Apple A14 Bionic
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Apple A14 Bionic
The Apple A14 Bionic is a 64-bit ARMv8.5-A system on a chip (SoC), designed by Apple Inc. It appears in the fourth generation iPad Air and tenth generation iPad, as well as iPhone 12 Mini, iPhone 12, iPhone 12 Pro, and iPhone 12 Pro Max. Apple states that the central processing unit (CPU) performs up to 40% faster than the A12, while the graphics processing unit (GPU) is up to 30% faster than the A12. It also includes a 16-core neural engine and new machine learning matrix accelerators that perform twice and ten times as fast, respectively. Design The Apple A14 Bionic features an Apple-designed 64-bit, six-core CPU, implementing ARMv8 with two high-performance cores called Firestorm and four energy-efficient cores called Icestorm. The A14 integrates an Apple-designed four-core GPU with 30% faster graphics performance than the A12. The A14 includes dedicated neural network hardware that Apple calls a new 16-core Neural Engine. The Neural Engine can perform 11 trillion o ...
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5 Nanometer
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the 5  nm process as the MOSFET technology node following the 7 nm node. In 2020, Samsung and TSMC entered volume production of 5 nm chips, manufactured for companies including Apple, Marvell, Huawei and Qualcomm. The term "5 nanometer" has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by IEEE Standards Association Industry Connection, a 5 nm node is expected to have a contacted gate pitch of 51 nanometers and a tightest metal pitch of 30 nanometers. However, in real world commercial practice, "5 nm" is used primarily as a marketing term by individual microchip manufacturers to refer to a new, improved generation of silicon semiconductor chips in terms of increased transistor density (i.e. a ...
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Apple A12
The Apple A12 Bionic is a 64-bit computing, 64-bit ARM architecture, ARM-based system on a chip (SoC) designed by Apple Inc. It first appeared in the iPhone XS, iPhone XS and XS Max, iPhone XR, iPad Air (3rd generation), iPad Mini (5th generation), iPad (8th generation), 8th generation iPad and Apple TV, Apple TV 4K (2nd generation). Apple states that the two high-performance cores are 15% faster and 50% more energy-efficient than the Apple A11's, and the four high-efficiency cores use 50% less power than the A11's. It is the first mass-market system on a chip to be built using the 7 nm process. Design The Apple A12 SoC features an Apple-designed 64-bit ARMv8.3-A six-core CPU, with two high-performance cores called Vortex, running at 2.49 GHz, and four energy-efficient cores called Tempest. The Vortex cores are a 7-wide decode Out-of-order execution, out-of-order Superscalar processor, superscalar design, while the Tempest cores are a 3-wide decode out-of-order supersca ...
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Advanced Video Coding
Advanced Video Coding (AVC), also referred to as H.264 or MPEG-4 Part 10, is a video compression standard based on block-oriented, motion-compensated coding. It is by far the most commonly used format for the recording, compression, and distribution of video content, used by 91% of video industry developers . It supports resolutions up to and including 8K UHD. The intent of the H.264/AVC project was to create a standard capable of providing good video quality at substantially lower bit rates than previous standards (i.e., half or less the bit rate of MPEG-2, H.263, or MPEG-4 Part 2), without increasing the complexity of design so much that it would be impractical or excessively expensive to implement. This was achieved with features such as a reduced-complexity integer discrete cosine transform (integer DCT), variable block-size segmentation, and multi-picture inter-picture prediction. An additional goal was to provide enough flexibility to allow the standard to be applied ...
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High Efficiency Video Coding
High Efficiency Video Coding (HEVC), also known as H.265 and MPEG-H Part 2, is a video compression standard designed as part of the MPEG-H project as a successor to the widely used Advanced Video Coding (AVC, H.264, or MPEG-4 Part 10). In comparison to AVC, HEVC offers from 25% to 50% better data compression at the same level of video quality, or substantially improved video quality at the same bit rate. It supports resolutions up to 8192×4320, including 8K UHD, and unlike the primarily 8-bit AVC, HEVC's higher fidelity Main 10 profile has been incorporated into nearly all supporting hardware. While AVC uses the integer discrete cosine transform (DCT) with 4×4 and 8×8 block sizes, HEVC uses integer DCT and DST transforms with varied block sizes between 4×4 and 32×32. The High Efficiency Image Format (HEIF) is based on HEVC. , HEVC is used by 43% of video developers, and is the second most widely used video coding format after AVC. Concept In most ways, HEVC is an extensi ...
