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Zig-zag In-line Package
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages ( TSOPs), but are still in use. The quad in-line package uses a smilar staggered semiconductor package design. High-power devices (such as hi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO220
The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used to mount the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits. Typical applications The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab wi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Acorn Archimedes
Acorn Archimedes is a family of personal computers designed by Acorn Computers of Cambridge, Cambridge, England. The systems are based on Acorn's own ARM architecture processors and the proprietary operating systems Arthur and RISC OS. The first models were introduced in 1987, and systems in the Archimedes family were sold until the mid-1990s. ARM's Reduced instruction set computer, RISC design, a 32-bit CPU (using 26-bit addressing), running at 8 Hertz, MHz, was stated as achieving 4.5+ Million instructions per second, MIPS, which provided a significant upgrade from 8-bit home computers, such as Acorn's previous machines. Claims of being the fastest micro in the world and running at 18 MIPS were also made during tests. Two of the first models—the A305 and A310—were given the BBC branding, with BBC Worldwide, BBC Enterprises regarding the machines as "a continuing part of the original computer literacy project". Dissatisfaction with the branding arrangement was ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Commodore CDTV
The CDTV (from Commodore Dynamic Total Vision, later treated as a backronym for Compact Disc Television) is a home multimedia entertainment and video game console – convertible into a full-fledged personal computer by the addition of optional peripherals – developed by Commodore International and launched in April 1991. Description The CDTV is essentially a Commodore Amiga 500 home computer with a CD-ROM drive and remote control. With the optional keyboard, mouse, and floppy disk drive, it gained the functionality of the regular Amiga. Commodore marketed the machine as an all-in-one multimedia appliance. As such, it targeted the same market as the Philips CD-i. The expected market for multimedia appliances did not materialize, and neither machine met with any real commercial success. Though the CDTV was based entirely on Amiga hardware, it was marketed strictly as a CDTV, with the Amiga name omitted from product branding. Commodore announced the CDTV at the summer 1990 Cons ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Amiga 3000
The Commodore Amiga 3000, or A3000, is a personal computer released by Commodore in June 1990. It features improved processing speed, improved graphics rendering, and a new revision of the operating system. It is the successor to the Amiga 2000. Its predecessors, the Amiga 500, 1000 and 2000, share the same fundamental system architecture and consequently perform without much variation in processing speed despite considerable variation in purchase price. The A3000 however, was entirely reworked and rethought as a high-end workstation. The new Motorola 32-bit 68030 CPU, 68882 math co-processor, and 32-bit system memory increase the integer processing speed by a factor of 5 to 18, and the floating-point processing speed by a factor of 7 to 200 times. The new 32-bit Zorro III expansion slots provide for faster and more powerful expansion capabilities. In common with earlier Amigas the 3000 runs a 32-bit operating system called AmigaOS. Version 2.0 is generally considered to have a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Amiga 500
The Amiga 500, also known as the A500, is the first low-end version of the Amiga home computer. It contains the same Motorola 68000 as the Amiga 1000, as well as the same graphics and sound coprocessors, but is in a smaller case similar to that of the Commodore 128. Commodore announced the Amiga 500 at the January 1987 winter Consumer Electronics Showat the same time as the high-end Amiga 2000. It was initially available in the Netherlands in April 1987, then the rest of Europe in May. In North America and the UK it was released in October 1987 with a list price. It competed directly against models in the Atari ST line. The Amiga 500 was sold in the same retail outlets as the Commodore 64, as opposed to the computer store-only Amiga 1000. It proved to be Commodore's best-selling model, particularly in Europe. Although popular with hobbyists, arguably its most widespread use was as a gaming machine, where its graphics and sound were of significant benefit. It was followed by a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DRAM
Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal-oxide-semiconductor (MOS) technology. While most DRAM memory cell designs use a capacitor and transistor, some only use two transistors. In the designs where a capacitor is used, the capacitor can either be charged or discharged; these two states are taken to represent the two values of a bit, conventionally called 0 and 1. The electric charge on the capacitors gradually leaks away; without intervention the data on the capacitor would soon be lost. To prevent this, DRAM requires an external ''memory refresh'' circuit which periodically rewrites the data in the capacitors, restoring them to their original charge. This refresh process is the defining characteristic of dynamic random-access memory, in contrast to static random-access memory (SRA ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-leaded Power Package
The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W. One well-known STMicroelectronics brand of this type of package is Multiwatt. Typical applications Multi-leaded power packa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heatsink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Package
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad In-line Package
In microelectronics, a quadin-line package (QIP or QIL), is an electronic component package with a rectangular housing and four parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. Rockwell used a QIP with 42 leads formed into staggered rows for their PPS-4 microprocessor family introduced in 1973, and other microprocessors and microcontrollers, some with higher lead counts, through the early 1990s. The QIP has the same dimensions as a Dual in-line package (DIP), but the leads on each side are bent into an alternating zigzag configuration so as to fit four lines of solder pads (instead of two with a DIP but similar to Zig-zag in-line package). The QIP design increased the spacing between solder pads without increasing package size, for two reasons: # First it allowed more reliable soldering. This may seem odd today, given the far closer solder pad spacing in use now, but in the 1970s, the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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