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Nanofabrication
Nanolithography (NL) is a growing field of techniques within nanotechnology dealing with the engineering (patterning e.g. etching, depositing, writing, printing etc) of nanometer-scale structures on various materials. The modern term reflects on a design of structures built in range of 10−9 to 10−6 meters, i.e. nanometer scale. Essentially, the field is a derivative of lithography, only covering very small structures. All NL methods can be categorized into four groups: photo lithography, scanning lithography, soft lithography and other miscellaneous techniques. History The NL has evolved from the need to increase the number of sub-micrometer features (e.g. transistors, capacitors etc.) in an integrated circuit in order to keep up with Moore's Law. While lithographic techniques have been around since the late 18th century, none were applied to nanoscale structures until the mid-1950s. With evolution of the semiconductor industry, demand for techniques capable of producing mi ...
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Nanotechnology
Nanotechnology, also shortened to nanotech, is the use of matter on an atomic, molecular, and supramolecular scale for industrial purposes. The earliest, widespread description of nanotechnology referred to the particular technological goal of precisely manipulating atoms and molecules for fabrication of macroscale products, also now referred to as molecular nanotechnology. A more generalized description of nanotechnology was subsequently established by the National Nanotechnology Initiative, which defined nanotechnology as the manipulation of matter with at least one dimension sized from 1 to 100 nanometers (nm). This definition reflects the fact that quantum mechanical effects are important at this quantum-realm scale, and so the definition shifted from a particular technological goal to a research category inclusive of all types of research and technologies that deal with the special properties of matter which occur below the given size threshold. It is therefore commo ...
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Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical ( photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature ...
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Soft Lithography
In technology, soft lithography is a family of techniques for fabricating or replicating structures using "elastomeric stamps, molds, and conformable photomasks". It is called "soft" because it uses elastomeric materials, most notably PDMS. Soft lithography is generally used to construct features measured on the micrometer to nanometer scale. According to Rogers and Nuzzo (2005), development of soft lithography expanded rapidly from 1995 to 2005. Soft lithography tools are now commercially available. Types * PDMS stamp * Microcontact printing * Multilayer soft lithography Advantages Soft lithography has some unique advantages over other forms of lithography (such as photolithography and electron beam lithography). They include the following: *Lower cost than traditional photolithography in mass production *Well-suited for applications in biotechnology *Well-suited for applications in plastic electronics *Well-suited for applications involving large or nonplanar (nonf ...
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Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical ( photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature ...
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Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography and the production of integrated circuits (ICs or "chips") in particular. Masks are used to produce a pattern on a substrate, normally a thin slice of silicon known as a wafer in the case of chip manufacturing. Several masks are used in turn, each one reproducing a layer of the completed design, and together they are known as a mask set. Previously, photomasks used to be produced manually by using rubylith and mylar. As complexity continued to grow, manual processing of any sort became difficult. This was solved with the introduction of the optical pattern generator which automated the process of producing the initial large-scale pattern, and the step-and-repeat cameras that automated the copying of the pattern into a multiple-IC mask. The intermediate masks are known as reticles, and were initially copied to production m ...
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Poly(methyl Methacrylate)
Poly(methyl methacrylate) (PMMA) belongs to a group of materials called engineering plastics. It is a transparent thermoplastic. PMMA is also known as acrylic, acrylic glass, as well as by the trade names and brands Crylux, Plexiglas, Acrylite, Astariglas, Lucite, Perclax, and Perspex, among several others ( see below). This plastic is often used in sheet form as a lightweight or shatter-resistant alternative to glass. It can also be used as a casting resin, in inks and coatings, and for many other purposes. Although not a type of familiar silica-based glass, the substance, like many thermoplastics, is often technically classified as a type of glass, in that it is a non-crystalline vitreous substance—hence its occasional historic designation as ''acrylic glass''. Chemically, it is the synthetic polymer of methyl methacrylate. It was developed in 1928 in several different laboratories by many chemists, such as William Chalmers, Otto Röhm, and Walter Bauer, and first brough ...
