini (stylized and marketed as iPhone 12 mini) are smartphones developed and marketed by Apple Inc. They are the fourteenth-generation iPhones, succeeding the iPhone 11. They were unveiled at a virtually held Apple Special Event at Apple Park in Cupertino, California, on October 13, 2020, alongside the "premium flagship" iPhone 12 Pro and iPhone 12 Pro Max and HomePod Mini. Pre-orders for the iPhone 12 started on October 16, 2020, and the phone was released in most countries on October 23, 2020, alongside the iPhone 12 Pro and fourth-generation iPad Air. Pre-orders for the iPhone 12 Mini began on November 6, 2020, and the phone was released on November 13, 2020, alongside the iPhone 12 Pro Max. The major upgrades over the iPhone 11 include the addition of a Super Retina XDR OLED as opposed to the Liquid Retina LED-backlit LCD IPS panel on the iPhone 11 and XR, 5G support, the introduction of MagSafe, Apple A14 Bionic system on a chip (S ...
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ExtremeTech
ExtremeTech is a technology weblog, launched in June 2001, which focuses on hardware, computer software, science, and other technologies. Between 2003 and 2005, ExtremeTech was also a print magazine and the publisher of a popular series of how-to and do-it-yourself books. Background ExtremeTech was launched as a website in June 2001, with co-founder Bill Machrone as Editor-in-Chief, and fellow co-founder Nick Stam as Senior Technical Director. Loyd Case, Dave Salvator, Mark Hachman, and Jim Lynch were other original core ET staff. In 2002 Jim Louderback became the Editor-in-Chief. When initially launched, ExtremeTech covered a broad range of technical topics with very in-depth technical stories. Topic areas included core PC techniques (CPUs/GPUs), networking, operating systems, software development, display technology, printers, scanners, etc. By 2003, Ziff Davis management wanted to reduce expenses and cut back content to core PC tech areas, focusing on how to build and opt ...
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Apple A14
The Apple A14 Bionic is a 64-bit computing, 64-bit ARMv8.4-A system on a chip, system on a chip (SoC) designed by Apple Inc., part of the Apple silicon series. It appears in the iPad Air (4th generation) and iPad (10th generation), as well as iPhone 12, iPhone 12 Mini, iPhone 12, iPhone 12 Pro, and iPhone 12 Pro, iPhone 12 Pro Max. Apple states that the Central processing unit, central processing unit (CPU) performs up to 40% faster than the Apple A12, A12, while the Graphics processing unit, graphics processing unit (GPU) is up to 30% faster than the A12. It also includes a 16-core neural engine and new machine learning matrix accelerators that perform twice and ten times as fast, respectively. Design The Apple A14 Bionic features an Apple-designed 64-bit, six-core CPU, implementing ARMv8 with two high-performance cores called Firestorm and four energy-efficient cores called Icestorm. The A14 integrates an Apple-designed four-core GPU with 30% faster graphics performance than ...
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LinkedIn
LinkedIn () is an American business and employment-oriented Social networking service, social network. It was launched on May 5, 2003 by Reid Hoffman and Eric Ly. Since December 2016, LinkedIn has been a wholly owned subsidiary of Microsoft. The platform is primarily used for professional networking and career development, and allows jobseekers to post their Curriculum vitae, CVs and employers to post jobs. From 2015, most of the company's revenue came from Information broker, selling access to information about its members to recruiters and sales professionals and has also introduced their own ad portal named LinkedIn Ads to let companies advertise in their platform. LinkedIn has more than 1 billion registered members from over 200 countries and territories. LinkedIn allows members (both employees and employers) to create profiles and connect with each other in an online social network which may represent real-world professional relationships. Members can invite anyone (whet ...
