Physical Verification
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Physical Verification
Physical verification is a process whereby an integrated circuit layout (IC layout) design is verified via EDA software tools to ensure correct electrical and logical functionality and manufacturability. Verification involves design rule check (DRC), layout versus schematic (LVS), XOR (exclusive OR), antenna checks and electrical rule check (ERC).A. Kahng, et al.: ''VLSI Physical Design: From Graph Partitioning to Timing Closure'', , , p. 10. Design Rule Check (DRC) DRC verifies that the layout meets all technology-imposed constraints. DRC also verifies layer density for chemical-mechanical polishing (CMP). Layout Versus Schematic (LVS) LVS verifies the functionality of the design. From the layout, a netlist is derived and compared with the original netlist produced from logic synthesis or circuit design. XOR check This check is typically run after a metal spin, where the original and modified database are compared. This is done to confirm that the desired modifications have ...
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Integrated Circuit Layout
Integrated circuit layout, also known IC layout, IC mask layout, or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit. Originally the overall process was called tapeout as historically early ICs used graphical black crepe tape on mylar media for photo imaging (erroneously believed to reference magnetic data—the photo process greatly predated magnetic media). When using a standard process—where the interaction of the many chemical, thermal, and photographic variables is known and carefully controlled—the behaviour of the final integrated circuit depends largely on the positions and interconnections of the geometric shapes. Using a computer-aided layout tool, the layout engineer—or layout technician—places and connects all of the components that make up the chip such that they meet certain criteria†...
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Design Rule Check
In electronic design automation, a design rule is a geometric constraint imposed on circuit board, semiconductor device, and integrated circuit (IC) designers to ensure their designs function properly, reliably, and can be produced with acceptable yield. Design rules for production are developed by process engineers based on the capability of their processes to realize design intent. Electronic design automation is used extensively to ensure that designers do not violate design rules; a process called design rule checking (DRC). DRC is a major step during physical verification signoff on the design, which also involves LVS (layout versus schematic) checks, XOR checks, ERC ( electrical rule check), and antenna checks. The importance of design rules and DRC is greatest for ICs, which have micro- or nano-scale geometries; for advanced processes, some fabs also insist upon the use of more restricted rules to improve yield. Design rules Design rules are a series of parameters provi ...
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Layout Versus Schematic
The Layout Versus Schematic (LVS) is the class of electronic design automation (EDA) verification software that determines whether a particular integrated circuit layout corresponds to the original schematic or circuit diagram of the design. Background A successful design rule check (DRC) ensures that the layout conforms to the rules designed/required for faultless fabrication. However, it does not guarantee if it really represents the circuit you desire to fabricate. This is where an LVS check is used. The need for such programs was recognized relatively early in the history of ICs, and programs to perform this comparison were written as early as 1975. These early programs operated mainly on the level of graph isomorphism, checking whether the schematic and layout were indeed identical. With the advent of digital logic, this was too restrictive, since exactly the same function can be implemented in many different (and non-isomorphic) ways. Therefore, LVS has been augmented by ...
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Antenna Effect
The antenna effect, more formally plasma induced gate oxide damage, is an effect that can potentially cause yield and reliability problems during the manufacture of MOS integrated circuits. Factories (''fabs'') normally supply antenna rules, which are rules that must be obeyed to avoid this problem. A violation of such rules is called an antenna violation. The word antenna is something of a misnomer in this context—the problem is really the collection of charge, not the normal meaning of antenna, which is a device for converting electromagnetic fields to/from electrical currents. Occasionally the phrase ''antenna effect'' is used in this context, but this is less common since there are many effects,From the above reference: ''Several major antenna effects are considered, like impedance matching, antenna gain, frequency-dependent radiation patterns, and antenna temporal dispersion in the presence of the radio channel.'' and the phrase does not make clear which is meant. Fig ...
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Logic Synthesis
In computer engineering, logic synthesis is a process by which an abstract specification of desired circuit behavior, typically at register transfer level (RTL), is turned into a design implementation in terms of logic gates, typically by a computer program called a ''synthesis tool''. Common examples of this process include synthesis of designs specified in hardware description languages, including VHDL and Verilog. Some synthesis tools generate bitstreams for programmable logic devices such as PALs or FPGAs, while others target the creation of ASICs. Logic synthesis is one aspect of electronic design automation. History of logic synthesis The roots of logic synthesis can be traced to the treatment of logic by George Boole (1815 to 1864), in what is now termed Boolean algebra. In 1938, Claude Shannon showed that the two-valued Boolean algebra can describe the operation of switching circuits. In the early days, logic design involved manipulating the truth table representation ...
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Fan-out
In digital electronics, the fan-out is the number of gate inputs driven by the output of another single logic gate. In most designs, logic gates are connected to form more complex circuits. While no logic gate input can be fed by more than one output at a time without causing contention, it is common for one output to be connected to several inputs. The technology used to implement logic gates usually allows a certain number of gate inputs to be wired directly together without additional interfacing circuitry. The maximum fan-out of an output measures its load-driving capability: it is the greatest number of inputs of gates of the same type to which the output can be safely connected. Logical practice Maximum limits on fan-out are usually stated for a given logic family or device in the manufacturer's datasheets. These limits assume that the driven devices are members of the same family. More complex analysis than fan-in and fan-out is required when two different logic fami ...
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Application-specific Integrated Circuit
An application-specific integrated circuit (ASIC ) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product (ASSP) chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal-oxide-semiconductor (MOS) technology, as MOS integrated circuit chips. As feature sizes have shrunk and design tools improved over the years, the maximum complexity (and hence functionality) possible in an ASIC has grown from 5,000 logic gates to over 100 million. Modern ASICs often include entire microprocessors, memory blocks including ROM, RAM, EEPROM, flash memory and other large building blocks. Such an ASIC is often termed a SoC (system-on-chip). Designers of digital ASICs often use a hardware descrip ...
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Electrostatic Discharge
Electrostatic discharge (ESD) is a sudden and momentary flow of electric current between two electrically charged objects caused by contact, an short circuit, electrical short or dielectric breakdown. A buildup of static electricity can be caused by tribocharging or by electrostatic induction. The ESD occurs when differently-charged objects are brought close together or when the dielectric between them breaks down, often creating a visible electric spark, spark. ESD can create spectacular electric sparks (lightning, with the accompanying sound of thunder, is a large-scale ESD event), but also less dramatic forms which may be neither seen nor heard, yet still be large enough to cause damage to sensitive electronic devices. Electric sparks require a field strength above approximately 40 kV/cm in air, as notably occurs in lightning strikes. Other forms of ESD include corona discharge from sharp electrodes and brush discharge from blunt electrodes. ESD can cause harmful effects of imp ...
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