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Hydrogen Silsesquioxane
200px, thumbnail, Hydrogen silsesquioxane (R = H). Hydrogen silsesquioxane(s) (HSQ, H-SiOx, THn, H-resin) are inorganic compounds with the empirical formula SiO3/2sub>n. The cubic H8Si8O12 (TH8) is used as the visual representation for HSQ. TH8, TH10, TH12, and TH14 have been characterized by EA), gas chromatography–mass spectroscopy ( GC-MS), IR spectroscopy, and NMR spectroscopy . High purity semiconductor-grade HSQ has been investigated as a negative resist in photolithography and electron-beam (e-beam) lithography. HSQ is commonly delivered in methyl isobutyl ketone ( MIBK) and can be used to form 0.01–2 µm films on substrates/wafers. When exposed to electrons or extreme ultraviolet radiation (EUV), HSQ cross-links via hydrogen evolution concomitant with Si-O bond crosslink In chemistry and biology a cross-link is a bond or a short sequence of bonds that links one polymer chain to another. These links may take the form of covalent bonds or ionic bonds ...
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Solubility
In chemistry, solubility is the ability of a substance, the solute, to form a solution with another substance, the solvent. Insolubility is the opposite property, the inability of the solute to form such a solution. The extent of the solubility of a substance in a specific solvent is generally measured as the concentration of the solute in a saturated solution, one in which no more solute can be dissolved. At this point, the two substances are said to be at the solubility equilibrium. For some solutes and solvents, there may be no such limit, in which case the two substances are said to be " miscible in all proportions" (or just "miscible"). The solute can be a solid, a liquid, or a gas, while the solvent is usually solid or liquid. Both may be pure substances, or may themselves be solutions. Gases are always miscible in all proportions, except in very extreme situations,J. de Swaan Arons and G. A. M. Diepen (1966): "Gas—Gas Equilibria". ''Journal of Chemical Physi ...
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Maskless Lithography
Maskless lithography (MPL) is a photomask-less photolithography-like technology used to project or focal-spot write the image pattern onto a chemical resist-coated substrate (e.g. wafer) by means of UV radiation or electron beam. In microlithography, typically UV radiation casts an image of a time constant mask onto a photosensitive emulsion (or photoresist). Traditionally, mask aligners, steppers, scanners, and other kinds of non-optical techniques are used for high speed microfabrication of microstructures, but in case of MPL, some of these become redundant. Maskless lithography has two approaches to project a pattern: rasterized and vectorized. In the first one it utilizes generation of a time-variant intermittent image on an electronically modifiable (virtual) mask that is projected with known means (also known as Laser Direct Imaging and other synonyms). In the vectored approach, direct writing is achieved by radiation that is focused to a narrow beam that is scanned in vec ...
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Scanning Probe Lithography
Scanning probe lithography (SPL) describes a set of nanolithographic methods to pattern material on the nanoscale using scanning probes. It is a direct-write, mask-less approach which bypasses the diffraction limit and can reach resolutions below 10 nm. It is considered an alternative lithographic technology often used in academic and research environments. The term ''scanning probe lithography'' was coined after the first patterning experiments with scanning probe microscopes (SPM) in the late 1980s. Classification The different approaches towards SPL can be classified by their goal to either add or remove material, by the general nature of the process either chemical or physical, or according to the driving mechanisms of the probe-surface interaction used in the patterning process: mechanical, thermal, diffusive and electrical. Overview Mechanical/thermo-mechanical Mechanical scanning probe lithography (m-SPL) is a nanomachining or ''nano-scratching'' top-down a ...
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Semiconductor Device
A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in most applications. They conduct electric current in the solid state, rather than as free electrons across a vacuum (typically liberated by thermionic emission) or as free electrons and ions through an ionized gas. Semiconductor devices are manufactured both as single discrete devices and as integrated circuit (IC) chips, which consist of two or more devices—which can number from the hundreds to the billions—manufactured and interconnected on a single semiconductor wafer (also called a substrate). Semiconductor materials are useful because their behavior can be easily manipulated by the deliberate addition of impurities, known as doping ...
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Electron-beam Lithography
Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with Semiconductor device fabrication, sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development. Systems Electron-beam lithography system ...
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