AlSiC, pronounced "alsick",
is a
metal matrix composite
In materials science, a metal matrix composite (MMC) is a composite material with fibers or particles dispersed in a metallic matrix, such as copper, aluminum, or steel. The secondary phase is typically a ceramic (such as alumina or silicon carb ...
consisting of
aluminium
Aluminium (aluminum in American and Canadian English) is a chemical element with the symbol Al and atomic number 13. Aluminium has a density lower than those of other common metals, at approximately one third that of steel. I ...
matrix with
silicon carbide
Silicon carbide (SiC), also known as carborundum (), is a hard chemical compound containing silicon and carbon. A semiconductor, it occurs in nature as the extremely rare mineral moissanite, but has been mass-produced as a powder and crystal sin ...
particles. It has high
thermal conductivity
The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by k, \lambda, or \kappa.
Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal ...
(180–200 W/m K), and its
thermal expansion
Thermal expansion is the tendency of matter to change its shape, area, volume, and density in response to a change in temperature, usually not including phase transitions.
Temperature is a monotonic function of the average molecular kinetic ...
can be adjusted to match other materials, e.g.
silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic tab ...
and
gallium arsenide
Gallium arsenide (GaAs) is a III-V direct band gap semiconductor with a Zincblende (crystal structure), zinc blende crystal structure.
Gallium arsenide is used in the manufacture of devices such as microwave frequency integrated circuits, monoli ...
chips and various
ceramic
A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain ...
s. It is chiefly used in
microelectronics
Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre-sc ...
as
substrate for
power semiconductor device
A power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics (for example in a switch-mode power supply). Such a device is also called a power device or, when used in an integrated circuit, a power IC ...
s and high density
multi-chip module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are int ...
s, where it aids with removal of
waste heat
Waste heat is heat that is produced by a machine, or other process that uses energy, as a byproduct of doing work. All such processes give off some waste heat as a fundamental result of the laws of thermodynamics. Waste heat has lower utility ...
.
Several variants exist:
*AlSiC-9, containing 37 vol.% of A 356.2
aluminium alloy
An aluminium alloy (or aluminum alloy; see spelling differences) is an alloy in which aluminium (Al) is the predominant metal. The typical alloying elements are copper, magnesium, manganese, silicon, tin, nickel and zinc. There are two principal ...
and 63 vol.% silicon carbide. Its thermal conductivity is 190–200 W/m K. Its thermal expansion roughly matches
gallium arsenide
Gallium arsenide (GaAs) is a III-V direct band gap semiconductor with a Zincblende (crystal structure), zinc blende crystal structure.
Gallium arsenide is used in the manufacture of devices such as microwave frequency integrated circuits, monoli ...
,
silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic tab ...
,
indium phosphide
Indium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. It has a face-centered cubic ("zincblende") crystal structure, identical to that of GaAs and most of the III-V semiconductors.
Manufacturing
Indium phosphide ca ...
,
alumina,
aluminium nitride,
silicon nitride
Silicon nitride is a chemical compound of the elements silicon and nitrogen. is the most thermodynamically stable and commercially important of the silicon nitrides, and the term "silicon nitride" commonly refers to this specific composition. It ...
, and
Direct Bonded Copper aluminium nitride. It is also compatible with some
low temperature co-fired ceramic
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, ...
s, e.g. Ferro A6M and A6S, Heraeus CT 2000, and Kyocera GL560. Its density at 25 °C is 3.01 g/cm
3.
*AlSiC-10, containing 45 vol.% of A 356.2 aluminium alloy and 55 vol.% silicon carbide. Its thermal conductivity is 190–200 W/m K. Its thermal expansion roughly matches e.g.
printed circuit board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a L ...
s,
FR-4
FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material. FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (''self-extinguishing'').
"FR" stands fo ...
, and
Duroid. Its density at 25 °C is 2.96 g/cm
3.
*AlSiC-12, containing 63 vol.% of A 356.2 aluminium alloy and 37 vol.% silicon carbide. Its thermal conductivity is 170–180 W/m K. It is compatible with generally the same materials as AlSiC-10. Its density at 25 °C is 2.89 g/cm
3.
AlSiC composites are suitable replacements for
copper
Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkis ...
-
molybdenum
Molybdenum is a chemical element with the symbol Mo and atomic number 42 which is located in period 5 and group 6. The name is from Neo-Latin ''molybdaenum'', which is based on Ancient Greek ', meaning lead, since its ores were confused with lea ...
(
CuMo) and copper-
tungsten
Tungsten, or wolfram, is a chemical element with the symbol W and atomic number 74. Tungsten is a rare metal found naturally on Earth almost exclusively as compounds with other elements. It was identified as a new element in 1781 and first isolat ...
