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Through-silicon Via
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (Via (electronics), via) that passes completely through a silicon wafer or die (integrated circuit), die. TSVs are high-performance interconnect techniques used as an alternative to wire bond, wire-bond and flip chips to create 3D packages and Three-dimensional integrated circuit, 3D integrated circuits. Compared to alternatives such as Package on package, package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter. Classification Dictated by the manufacturing process, there exist three different types of TSVs: ''via-first TSVs'' are fabricated before the individual component (transistors, capacitors, resistors, etc.) are patterned (front end of line, FEOL), ''via-middle TSVs'' are fabricated after the individual component are patterned but before the metal layers (Back end of line, back-end-of-li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
High Bandwidth Memory Schematic
High may refer to: Science and technology * Height * High (atmospheric), a high-pressure area * High (computability), a quality of a Turing degree, in computability theory * High (tectonics), in geology an area where relative tectonic uplift took or takes place * Substance intoxication, also known by the slang description "being high" * Sugar high, a misconception about the supposed psychological effects of sucrose Music Performers * High (musical group), a 1974–1990 Indian rock group * The High, an English rock band formed in 1989 Albums * High (The Blue Nile album), ''High'' (The Blue Nile album) or the title song, 2004 * High (Flotsam and Jetsam album), ''High'' (Flotsam and Jetsam album), 1997 * High (New Model Army album), ''High'' (New Model Army album) or the title song, 2007 * High (Royal Headache album), ''High'' (Royal Headache album) or the title song, 2015 * High (Keith Urban album), ''High'' (Keith Urban album), 2024 * High (EP), ''High'' (EP), by Jarryd James, o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Interposer
An interposer is an electrical interface routing between one socket or connection and another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. An interposer can be made of either silicon or organic (printed circuit board-like) material. Interposer comes from the Latin word , meaning "to put between".interposes - definition of interposes by the Free Online Dictionary, Thesaurus and Encyclopedia They are often used in [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DRAM
Dram, DRAM, or drams may refer to: Technology and engineering * Dram (unit), a unit of mass and volume, and an informal name for a small amount of liquor, especially whisky or whiskey * Dynamic random-access memory, a type of electronic semiconductor memory * Dram, Welsh term for a minecart, a small railway cargo truck used in a mine railway Currency and geography * Dram, Armenian for "money" ** Armenian dram, a monetary unit ** Artsakh dram (formerly ''Nagorno-Karabakh dram''), a monetary unit * Dram, the Tibetan name for the town of Zhangmu on the Nepal-Tibet border * Historic English name for Drammen, Norway Music * DRAM (musician) (Shelley Marshaun Massenburg-Smith, born 1988), American rapper and actor * Database of Recorded American Music, an online resource * The Drams, an American band made up of members of Slobberbone See also * Dram shop, a bar, tavern or similar commercial establishment where alcoholic beverages are sold * Dirham The dirham, dirhem or drah ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dynamic Random-access Memory
Dynamics (from Greek language, Greek δυναμικός ''dynamikos'' "powerful", from δύναμις ''dynamis'' "power (other), power") or dynamic may refer to: Physics and engineering * Dynamics (mechanics), the study of forces and their effect on motion Brands and enterprises * Dynamic (record label), an Italian record label in Genoa Mathematics * Dynamical system, a concept describing a point's time dependency ** Topological dynamics, the study of dynamical systems from the viewpoint of general topology * Symbolic dynamics, a method to model dynamical systems Social science * Group dynamics, the study of social group processes especially * Population dynamics, in life sciences, the changes in the composition of a population * Psychodynamics, the study of psychological forces driving human behavior * Social dynamics, the ability of a society to react to changes * Spiral Dynamics, a social development theory Other uses * Dynamics (music), the softness or loudn ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CMOS
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss ", , ) is a type of MOSFET, metal–oxide–semiconductor field-effect transistor (MOSFET) semiconductor device fabrication, fabrication process that uses complementary and symmetrical pairs of p-type semiconductor, p-type and n-type semiconductor, n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including Nonvolatile BIOS memory, CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data conversion, data converters, RF circuits (RF CMOS), and highly integrated transceivers for many types of communication. In 1948, Bardeen and Brattain patented an insulated-gate transistor (IGFET) with an inversion layer. Bardeen's concept forms the basis of CMOS technology today. The CMOS process was presented by Fairchild Semico ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Three Dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integration; and 3D systems integration; a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-Chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or Lead (electronics), "pins") where multiple integrated circuits (ICs or "chips"), semiconductor Die (integrated circuit), dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System In Package
A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when Integrated circuit design, designing components for mobile phone, mobile phones, Portable media player, digital music players, etc. die (integrated circuit), Dies containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine wires that are bonded to the package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like system on a c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Back-illuminated Sensor
Comparison of simplified back-illuminated and front-illuminated pixel cross-sections A back-illuminated (BI) sensor, also known as back-side illumination (BSI) sensor, is a type of digital image sensor that uses a novel arrangement of the imaging elements to increase the amount of light captured and thereby improve low-light performance. The technique was used for some time in specialized roles like low-light security cameras and astronomy sensors, but was complex to build and required further refinement to become widely used. Sony was the first to reduce these problems and their costs sufficiently to introduce a 5-megapixel 1.75 μm BI CMOS sensor at general consumer prices in 2009.''Sony'', 2009 BI sensors from OmniVision Technologies have since been used in consumer electronics from other manufacturers as in the HTC EVO 4G Android smartphone, and as a major selling point for the camera in Apple's iPhone 4.''Apple'', 2010 Description A traditional, front-illuminated di ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Image Sensor
An image sensor or imager is a sensor that detects and conveys information used to form an image. It does so by converting the variable attenuation of light waves (as they refraction, pass through or reflection (physics), reflect off objects) into signal (electrical engineering), signals, small bursts of electric current, current that convey the information. The waves can be light or other electromagnetic radiation. Image sensors are used in electronics, electronic imaging devices of both analogue electronics, analog and digital electronics, digital types, which include digital cameras, camera modules, camera phones, optical mouse devices, medical imaging equipment, night vision equipment such as thermography, thermal imaging devices, radar, sonar, and others. As technological change, technology changes, electronic and digital imaging tends to replace chemical and analog imaging. The two main types of electronic image sensors are the charge-coupled device (CCD) and the active-pixel s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CMOS Image Sensor
An active-pixel sensor (APS) is an image sensor, which was invented by Peter J.W. Noble in 1968, where each pixel sensor unit cell has a photodetector (typically a pinned photodiode) and one or more active transistors. In a metal–oxide–semiconductor (MOS) active-pixel sensor, MOS field-effect transistors (MOSFETs) are used as amplifiers. There are different types of APS, including the early NMOS APS and the now much more common complementary MOS (CMOS) APS, also known as the CMOS sensor. CMOS sensors are used in digital camera technologies such as cell phone cameras, web cameras, most modern digital pocket cameras, most digital single-lens reflex cameras (DSLRs), mirrorless interchangeable-lens cameras (MILCs), and lensless imaging for, e.g., blood cells. CMOS sensors emerged as an alternative to charge-coupled device (CCD) image sensors and eventually outsold them by the mid-2000s. The term ''active pixel sensor'' is also used to refer to the individual pixel sensor itsel ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