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Mobile DDR
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power and is targeted for mobile computers and devices such as mobile phones. Older variants are also known as Mobile DDR, and abbreviated as mDDR. Modern LPDDR SDRAM is distinct from DDR SDRAM, with various differences that make the technology more appropriate for the mobile application. LPDDR technology standards are developed independently of DDR standards, with LPDDR4X and even LPDDR5 for example being implemented prior to DDR5 SDRAM and offering far higher data rates than DDR4 SDRAM. Bus width In contrast with standard SDRAM, used in stationary devices and laptops and usually connected over a 64-bit wide memory bus, LPDDR also permits 16- or 32-bit wide channels. The "E" versions mark enhanced versions of the specifications. They formalize overclocking the memory array up to 266 MHz for a 33% performance boost. Memory modules implem ...
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Package On Package
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations. Configuration Two widely used configurations exist for PoP: * Pure memory stacking: two or more memory only packages are stacked on each other * Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard. During PCB assembly, the bottom package of a Po ...
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Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ...
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5 Nm Process
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the 5  nm process as the MOSFET technology node following the 7 nm node. In 2020, Samsung and TSMC entered volume production of 5 nm chips, manufactured for companies including Apple, Marvell, Huawei and Qualcomm. The term "5 nanometer" has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by IEEE Standards Association Industry Connection, a 5 nm node is expected to have a contacted gate pitch of 51 nanometers and a tightest metal pitch of 30 nanometers. However, in real world commercial practice, "5 nm" is used primarily as a marketing term by individual microchip manufacturers to refer to a new, improved generation of silicon semiconductor chips in terms of increased transistor density (i.e. ...
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Image Processor
An image processor, also known as an image processing engine, image processing unit (IPU), or image signal processor (ISP), is a type of media processor or specialized digital signal processor (DSP) used for image processing, in digital cameras or other devices. Image processors often employ parallel computing even with SIMD or MIMD technologies to increase speed and efficiency. The digital image processing engine can perform a range of tasks. To increase the system integration on embedded devices, often it is a system on a chip with multi-core processor architecture. Function Bayer transformation The photodiodes employed in an image sensor are color-blind by nature: they can only record shades of grey. To get color into the picture, they are covered with different color filters: red, green and blue (RGB) according to the pattern designated by the Bayer filter - named after its inventor. As each photodiode records the color information for exactly one pixel of the image, withou ...
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IMore
The Apple community is a group of people interested in Apple Inc. and its products, who report information in various media. Generally this has evolved into a proliferation of websites, but latterly has also expanded into podcasts (both audio and video), either speculating on rumors about future product releases, simply report Apple-related news stories, or have discussions about Apple's products and how to use them. Such stories and discussions may include topics related to physical products like the Macintosh and iOS devices (e.g., the iPhone, iPod, and iPad); software and operating systems, like Final Cut Pro, Logic Pro X, iWork, iOS, and macOS; or even services Apple offers like iCloud, iTunes Store, or Apple Music. Apple enjoys a cult-like following for its platforms, especially following the massive increase in popularity for the brand brought about by the huge increase in sales for all its products that started around the time the company introduced the original iPod in ...
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AI Accelerator
An AI accelerator is a class of specialized hardware accelerator or computer system designed to accelerate artificial intelligence and machine learning applications, including artificial neural networks and machine vision. Typical applications include algorithms for robotics, internet of things, and other data-intensive or sensor-driven tasks. They are often manycore designs and generally focus on low-precision arithmetic, novel dataflow architectures or in-memory computing capability. , a typical AI integrated circuit chip contains billions of MOSFET transistors. A number of vendor-specific terms exist for devices in this category, and it is an emerging technology without a dominant design. History Computer systems have frequently complemented the CPU with special-purpose accelerators for specialized tasks, known as coprocessors. Notable application-specific hardware units include video cards for graphics, sound cards, graphics processing units and digital signal processor ...
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