InterChip USB (IC-USB), sometimes referred to as USB-IC or Inter-chip USB, is an addendum to the USB Implementers Forum (USB-IF) USB 2.0 specification. IC-USB is intended as a low-power variant of the standard physical USB interface, intended for direct chip-to-chip communications. The IC-USB bus's maximum length of 10 cm results in a lower

inductance Inductance is the tendency of an electrical conductor to oppose a change in the electric current flowing through it. The flow of electric current creates a magnetic field around the conductor. The field strength depends on the magnitude of th ...

and

capacitance Capacitance is the capability of a material object or device to store electric charge. It is measured by the change in charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized are ...

and therefore allows lower power requirements. IC-USB is used primarily in

embedded system An embedded system is a computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is ''embedded ...

s; for example,

ETSI The European Telecommunications Standards Institute (ETSI) is an independent, not-for-profit, standardization organization in the field of information and communications. ETSI supports the development and testing of global technical standard ...

(in specification TS 102 600) has standardized on IC-USB as the official high-speed interface for connections between the main chipset of a

smartphone A smartphone is a portable computer device that combines mobile telephone and computing functions into one unit. They are distinguished from feature phones by their stronger hardware capabilities and extensive mobile operating systems, whi ...

and the

SIM card A typical SIM card (mini-SIM with micro-SIM cutout) A GSM mobile phone file:Simkarte NFC SecureElement.jpg, T-Mobile nano-SIM card with NFC capabilities in the SIM tray of an iPhone 6s file:Tf sim both sides.png, A TracFone Wireless SIM card ha ...

or UICC card. High-Speed Inter-Chip (HSIC) is a chip-to-chip variant of USB 2.0 that eliminates the conventional analog transceivers found in normal USB. It was adopted as a standard by the USB-IF in 2007. The HSIC

physical layer In the seven-layer OSI model of computer networking, the physical layer or layer 1 is the first and lowest layer; The layer most closely associated with the physical connection between devices. This layer may be implemented by a PHY chip. The ...

uses about 50% less power and 75% less

board Board or Boards may refer to: Flat surface * Lumber, or other rigid material, milled or sawn flat ** Plank (wood) ** Cutting board ** Sounding board, of a musical instrument * Cardboard (paper product) * Paperboard * Fiberboard ** Hardboard, a t ...

area compared to traditional USB 2.0. HSIC uses two signals at 1.2 V and has a throughput of 480 Mbit/s. Maximum PCB trace length for HSIC is 10 cm. It does not have low enough latency to support

RAM Ram, ram, or RAM may refer to: Animals * A male sheep * Ram cichlid, a freshwater tropical fish People * Ram (given name) * Ram (surname) * Ram (director) (Ramsubramaniam), an Indian Tamil film director * RAM (musician) (born 1974), Dutch * ...

sharing between two chips. SuperSpeed Inter-Chip (SSIC) is the USB 3.0 successor of HSIC. The USB-IF Inter-Chip USB Supplement was released in March 2006. ETSI TS 102 600, which is ETSI's USB implementation requirements specification, was first released in December 2007.

References

{{reflist USB Computer buses Motherboard