(
CuW) alloys; they have about 1/3 the weight of copper, 1/5 of CuMo, and 1/6 of CuW, making them suitable for weight-sensitive applications; they are also stronger and stiffer than copper. They can be used as heatsinks, substrates for power electronics (e.g.
IGBT
An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily used as an electronic switch, which, as it was developed, came to combine high efficiency and fast switching. It consists of four alternating lay ...
s and high-power
LED
A light-emitting diode (LED) is a semiconductor Electronics, device that Light#Light sources, emits light when Electric current, current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy i ...
s), heat spreaders, housings for electronics, and lids for chips, e.g.
microprocessor
A microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit, or a small number of integrated circuits. The microprocessor contains the arithmetic, logic, and control circu ...
s and
ASICs. Metal and ceramic inserts and channels for a
coolant
A coolant is a substance, typically liquid, that is used to reduce or regulate the temperature of a system. An ideal coolant has high thermal capacity, low viscosity, is low-cost, non-toxic, chemically inert and neither causes nor promotes corrosio ...
can be integrated into the parts during manufacture. AlSiC composites can be produced relatively inexpensively (USD 2-4/lb in large series); the dedicated tooling however causes large up-front expenses, making AlSiC more suitable for mature designs.
Heat pipe
A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces.
At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor ...
s can be embedded into AlSiC, raising effective heat conductivity to 500–800 W/m K.
AlSiC parts are typically manufactured by
near net shape
Near-net-shape is an industrial manufacturing technique. As the name implies, the initial production of the item is very close to the final, or ''net'', shape. This reduces the need for surface finishing. By minimizing the use of finishing methods ...
approach, by creating a SiC preform by
metal injection molding
Metal injection molding (MIM) is a metalworking process in which finely-powdered metal is mixed with binder material to create a "feedstock" that is then shaped and solidified using injection molding. The molding process allows high volume, ...
of an SiC-binder slurry, firing to remove the binder, then infiltration under pressure with molten aluminium. Parts can be made with sufficient tolerance to not require further machining. The material is fully dense, without voids, and is hermetic. Its high stiffness and low density suits larger parts with thin walls such as fins for heat dissipation. AlSiC can be plated with
nickel
Nickel is a chemical element with symbol Ni and atomic number 28. It is a silvery-white lustrous metal with a slight golden tinge. Nickel is a hard and ductile transition metal. Pure nickel is chemically reactive but large pieces are slow to ...
and nickel-
gold
Gold is a chemical element with the symbol Au (from la, aurum) and atomic number 79. This makes it one of the higher atomic number elements that occur naturally. It is a bright, slightly orange-yellow, dense, soft, malleable, and ductile met ...
, or by other metals by
thermal spraying
Thermal spraying techniques are coating processes in which melted (or heated) materials are sprayed onto a surface. The "feedstock" (coating precursor) is heated by electrical (plasma or arc) or chemical means (combustion flame).
Thermal sprayi ...
. Ceramic and metal insets can be inserted into the preform before aluminium infiltration, resulting in a hermetic seal. AlSiC can be also prepared by
mechanical alloying Mechanical alloying (MA) is a solid-state and powder processing technique involving repeated cold welding, fracturing, and re-welding of blended powder particles in a high-energy ball mill to produce a homogeneous material. Originally developed to ...
. When lower degree of SiC content is used, parts can be stamped from AlSiC sheets.
The aluminium matrix contains high amount of
dislocation
In materials science, a dislocation or Taylor's dislocation is a linear crystallographic defect or irregularity within a crystal structure that contains an abrupt change in the arrangement of atoms. The movement of dislocations allow atoms to sl ...
s, responsible for the strength of the material. The dislocations are introduced during cooling by the SiC particles, due to their different thermal expansion coefficient.
A similar material is
Dymalloy Dymalloy is a metal matrix composite consisting of 20% copper and 80% silver alloy matrix with type I diamond. It has very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g. sili ...
, with copper-silver alloy instead of aluminium and
diamond
Diamond is a Allotropes of carbon, solid form of the element carbon with its atoms arranged in a crystal structure called diamond cubic. Another solid form of carbon known as graphite is the Chemical stability, chemically stable form of car ...
instead of silicon carbide. Other materials are copper reinforced with
carbon fiber
Carbon fiber-reinforced polymers (American English), carbon-fibre-reinforced polymers (Commonwealth English), carbon-fiber-reinforced plastics, carbon-fiber reinforced-thermoplastic (CFRP, CRP, CFRTP), also known as carbon fiber, carbon compo ...
, diamond-reinforced aluminium,
reinforced carbon-carbon, and
pyrolytic graphite
Pyrolytic carbon is a material similar to graphite, but with some covalent bonding between its graphene sheets as a result of imperfections in its production.
Pyrolytic carbon is man-made and is thought not to be found in nature.Ratner, Buddy D. ...
.
References
{{aluminium alloys
Aluminium alloys
Metal matrix composites
Chip carriers