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InterChip USB
InterChip USB (IC-USB), sometimes referred to as USB-IC or Inter-chip USB, is an addendum to the USB Implementers Forum (USB-IF) USB 2.0 specification. IC-USB is intended as a low-power variant of the standard physical USB interface, intended for direct chip-to-chip communications. The IC-USB bus's maximum length of 10 cm results in a lower inductance and capacitance and therefore allows lower power requirements. IC-USB is used primarily in embedded systems; for example, ETSI (in specification TS 102 600) has standardized on IC-USB as the official high-speed interface for connections between the main chipset of a smartphone and the SIM card or UICC card. High-Speed Inter-Chip (HSIC) is a chip-to-chip variant of USB 2.0 that eliminates the conventional analog transceivers found in normal USB. It was adopted as a standard by the USB-IF in 2007. The HSIC physical layer uses about 50% less power and 75% less board area compared to traditional USB 2.0. HSIC uses two ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
USB Implementers Forum
The USB Implementers Forum (USB-IF) is a nonprofit organization created to promote and support USB (Universal Serial Bus). Its main activities are the promotion and marketing of USB, Wireless USB, USB On-The-Go, and the maintenance of the specifications, as well as a compliance program. The USB-IF was founded in 1995 by the group of companies that was developing USB, which was released in 1996. The founding companies of USB-IF were Compaq, Digital, IBM, Intel, Microsoft, NEC and Nortel. Notable current members include HP, NEC, Microsoft, Apple Inc., Intel, and Agere Systems. The working committees within USB-IF are: * Device Working Group * Compliance Committee * Marketing Committee The USB-IF web caters to developers who may sign up freely to the developer web-forums and access documentation. To join a working group, however, one has to work for a member company or register as a member. The developer forums oversee the development of the USB connector, of other USB hardwar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
USB 2
Universal Serial Bus (USB) is an industry standard that establishes specifications for cables, connectors and protocols for connection, communication and power supply ( interfacing) between computers, peripherals and other computers. A broad variety of USB hardware exists, including 14 different connector types, of which USB-C is the most recent and the only one not currently deprecated. First released in 1996, the USB standards are maintained by the USB Implementers Forum (USB-IF). The four generations of USB are: USB 1.''x'', USB 2.0, USB 3.''x'', and USB4. Overview USB was designed to standardize the connection of peripherals to personal computers, both to communicate with and to supply electric power. It has largely replaced interfaces such as serial ports and parallel ports, and has become commonplace on a wide range of devices. Examples of peripherals that are connected via USB include computer keyboards and mice, video cameras, printers, portable media playe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Inductance
Inductance is the tendency of an electrical conductor to oppose a change in the electric current flowing through it. The flow of electric current creates a magnetic field around the conductor. The field strength depends on the magnitude of the current, and follows any changes in current. From Faraday's law of induction, any change in magnetic field through a circuit induces an electromotive force (EMF) (voltage) in the conductors, a process known as electromagnetic induction. This induced voltage created by the changing current has the effect of opposing the change in current. This is stated by Lenz's law, and the voltage is called ''back EMF''. Inductance is defined as the ratio of the induced voltage to the rate of change of current causing it. It is a proportionality factor that depends on the geometry of circuit conductors and the magnetic permeability of nearby materials. An electronic component designed to add inductance to a circuit is called an inductor. It typically ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Capacitance
Capacitance is the capability of a material object or device to store electric charge. It is measured by the change in charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized are two closely related notions of capacitance: ''self capacitance'' and ''mutual capacitance''. An object that can be electrically charged exhibits self capacitance, for which the electric potential is measured between the object and ground. Mutual capacitance is measured between two components, and is particularly important in the operations of the capacitor, a device designed for this purpose as an elementary Linear circuit, linear electronic component. Capacitance is a function only of the geometry of the design of the capacitor, e.g., the opposing surface area of the plates and the distance between them, and the permittivity of the dielectric material between the plates. For many dielectric materials, the permittivity and thus the capaci ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Embedded System
An embedded system is a computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is ''embedded'' as part of a complete device often including electrical or electronic hardware and mechanical parts. Because an embedded system typically controls physical operations of the machine that it is embedded within, it often has real-time computing constraints. Embedded systems control many devices in common use today. , it was estimated that ninety-eight percent of all microprocessors manufactured were used in embedded systems. Modern embedded systems are often based on microcontrollers (i.e. microprocessors with integrated memory and peripheral interfaces), but ordinary microprocessors (using external chips for memory and peripheral interface circuits) are also common, especially in more complex systems. In either case, the processor(s) used ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ETSI