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Extreme Ultraviolet Lithography
Extreme ultraviolet lithography (EUVL, also known simply as EUV) is a technology used in the semiconductor industry for manufacturing integrated circuits (ICs). It is a type of photolithography that uses 13.5 nm extreme ultraviolet (EUV) light from a laser-pulsed tin (Sn) plasma to create intricate patterns on semiconductor substrates. , ASML Holding is the only company that produces and sells EUV systems for chip production, targeting 5 nanometer (nm) and 3 nm process nodes. The EUV wavelengths that are used in EUVL are near 13.5 nanometers (nm), using a laser-pulsed tin (Sn) droplet plasma to produce a pattern by using a reflective photomask to expose a substrate covered by photoresist. Tin ions in the ionic states from Sn IX to Sn XIV give photon emission spectral peaks around 13.5 nm from 4p64d''n'' – 4p54d''n''+1 + 4d''n''−14f ionic state transitions. History and economic impact In the 1960s, visible light was used for the production of integ ...
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FinFET
A fin field-effect transistor (FinFET) is a multigate device, a MOSFET (metal–oxide–semiconductor field-effect transistor) built on a substrate where the gate is placed on two, three, or four sides of the channel or wrapped around the channel (gate all around), forming a double or even multi gate structure. These devices have been given the generic name "FinFETs" because the source/drain region forms fins on the silicon surface. The FinFET devices exhibit significantly faster switching times and higher current density than planar CMOS (complementary metal–oxide–semiconductor) technology, resulting in enhanced performance and power efficienc FinFET is a type of non-planar transistor, or "3D" transistor. It is the basis for modern nanoelectronic semiconductor device fabrication. Microchips utilizing FinFET gates first became commercialized in the first half of the 2010s, and became the dominant gate design at 14 nm, 10 nm and 7 nm process nodes. It is common for a ...
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Gate-all-around
A multigate device, multi-gate MOSFET or multi-gate field-effect transistor (MuGFET) refers to a metal–oxide–semiconductor field-effect transistor (MOSFET) that has more than one gate on a single transistor. The multiple gates may be controlled by a single gate electrode, wherein the multiple gate surfaces act electrically as a single gate, or by independent gate electrodes. A multigate device employing independent gate electrodes is sometimes called a multiple-independent-gate field-effect transistor (MIGFET). The most widely used multi-gate devices are the FinFET (fin field-effect transistor) and the GAAFET (gate-all-around field-effect transistor), which are non-planar transistors, or 3D transistors. Multi-gate transistors are one of the several strategies being developed by MOS semiconductor manufacturers to create ever-smaller microprocessors and memory cells, colloquially referred to as extending Moore's law (in its narrow, specific version concerning density sca ...
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Silicon
Silicon is a chemical element; it has symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic lustre, and is a tetravalent metalloid (sometimes considered a non-metal) and semiconductor. It is a member of group 14 in the periodic table: carbon is above it; and germanium, tin, lead, and flerovium are below it. It is relatively unreactive. Silicon is a significant element that is essential for several physiological and metabolic processes in plants. Silicon is widely regarded as the predominant semiconductor material due to its versatile applications in various electrical devices such as transistors, solar cells, integrated circuits, and others. These may be due to its significant band gap, expansive optical transmission range, extensive absorption spectrum, surface roughening, and effective anti-reflection coating. Because of its high chemical affinity for oxygen, it was not until 1823 that Jöns Jakob Berzelius was first able to p ...
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Interconnects (integrated Circuits)
In integrated circuits (ICs), interconnects are structures that connect two or more circuit elements (such as transistors) together electrically. The design and layout of interconnects on an IC is vital to its proper function, performance, power efficiency, reliability, and fabrication yield. The material interconnects are made from depends on many factors. Chemical and mechanical compatibility with the semiconductor substrate and the dielectric between the levels of interconnect is necessary, otherwise barrier layers are needed. Suitability for fabrication is also required; some chemistries and processes prevent the integration of materials and unit processes into a larger technology (recipe) for IC fabrication. In fabrication, interconnects are formed during the back-end-of-line after the fabrication of the transistors on the substrate. Interconnects are classified as ''local'' or ''global'' interconnects depending on the signal propagation distance it is able to support. The wi ...
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