ATtiny Microcontroller Comparison Chart
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ATtiny Microcontroller Comparison Chart
ATtiny (also known as TinyAVR) is a subfamily of the popular 8-bit AVR microcontrollers, which typically has fewer features, fewer I/O pins, and less memory than other AVR series chips. The first members of this family were released in 1999 by Atmel (later acquired by Microchip Technology in 2016). Features ATtiny microcontrollers specifically excludes various common features, such as: USB peripheral, DMA controller, crypto engine, or an external memory bus. The following table summarizes common features of the ATtiny microcontrollers, for easy comparison. This table is not meant to be an unabridged feature list. ;Notes :* Package column - the number after the dash is the number of pins on the package. DIP packages in this table are row-to-row. SOwww means SOIC package with a case width of 'www' in thousandth of an inch. Though some package types are known by more than one name, a common name was chosen to make it easier to compare packages. :* UART/I²C/SPI columns - ...
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ATtiny2313
ATtiny (also known as TinyAVR) is a subfamily of the popular 8-bit AVR microcontrollers, which typically has fewer features, fewer I/O pins, and less memory than other AVR series chips. The first members of this family were released in 1999 by Atmel (later acquired by Microchip Technology in 2016). Features ATtiny microcontrollers specifically excludes various common features, such as: USB peripheral, DMA controller, crypto engine, or an external memory bus. The following table summarizes common features of the ATtiny microcontrollers, for easy comparison. This table is not meant to be an unabridged feature list. ;Notes :* Package column - the number after the dash is the number of pins on the package. DIP packages in this table are row-to-row. SOwww means SOIC package with a case width of 'www' in thousandth of an inch. Though some package types are known by more than one name, a common name was chosen to make it easier to compare packages. :* UART/I²C/SPI columns - ...
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Quad Flat No-leads Package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ''surfaces'' of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). Flat no-lead cross-section The figure shows the cross section of a flat no-lead package with a lead frame and wire bonding. ...
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Arduino
Arduino () is an open-source hardware and software company, project, and user community that designs and manufactures single-board microcontrollers and microcontroller kits for building digital devices. Its hardware products are licensed under a CC BY-SA license, while software is licensed under the GNU Lesser General Public License (LGPL) or the GNU General Public License (GPL), permitting the manufacture of Arduino boards and software distribution by anyone. Arduino boards are available commercially from the official website or through authorized distributors. Arduino board designs use a variety of microprocessors and controllers. The boards are equipped with sets of digital and analog input/output (I/O) pins that may be interfaced to various expansion boards ('shields') or breadboards (for prototyping) and other circuits. The boards feature serial communications interfaces, including Universal Serial Bus (USB) on some models, which are also used for loading programs. The ...
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Atmel AVR Instruction Set
The Atmel AVR instruction set is the machine language for the Atmel AVR, a modified Harvard architecture 8-bit RISC single chip microcontroller which was developed by Atmel in 1996. The AVR was one of the first microcontroller families to use on-chip flash memory for program storage. Processor registers There are 32 general-purpose 8-bit registers, R0–R31. All arithmetic and logic operations operate on those registers; only load and store instructions access RAM. A limited number of instructions operate on 16-bit register pairs. The lower-numbered register of the pair holds the least significant bits and must be even-numbered. The last three register pairs are used as pointer registers for memory addressing. They are known as X (R27:R26), Y (R29:R28) and Z (R31:R30). Postincrement and predecrement addressing modes are supported on all three. Y and Z also support a six-bit positive displacement. Instructions which allow an immediate value are limited to registers R16–R31 ...
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UART
A universal asynchronous receiver-transmitter (UART ) is a computer hardware device for asynchronous serial communication in which the data format and transmission speeds are configurable. It sends data bits one by one, from the least significant to the most significant, framed by start and stop bits so that precise timing is handled by the communication channel. The electric signaling levels are handled by a driver circuit external to the UART. Two common signal levels are RS-232, a 12-volt system, and RS-485, a 5-volt system. Early teletypewriters used current loops. It was one of the earliest computer communication devices, used to attach teletypewriters for an operator console. It was also an early hardware system for the Internet. A UART is usually an individual (or part of an) integrated circuit (IC) used for serial communications over a computer or peripheral device serial port. One or more UART peripherals are commonly integrated in microcontroller chips. Specialised UA ...
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DebugWIRE
debugWIRE is a serial communications protocol, designed by Atmel. It is used for on-chip debugging of AVR microcontrollers. Protocol debugWIRE is designed as a simpler alternative to JTAG, aimed at microcontrollers (MCUs) with limited resources. It is supported by the classic ATtiny and some smaller ATmega MCUs, such as the ATmega328. By using debugWIRE one has full read and write access to all memory and full control over the execution flow. It supports single-step, run-to-cursor, step-out, and software break instructions. A breakpoint (run-to-cursor) will be set by reprogramming the ''BREAK'' opcode into the flash memory of the MCU. Care must be taken due to the limited number of guaranteed write cycles (10000) of the device. Programmer models debugWIRE is supported by all modern hardware debuggers from Microchip. This includes Atmel-ICE, JTAGICE3, AVR Dragon, JTAGICE mkII, and SNAP. It is also possible to build a cheap debugWIRE hardware debugger based on an open-source Ard ...
