Thermally Conductive Pad
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Thermally Conductive Pad
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact;AMD - Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease
Accessed 23 February 2014
they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become so ...
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Computing
Computing is any goal-oriented activity requiring, benefiting from, or creating computing machinery. It includes the study and experimentation of algorithmic processes, and development of both hardware and software. Computing has scientific, engineering, mathematical, technological and social aspects. Major computing disciplines include computer engineering, computer science, cybersecurity, data science, information systems, information technology and software engineering. The term "computing" is also synonymous with counting and calculating. In earlier times, it was used in reference to the action performed by mechanical computing machines, and before that, to human computers. History The history of computing is longer than the history of computing hardware and includes the history of methods intended for pen and paper (or for chalk and slate) with or without the aid of tables. Computing is intimately tied to the representation of numbers, though mathematical conc ...
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Overclocking
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, however there are an increasing number of manufacturers that will allow overclocking as long as performed (relatively) safely. Overview The purpose of overclocking is to increase the operating speed of a given component. Normally, on modern systems, the target of overclocking is increasing the performance of a major chip or subsystem, such as the main processor or graphics cont ...
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Cooling Technology
Cooling is removal of heat, usually resulting in a lower temperature and/or phase change. Temperature lowering achieved by any other means may also be called cooling.ASHRAE Terminology, https://www.ashrae.org/technical-resources/free-resources/ashrae-terminology The transfer of thermal energy may occur via thermal radiation, heat conduction or convection. Examples can be as simple as reducing temperature of a coffee. Devices *Coolant *Cooling towers, as used in large industrial plants and power stations * Daytime passive radiative cooler *Evaporative cooler *Heat exchanger *Heat pipe *Heat sink *HVAC (Heating, Ventilation and Air Conditioning) * Intercooler *Radiative cooling in Heat shields * Radiators in automobiles *Pumpable ice technology *Thermoelectric cooling *Vortex tube The vortex tube, also known as the Ranque-Hilsch vortex tube, is a mechanical device that separates a compressed gas into hot and cold streams. The gas emerging from the hot end can reach temperature ...
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Computer Hardware Cooling
A computer is a machine that can be programmed to carry out sequences of arithmetic or logical operations (computation) automatically. Modern digital electronic computers can perform generic sets of operations known as programs. These programs enable computers to perform a wide range of tasks. A computer system is a nominally complete computer that includes the hardware, operating system (main software), and peripheral equipment needed and used for full operation. This term may also refer to a group of computers that are linked and function together, such as a computer network or computer cluster. A broad range of industrial and consumer products use computers as control systems. Simple special-purpose devices like microwave ovens and remote controls are included, as are factory devices like industrial robots and computer-aided design, as well as general-purpose devices like personal computers and mobile devices like smartphones. Computers power the Internet, which links bi ...
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List Of Thermal Conductivities
In heat transfer, the thermal conductivity of a substance, ''k'', is an intensive property that indicates its ability to conduct heat. For most materials, the amount of heat conducted varies (usually non-linearly) with temperature. Thermal conductivity is often measured with laser flash analysis. Alternative measurements are also established. Mixtures may have variable thermal conductivities due to composition. Note that for gases in usual conditions, heat transfer by advection (caused by convection or turbulence for instance) is the dominant mechanism compared to conduction. This table shows thermal conductivity in SI units of watts per metre-kelvin (W·m−1·K−1). Some measurements use the imperial unit BTUs per foot per hour per degree Fahrenheit ( = Sortable list This concerns materials at atmospheric pressure and around . Analytical list Thermal conductivities have been measured with longitudinal heat flow methods where the experimental arrangement is so designed ...
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Thermal Paste
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste. Composition Thermal paste consists of a polymerizable liquid matrix and large volu ...
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Thermal Adhesive
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available. The glue is typically a two-part epoxy resin (usually for paste products) or cyanoacrylate (for tapes). The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres. The latter are found in products that have much higher dielectric strength, although this comes at the cost of lower thermal conductivity. End-user modding heatsinks may be supplied with thermal adhesive attached (usually a piece of tape). For products sold through electronic components distributors this is rarely the case; the adhesives are sold separately to professionals. See also * Computer cooling * Hot-melt adhesive * Phase-change material * Thermally conductive ...
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Phase-change Material
A phase change material (PCM) is a substance which releases/absorbs sufficient energy at phase transition to provide useful heat or cooling. Generally the transition will be from one of the first two fundamental states of matter - solid and liquid - to the other. The phase transition may also be between non-classical states of matter, such as the conformity of crystals, where the material goes from conforming to one crystalline structure to conforming to another, which may be a higher or lower energy state. The energy released/absorbed by phase transition from solid to liquid, or vice versa, the heat of fusion is generally much higher than the sensible heat. Ice, for example, requires 333.55 J/g to melt, but then water will rise one degree further with the addition of just 4.18 J/g. Water/ice is therefore a very useful phase change material and has been used to store winter cold to cool buildings in summer since at least the time of the Achaemenid Empire. By melting and soli ...
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Hot-melt Adhesive
Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun. The gun uses a continuous-duty heating element to melt the plastic glue, which the user pushes through the gun either with a mechanical trigger mechanism on the gun, or with direct finger pressure. The glue squeezed out of the heated nozzle is initially hot enough to burn and even blister skin. The glue is sticky when hot, and solidifies in a few seconds to one minute. Hot-melt adhesives can also be applied by dipping or spraying, and are popular with hobbyists and crafters both for affixing and as an inexpensive alternative to resin casting. In industrial use, hot-melt adhesives provide several advantages over solvent-based adhesives. Volatile organic compounds are reduced or eliminated, and the drying or curing step is eliminated. Hot-melt adhesives have a long shelf life and usua ...
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Computer Cooling
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, Video card, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of Heat sink#Microprocessor cooling, heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also mo ...
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Dynamic Frequency Scaling
Dynamic frequency scaling (also known as CPU throttling) is a power management technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip. Dynamic frequency scaling helps preserve battery on mobile devices and decrease cooling cost and noise on quiet computing settings, or can be useful as a security measure for overheated systems (e.g. after poor overclocking). Dynamic frequency scaling almost always appear in conjunction with dynamic voltage scaling, since higher frequencies require higher supply voltages for the digital circuit to yield correct results. The combined topic is known as dynamic voltage and frequency scaling (DVFS). Processor throttling is also known as "automatic underclocking". Automatic overclocking (boosting) is also technically a form of dynamic frequency scaling, but it's relatively new and usu ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ...
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