The European Telecommunications Standards Institute (ETSI) is an independent, not-for-profit, standardization organization in the field of information and communications. ETSI supports the development and testing of global technical standards for ICT-enabled systems, applications and services. Overview ETSI was set up in 1988 by the European Conference of Postal and Telecommunications Administrations ( CEPT) following a proposal from the European Commission. ETSI is the officially recognized body with a responsibility for the standardization of Information and Communication Technologies (ICT). It is one of the three bodies, the others being CEN and CENELEC, officially recognized by the European Union as a European Standards Organization (ESO). The role of the European Standards Organizations is to support EU regulation and policies through the production of Harmonised European Standards and other deliverables. The standards developed by ESOs are the only ones that can be rec ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Smartphone
A smartphone is a portable computer device that combines mobile telephone and computing functions into one unit. They are distinguished from feature phones by their stronger hardware capabilities and extensive mobile operating systems, which facilitate wider software, internet (including web browsing over mobile broadband), and multimedia functionality (including music, video, cameras, and gaming), alongside core phone functions such as voice calls and text messaging. Smartphones typically contain a number of metal–oxide–semiconductor (MOS) integrated circuit (IC) chips, include various sensors that can be leveraged by pre-included and third-party software (such as a magnetometer, proximity sensors, barometer, gyroscope, accelerometer and more), and support wireless communications protocols (such as Bluetooth, Wi-Fi, or satellite navigation). Early smartphones were marketed primarily towards the enterprise market, attempting to bridge the functionality of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SIM Card
file:SIM-Karte von Telefónica O2 Europe - Standard und Micro.jpg, A typical SIM card (mini-SIM with micro-SIM cutout) file:Sim card.png, A smart card taken from a Global System for Mobile Communications, GSM mobile phone file:Simkarte NFC SecureElement.jpg, T-Mobile nano-SIM card with NFC capabilities in the SIM tray of an iPhone 6s file:Tf sim both sides.png, A TracFone Wireless SIM card has no distinctive carrier markings and is only marked as a "SIM card" A SIM card (full form Subscriber Identity Module or Subscriber Identification Module) is an integrated circuit (IC) intended to securely store the international mobile subscriber identity (IMSI) number and its related key, which are used to identify and authenticate subscribers on mobile telephony devices (such as mobile phones and computers). Technically the actual physical card is known as a universal integrated circuit card (UICC); this smart card is usually made of PVC with embedded contacts and semiconductors, with the S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Universal Integrated Circuit Card
A GSM mobile phone file:SIM-DXAI20210313172217.jpg, alt=Black and white image of the contacts area of a SIM card showing the internal construction, X-Ray of a SIM card showing small rectangular semiconductor chip (central small rectangle) and 5 bond wires leading to the connection pads file:Vodafone New Zealand SIM circa 2002.jpeg">A 25 × 15 mm Vodafone New Zealand SIM card The universal integrated circuit card (UICC) is the smart card (integrated circuit card) used in mobile terminals in Global System for Mobile Communications, GSM and Universal Mobile Telecommunications System, UMTS networks. The UICC ensures the integrity and security of all kinds of personal data, and it typically holds a few hundred kilobytes. The official definition for UICC is found in ETSI TR 102 216, where it is defined as a "smart card that conforms to the specifications written and maintained by the ETSI Smart Card Platform project". In addition, the definition has a note that states that "UICC is n ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Physical Layer
In the seven-layer OSI model of computer networking, the physical layer or layer 1 is the first and lowest layer; The layer most closely associated with the physical connection between devices. This layer may be implemented by a PHY chip. The physical layer provides an electrical, mechanical, and procedural interface to the transmission medium. The shapes and properties of the electrical connectors, the frequencies to broadcast on, the line code to use and similar low-level parameters, are specified by the physical layer. Role The physical layer defines the means of transmitting a stream of raw bits over a physical data link connecting network nodes. The bitstream may be grouped into code words or symbols and converted to a physical signal that is transmitted over a transmission medium. The physical layer consists of the electronic circuit transmission technologies of a network. It is a fundamental layer underlying the higher level functions in a network, and can be imple ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Buses
In computer architecture, a bus (shortened form of the Latin '' omnibus'', and historically also called data highway or databus) is a communication system that transfers data between components inside a computer, or between computers. This expression covers all related hardware components (wire, optical fiber, etc.) and software, including communication protocols. Early computer buses were parallel electrical wires with multiple hardware connections, but the term is now used for any physical arrangement that provides the same logical function as a parallel electrical busbar. Modern computer buses can use both parallel and bit serial connections, and can be wired in either a multidrop (electrical parallel) or daisy chain topology, or connected by switched hubs, as in the case of Universal Serial Bus (USB). Background and nomenclature Computer systems generally consist of three main parts: * The central processing unit (CPU) that processes data, * The memory that holds the p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
