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Three-dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MOSFET
upright=1.3, Two power MOSFETs in amperes">A in the ''on'' state, dissipating up to about 100 watt">W and controlling a load of over 2000 W. A matchstick is pictured for scale. In electronics, the metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, MOS FET, or MOS transistor) is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. The term ''metal–insulator–semiconductor field-effect transistor'' (''MISFET'') is almost synonymous with ''MOSFET''. Another near-synonym is ''insulated-gate field-effect transistor'' (''IGFET''). The main advantage of a MOSFET is that it requires almost no input current to control the load current under steady-state or low-frequency conditions ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Interposer
An interposer is an electrical interface routing between one socket or connection and another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. An interposer can be made of either silicon or organic (printed circuit board-like) material. Interposer comes from the Latin word , meaning "to put between".interposes - definition of interposes by the Free Online Dictionary, Thesaurus and Encyclopedia They are often used in [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
High Bandwidth Memory
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers (such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX). The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015. HBM was adopted by JEDEC as an industry standard in October 2013.High Bandwidth Memory (HBM) DRAM (JESD235) JEDEC, October 2013 The second generation, HBM2, was accepted by JEDEC in January 2016. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Memory Cube
Hybrid Memory Cube (HMC) is a high-performance computer random-access memory (RAM) interface for through-silicon via (TSV)-based stacked DRAM memory. HMC competes with the incompatible rival interface High Bandwidth Memory (HBM). Overview Hybrid Memory Cube was co-developed by Samsung Electronics and Micron Technology in 2011, and announced by Micron in September 2011.Micron Reinvents DRAM Memory Linley Group, Jag Bolaria, 12 September 2011 It promised a 15 times speed improvement over . The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including |
DDR4
Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high bandwidth ("double data rate") interface. Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), some of which have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies. DDR4 is not compatible with any earlier type of random-access memory (RAM) due to different signaling voltage and physical interface, besides other factors. DDR4 SDRAM was released to the public market in Q2 2014, focusing on ECC memory, while the non-ECC DDR4 modules became available in Q3 2014, accompanying the launch of Haswell-E processors that require DDR4 memory. Features The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs of up t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SDRAM
Synchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal. DRAM integrated circuits (ICs) produced from the early 1970s to the early 1990s used an ''asynchronous'' interface, in which input control signals have a direct effect on internal functions delayed only by the trip across its semiconductor pathways. SDRAM has a ''synchronous'' interface, whereby changes on control inputs are recognised after a rising edge of its clock input. In SDRAM families standardized by JEDEC, the clock signal controls the stepping of an internal finite-state machine that responds to incoming commands. These commands can be pipelined to improve performance, with previously started operations completing while new commands are received. The memory is divided into several equally sized but independent sections called ''banks'', allowing the device to operate on a memor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dynamic Random-access Memory
Dynamics (from Greek language, Greek δυναμικός ''dynamikos'' "powerful", from δύναμις ''dynamis'' "power (other), power") or dynamic may refer to: Physics and engineering * Dynamics (mechanics), the study of forces and their effect on motion Brands and enterprises * Dynamic (record label), an Italian record label in Genoa Mathematics * Dynamical system, a concept describing a point's time dependency ** Topological dynamics, the study of dynamical systems from the viewpoint of general topology * Symbolic dynamics, a method to model dynamical systems Social science * Group dynamics, the study of social group processes especially * Population dynamics, in life sciences, the changes in the composition of a population * Psychodynamics, the study of psychological forces driving human behavior * Social dynamics, the ability of a society to react to changes * Spiral Dynamics, a social development theory Other uses * Dynamics (music), the softness or loudn ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JEDEC
The Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association is a consortium of the semiconductor industry headquartered in Arlington County, Virginia, Arlington, United States. It has over 300 members and is focused on standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the RoHS, lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when Radio Manufacturers Association, RMA (subsequently renamed Electronic Industries Alliance , EIA) and National Electrical Manufacturers Association, NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type list of vacuum tubes, numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of Electronic Industries Association, EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Central Processing Unit
A central processing unit (CPU), also called a central processor, main processor, or just processor, is the primary Processor (computing), processor in a given computer. Its electronic circuitry executes Instruction (computing), instructions of a computer program, such as arithmetic, logic, controlling, and input/output (I/O) operations. This role contrasts with that of external components, such as main memory and I/O circuitry, and specialized coprocessors such as graphics processing units (GPUs). The form, CPU design, design, and implementation of CPUs have changed over time, but their fundamental operation remains almost unchanged. Principal components of a CPU include the arithmetic–logic unit (ALU) that performs arithmetic operation, arithmetic and Bitwise operation, logic operations, processor registers that supply operands to the ALU and store the results of ALU operations, and a control unit that orchestrates the #Fetch, fetching (from memory), #Decode, decoding and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Memory
Semiconductor memory is a digital electronic semiconductor device used for digital data storage, such as computer memory. It typically refers to devices in which data is stored within metal–oxide–semiconductor (MOS) memory cells on a silicon integrated circuit memory chip. There are numerous different types using different semiconductor technologies. The two main types of random-access memory (RAM) are static RAM (SRAM), which uses several transistors per memory cell, and dynamic RAM (DRAM), which uses a transistor and a MOS capacitor per cell. Non-volatile memory (such as EPROM, EEPROM and flash memory) uses floating-gate memory cells, which consist of a single floating-gate transistor per cell. Most types of semiconductor memory have the property of random access, which means that it takes the same amount of time to access any memory location, so data can be efficiently accessed in any random order. This contrasts with data storage media such as CDs which re ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3DS Die Stacking Concept Model
The is a foldable dual-screen handheld game console produced by Nintendo. Announced in March 2010 as the successor to the Nintendo DS, the console was released originally on February 26, 2011 and went through various revisions in its lifetime, produced until 2020. The system features backward compatibility with the Nintendo DS's library of video games. As an eighth-generation console, its primary competitor was Sony's PlayStation Vita. The most prominent feature of the 3DS is its ability to display stereoscopic 3D images without the use of 3D glasses or additional accessories. Other features of the 3DS include its StreetPass and SpotPass tag modes that were powered by Nintendo Network, augmented reality capabilities using its 3D camera system, and Virtual Console, which provides a method for users to download and play video games originally released for older video game systems. The Nintendo 3DS was released in Japan on February 26, 2011, and worldwide beginning the nex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mobile Devices
A mobile device or handheld device is a computer small enough to hold and operate in hand. Mobile devices are typically battery-powered and possess a flat-panel display and one or more built-in input devices, such as a touchscreen or keypad. Modern mobile devices often emphasize wireless networking, to both the Internet and to other devices in their vicinity, such as headsets or in-car entertainment systems, via Wi-Fi, Bluetooth, cellular networks, or near-field communication. Characteristics Device mobility can be viewed in the context of several qualities: * Physical dimensions and weight * Whether the device is mobile or some kind of host to which it is attached is mobile * What kind of host devices it can be bound with * How devices communicate with a host * When mobility occurs Strictly speaking, many so-called mobile devices are not mobile. It is the host that is mobile, i.e., a mobile human host carries a non-mobile smartphone device. An example of a true mobile computing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
