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Memory Module
In computing, a memory module or RAM stick is a printed circuit board on which Computer memory, memory integrated circuits are mounted. Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and Server (computing), servers. The first memory modules were proprietary designs that were specific to a model of computer from a specific manufacturer. Later, memory modules were standardized by organizations such as JEDEC and could be used in any system designed to use them. Distinguishing characteristics of computer memory modules include voltage, capacity, speed (i.e., bit rate), and computer form factor, form factor. Overview Types of memory module include: * TransFlash Memory Module * SIMM, a single in-line memory module * DIMM, dual in-line memory module ** Rambus memory modules are a subset of DIMMs, but are normally referred to as RIMMs ** SO-DIMM, small outline DIMM, a smaller version of the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DIMMs
A DIMM (Dual In-line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM integrated circuit, chips and Pin (electronics), pins. The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and capacities, and are generally one of two lengths: PC, which are , and laptop (SO-DIMM), which are about half the length at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5 (microarchitecture), P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus (computing), bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were introduced to eliminate this disadvantage. The contacts on SIMMs on b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CAMM (memory Module)
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and DIMM#SO-DIMM, SO-DIMMs which use edge connectors and had been in use for about 25 years. The first SO-DIMMs were introduced by JEDEC in 1997. CAMM was created to overcome technical limitations of traditional edge connector, slotted DIMM. The CAMM module allows for shorter traces on the motherboard PCB as compared to SO-DIMM, allowing the memory to be run with less power and at higher speeds. The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard. Advantages of CAMM include lower thickness, allows for replaceable LPDDR modules, faster speeds above 6400MT/s, higher capacities up to 128GB per module and higher memory bandwidth. Disadvantages are that it cannot be mounted without tools and uses screws. Systems with CAMM memory already ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL) is an Semiconductor package, electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole technology, through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild Semiconductor, Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually refer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Industry Standard Architecture
Industry Standard Architecture (ISA) is the 16-bit internal bus (computing), bus of IBM PC/AT and similar computers based on the Intel 80286 and its immediate successors during the 1980s. The bus was (largely) backward compatible with the 8-bit bus of the 8088-based IBM PC, including the IBM PC/XT as well as IBM PC compatibles. Originally referred to as the PC bus (8-bit) or AT bus (16-bit), it was also termed ''I/O Channel'' by IBM. The ISA term was coined as a retronym by IBM PC clone manufacturers in the late 1980s or early 1990s as a reaction to IBM attempts to replace the AT bus with its new and incompatible Micro Channel architecture. The 16-bit ISA bus was also used with 32-bit processors for several years. An attempt to extend it to 32 bits, called Extended Industry Standard Architecture (EISA), was not very successful, however. Later buses such as VESA Local Bus and Peripheral Component Interconnect, PCI were used instead, often along with ISA slots on the same mainbo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Motherboard
A motherboard, also called a mainboard, a system board, a logic board, and informally a mobo (see #Nomenclature, "Nomenclature" section), is the main printed circuit board (PCB) in general-purpose computers and other expandable systems. It holds and allows communication between many of the crucial electronic components of a system, such as the central processing unit (CPU) and computer memory, memory, and provides connectors for other peripherals. Unlike a backplane, a motherboard usually contains significant sub-systems, such as the CPU, the chipset's input/output and Memory controller, memory controllers, interface (computing), interface connectors, and other components integrated for general use. Nomenclature ''Oxford English Dictionary'' traces the origin of the word ''motherboard'' to 1965, its earliest-found attestation occurring in the magazine ''Electronics (magazine), Electronics''. The term alludes to its importance and size compared to the components attached to i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Adhesive
Adhesive, also known as glue, cement, mucilage, or paste, is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation. The use of adhesives offers certain advantages over other binding techniques such as sewing, mechanical fastenings, and welding. These include the ability to bind different materials together, the more efficient distribution of stress across a joint, the cost-effectiveness of an easily mechanized process, and greater flexibility in design. Disadvantages of adhesive use include decreased stability at high temperatures, relative weakness in bonding large objects with a small bonding surface area, and greater difficulty in separating objects during testing. Adhesives are typically organized by the method of adhesion followed by ''reactive'' or ''non-reactive'', a term which refers to whether the adhesive chemically reacts in order to harden. Alternatively, they can be organized either ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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Sixteen or 16 may refer to: *16 (number) *one of the years 16 BC, AD 16, 1916, 2016 Films * ''Pathinaaru'' or ''Sixteen'', a 2010 Tamil film * ''Sixteen'' (1943 film), a 1943 Argentine film directed by Carlos Hugo Christensen * ''Sixteen'' (2013 Indian film), a 2013 Hindi film * ''Sixteen'' (2013 British film), a 2013 British film by director Rob Brown Music *The Sixteen, an English choir *16 (band), a sludge metal band * Sixteen (Polish band), a Polish band Albums * ''16'' (Robin album), a 2014 album by Robin * 16 (Madhouse album), a 1987 album by Madhouse * ''Sixteen'' (album), a 1983 album by Stacy Lattisaw *''Sixteen'' , a 2005 album by Shook Ones * ''16'', a 2020 album by Wejdene Songs * "16" (Sneaky Sound System song), 2009 * "Sixteen" (Thomas Rhett song), 2017 * "Sixteen" (Ellie Goulding song), 2019 *"Six7een", by Hori7on, 2023 *"16", by Craig David from ''Following My Intuition'', 2016 *"16", by Green Day from ''39/Smooth'', 1990 *"16", by Highly Suspect from ''MCID ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
RAM N
Ram, ram, or RAM most commonly refers to: * A male sheep * Random-access memory, computer memory * Ram Trucks, US, since 2009 ** List of vehicles named Dodge Ram, trucks and vans ** Ram Pickup, produced by Ram Trucks Ram, ram, or RAM may also refer to: Animals * Ram cichlid, a freshwater tropical fish People * Ram (given name) * Ram (surname) * Ram (director) (Ramsubramaniam), an Indian Tamil film director * RAM (DJ), Dutch trance producer and DJ * Ram Dass (Richard Alpert), American spiritual teacher and author Religion * Rama (or Râm), an incarnation of the god Vishnu in Hinduism * Ram and Rud, progenitors of the second generation of humans in Mandaeism Places * Roum, Jezzine, village in Lebanon * Ram, Serbia, Veliko Gradište * Ram Island (other), several islands with the name * Ram Fortress, Serbia * Ram Range, a mountain range in the Canadian Rockies * Ram River, in Alberta, Canada * Lake Ram, Golan Heights, Syria * Mizo Ram, a state in northeastern India ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Epoxy
Epoxy is the family of basic components or Curing (chemistry), cured end products of epoxy Resin, resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called ''epoxy''. The IUPAC name for an epoxide group is an oxirane. Epoxy resins may be reacted (cross-linked) either with themselves through catalytic homopolymerisation, or with a wide range of co-reactants including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols and thiols (sometimes called mercaptans). These co-reactants are often referred to as hardeners or curatives, and the cross-linking reaction is commonly referred to as Curing (chemistry), curing. Reaction of polyepoxides with themselves or with polyfunctional hardeners forms a thermosetting polymer, often with favorable mechanical properties and high thermal and chemical resistance. Epoxy has a wide range of application ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
Integrated circuit packaging is the final stage of fabrication (semiconductor), semiconductor device fabrication, in which the die (integrated circuit), die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "semiconductor package, package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance. Both the structure and materials must prioritize sign ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Three-dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