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In-system Programming
In-system programming (ISP), or also called in-circuit serial programming (ICSP), is the ability of some programmable logic devices, microcontrollers, and other embedded devices to be programmed while installed in a complete system, rather than requiring the chip to be programmed prior to installing it into the system. It also allows firmware updates to be delivered to the on-chip memory of microcontrollers and related processors without requiring specialist programming circuitry on the circuit board, and simplifies design work. There is no standard for in-system programming protocols for programming microcontroller devices. Almost all manufacturers of microcontrollers support this feature, but all have implemented their own protocols, which often differ even for different devices from the same manufacturer. In general, modern protocols try to keep the number of pins used low, typically to 2 pins. Some ISP interfaces manage to achieve the same with just a single pin, others us ...
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RS-485
RS-485, also known as TIA-485(-A) or EIA-485, is a standard defining the electrical characteristics of drivers and receivers for use in serial communications systems. Electrical signaling is balanced, and multipoint systems are supported. The standard is jointly published by the Telecommunications Industry Association and Electronic Industries Alliance (TIA/EIA). Digital communications networks implementing the standard can be used effectively over long distances and in electrically noisy environments. Multiple receivers may be connected to such a network in a linear, multidrop bus. These characteristics make RS-485 useful in industrial control systems and similar applications. Overview RS-485 supports inexpensive local networks and multidrop communications links, using the same differential signaling over twisted pair as RS-422. It is generally accepted that RS-485 can be used with data rates up to 10 Mbit/s or, at lower speeds, distances up to . As a rule of thumb, the ...
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IrDA
The Infrared Data Association (IrDA) is an industry-driven interest group that was founded in 1994 by around 50 companies. IrDA provides specifications for a complete set of protocols for wireless infrared communications, and the name "IrDA" also refers to that set of protocols. The main reason for using the IrDA protocols had been wireless data transfer over the "last one meter" using point-and-shoot principles. Thus, it has been implemented in portable devices such as mobile telephones, laptops, cameras, printers, and medical devices. The main characteristics of this kind of wireless optical communication are physically secure data transfer, line-of-sight (LOS) and very low bit error rate (BER) that makes it very efficient. Specifications IrPHY The mandatory IrPHY (Infrared Physical Layer Specification) is the physical layer of the IrDA specifications. It comprises optical link definitions, modulation, coding, cyclic redundancy check (CRC) and the framer. Different data r ...
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Lin Bus
LIN (Local Interconnect Network) is a serial network protocol used for communication between components in vehicles. It is a single wire, serial network protocol that supports communications up to 19.2 Kbit/s at a bus length of 40 meters. The need for a cheap serial network arose as the technologies and the facilities implemented in the car grew, while the CAN bus was too expensive to implement for every component in the car. European car manufacturers started using different serial communication technologies, which led to compatibility problems. In the late 1990s, the LIN Consortium was founded by five automakers ( BMW, Volkswagen Group, Audi, Volvo Cars, Mercedes-Benz), with the technologies supplied (networking and hardware expertise) from Volcano Automotive Group and Motorola. The first fully implemented version of the new LIN specification (LIN version 1.3) was published in November 2002. In September 2003, version 2.0 was introduced to expand capabilities and make provision ...
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Thousandth Of An Inch
A thousandth of an inch is a derived unit of length in a system of units using inches. Equal to of an inch, a thousandth is commonly called a thou (used for both singular and plural) or particularly in North America a mil (plural mils). The words are shortened forms of the English and Latin words for "thousand" ( in Latin). In international engineering contexts, confusion can arise because ''mil'' is a formal unit name in North America but ''mil'' or ''mill'' is also a common colloquial clipped form of millimetre. The units are considerably different: a millimetre is approximately 39 mils. Contexts of use The thou, or mil, is most commonly used in engineering and manufacturing in non-metric countries. For example, in specifying: * The thickness of items such as paper, film, foil, wires, paint coatings, latex gloves, plastic sheeting, and fibers ** For example, most plastic ID cards are about in thickness. ** Card stock thickness in the United States, where mils are also ...
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Chip-scale Package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for ''chip-size packaging.'' Since only a few packages are chip size, the meaning of the acronym was adapted to ''chip-scale packaging''. According to IPC's standard J-STD-012, ''Implementation of Flip Chip and Chip Scale Technology'', in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or pr ...
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