|
Solder Ball
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. Ball grid array, chip-scale package, and flip chip packages generally use solder balls. Underfill After the solder balls are used to attach an integrated circuit chip to a printed circuit board (PCB), often the remaining air gap between them is underfilled with epoxy. In some cases, there may be multiple layers of so ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder Ball Grid
Solder (; North American English, NA: ) is a fusible alloy, fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
High Bandwidth Memory Schematic
High may refer to: Science and technology * Height * High (atmospheric), a high-pressure area * High (computability), a quality of a Turing degree, in computability theory * High (tectonics), in geology an area where relative tectonic uplift took or takes place * Substance intoxication, also known by the slang description "being high" * Sugar high, a misconception about the supposed psychological effects of sucrose Music Performers * High (musical group), a 1974–1990 Indian rock group * The High, an English rock band formed in 1989 Albums * High (The Blue Nile album), ''High'' (The Blue Nile album) or the title song, 2004 * High (Flotsam and Jetsam album), ''High'' (Flotsam and Jetsam album), 1997 * High (New Model Army album), ''High'' (New Model Army album) or the title song, 2007 * High (Royal Headache album), ''High'' (Royal Headache album) or the title song, 2015 * High (Keith Urban album), ''High'' (Keith Urban album), 2024 * High (EP), ''High'' (EP), by Jarryd James, o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
Integrated circuit packaging is the final stage of fabrication (semiconductor), semiconductor device fabrication, in which the die (integrated circuit), die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "semiconductor package, package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance. Both the structure and materials must prioritize sign ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder
Solder (; North American English, NA: ) is a fusible alloy, fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Package
Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multichip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed ci ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PC Magazine
''PC Magazine'' (shortened as ''PCMag'') is an American computer magazine published by Ziff Davis. A print edition was published from 1982 to January 2009. Publication of online editions started in late 1994 and continues . Overview ''PC Magazine'' provides reviews and previews of the latest hardware and software for the information technology professional. Other regular departments include columns by long-time editor-in-chief Michael J. Miller ("Forward Thinking"), Bill Machrone, and Jim Louderback, as well as: * "First Looks" (a collection of reviews of newly released products) * "Pipeline" (a collection of short articles and snippets on computer-industry developments) * "Solutions" (which includes various how-to articles) * "User-to-User" (a section in which the magazine's experts answer user-submitted questions) * "After Hours" (a section about various computer entertainment products; the designation "After Hours" is a legacy of the magazine's traditional orientation to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Prior Art
Prior art (also known as state of the art or background art) is a concept in patent law used to determine the patentability of an invention, in particular whether an invention meets the novelty and the inventive step or non-obviousness criteria for patentability. In most systems of patent law, prior art is generally defined as anything that is made available, or disclosed, to the public that might be relevant to a patent's claim before the effective filing date of a patent application for an invention. However, notable differences exist in how prior art is specifically defined under different national, regional, and international patent systems. The prior art is evaluated by patent offices as part of the patent granting process in what is called "substantive examination" of a patent application in order to determine whether an invention claimed in the patent application meets the novelty and inventive step or non-obviousness criteria for patentability. It may also be considered ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip-scale Package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for ''chip-size packaging.'' Since only a few packages are chip size, the meaning of the acronym was adapted to ''chip-scale packaging''. According to IPC (electronics), IPC's standard J-STD-012, ''Implementation of Flip Chip and Chip Scale Technology'', in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die (integrated circuit), die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconne ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
