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Wafer Dicing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a ''dicing saw'') or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Dicing saws may use a dicing blade with diamond particles, rotating at 30,000 RPM and cooled with deionized water. Once ...
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Manufacturing
Manufacturing is the creation or production of goods with the help of equipment, labor, machines, tools, and chemical or biological processing or formulation. It is the essence of secondary sector of the economy. The term may refer to a range of human activity, from handicraft to high-tech, but it is most commonly applied to industrial design, in which raw materials from the primary sector are transformed into finished goods on a large scale. Such goods may be sold to other manufacturers for the production of other more complex products (such as aircraft, household appliances, furniture, sports equipment or automobiles), or distributed via the tertiary industry to end users and consumers (usually through wholesalers, who in turn sell to retailers, who then sell them to individual customers). Manufacturing engineering is the field of engineering that designs and optimizes the manufacturing process, or the steps through which raw materials are transformed int ...
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Nanoseconds
A nanosecond (ns) is a unit of time in the International System of Units (SI) equal to one billionth of a second, that is, of a second, or 10 seconds. The term combines the SI prefix ''nano-'' indicating a 1 billionth submultiple of an SI unit (e.g. nanogram, nanometre, etc.) and ''second'', the primary unit of time in the SI. A nanosecond is equal to 1000 picoseconds or  microsecond. Time units ranging between 10 and 10 seconds are typically expressed as tens or hundreds of nanoseconds. Time units of this granularity are commonly found in telecommunications, pulsed lasers, and related aspects of electronics. Common measurements * 0.001 nanoseconds – one picosecond * 0.5 nanoseconds – the half-life of beryllium-13. * 0.96 nanoseconds – 100 Gigabit Ethernet Interpacket gap * 1.0 nanosecond – cycle time of an electromagnetic wave with a frequency of 1 GHz (1 hertz). * 1.0 nanosecond – electromagnetic wavelength of 1  light-nanosecond. E ...
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Solidification
Freezing is a phase transition where a liquid turns into a solid when its temperature is lowered below its freezing point. In accordance with the internationally established definition, freezing means the solidification phase change of a liquid or the liquid content of a substance, usually due to cooling. For most substances, the melting and freezing points are the same temperature; however, certain substances possess differing solid-liquid transition temperatures. For example, agar displays a hysteresis in its melting point and freezing point. It melts at 85 °C (185 °F) and solidifies from 32 °C to 40 °C (89.6 °F to 104 °F). Crystallization Most liquids freeze by crystallization, formation of crystalline solid from the uniform liquid. This is a first-order thermodynamic phase transition, which means that as long as solid and liquid coexist, the temperature of the whole system remains very nearly equal to the melting point due to the slow ...
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Cleavage Plane
Cleavage, in mineralogy and materials science, is the tendency of crystalline materials to split along definite crystallographic structural planes. These planes of relative weakness are a result of the regular locations of atoms and ions in the crystal, which create smooth repeating surfaces that are visible both in the microscope and to the naked eye. If bonds in certain directions are weaker than others, the crystal will tend to split along the weakly bonded planes. These flat breaks are termed "cleavage."Hurlbut, Cornelius S.; Klein, Cornelis, 1985, '' Manual of Mineralogy'', 20th ed., Wiley, The classic example of cleavage is mica, which cleaves in a single direction along the basal pinacoid, making the layers seem like pages in a book. In fact, mineralogists often refer to "books of mica." Diamond and graphite provide examples of cleavage. Both are composed solely of a single element, carbon. But in diamond, each carbon atom is bonded to four others in a tetrahedral p ...
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Focus (optics)
In geometrical optics, a focus, also called an image point, is a point where light rays originating from a point on the object converge. Although the focus is conceptually a point, physically the focus has a spatial extent, called the blur circle. This non-ideal focusing may be caused by aberrations of the imaging optics. In the absence of significant aberrations, the smallest possible blur circle is the Airy disc, which is caused by diffraction from the optical system's aperture. Aberrations tend to worsen as the aperture diameter increases, while the Airy circle is smallest for large apertures. An image, or image point or region, is in focus if light from object points is converged almost as much as possible in the image, and out of focus if light is not well converged. The border between these is sometimes defined using a " circle of confusion" criterion. A principal focus or focal point is a special focus: * For a lens, or a spherical or parabolic mirror, it is a ...
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Absorption (electromagnetic Radiation)
In physics, absorption of electromagnetic radiation is how matter (typically electrons bound in atoms) takes up a photon's energy — and so transforms electromagnetic energy into internal energy of the absorber (for example, thermal energy). A notable effect is attenuation, or the gradual reduction of the intensity of light waves as they propagate through a medium. Although the absorption of waves does not usually depend on their intensity (linear absorption), in certain conditions (optics) the medium's transparency changes by a factor that varies as a function of wave intensity, and saturable absorption (or nonlinear absorption) occurs. Quantifying absorption Many approaches can potentially quantify radiation absorption, with key examples following. * The absorption coefficient along with some closely related derived quantities * The attenuation coefficient (NB used infrequently with meaning synonymous with "absorption coefficient") * The Molar attenuation coefficien ...
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Electronvolt
In physics, an electronvolt (symbol eV, also written electron-volt and electron volt) is the measure of an amount of kinetic energy gained by a single electron accelerating from rest through an electric potential difference of one volt in vacuum. When used as a unit of energy, the numerical value of 1 eV in joules (symbol J) is equivalent to the numerical value of the charge of an electron in coulombs (symbol C). Under the 2019 redefinition of the SI base units, this sets 1 eV equal to the exact value Historically, the electronvolt was devised as a standard unit of measure through its usefulness in electrostatic particle accelerator sciences, because a particle with electric charge ''q'' gains an energy after passing through a voltage of ''V.'' Since ''q'' must be an integer multiple of the elementary charge ''e'' for any isolated particle, the gained energy in units of electronvolts conveniently equals that integer times the voltage. It is a common unit of energy with ...
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Band Gap
In solid-state physics, a band gap, also called an energy gap, is an energy range in a solid where no electronic states can exist. In graphs of the electronic band structure of solids, the band gap generally refers to the energy difference (in electron volts) between the top of the valence band and the bottom of the conduction band in insulators and semiconductors. It is the energy required to promote a valence electron bound to an atom to become a conduction electron, which is free to move within the crystal lattice and serve as a charge carrier to conduct electric current. It is closely related to the HOMO/LUMO gap in chemistry. If the valence band is completely full and the conduction band is completely empty, then electrons cannot move within the solid because there are no available states. If the electrons are not free to move within the crystal lattice, then there is no generated current due to no net charge carrier mobility. However, if some electrons transfer fr ...
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YAG Laser
YAG laser may refer to two types of lasers that use yttrium aluminum garnet (YAG): * Nd:YAG laser (doped with neodymium) * Er:YAG laser (doped with erbium Erbium is a chemical element with the symbol Er and atomic number 68. A silvery-white solid metal when artificially isolated, natural erbium is always found in chemical combination with other elements. It is a lanthanide, a rare-earth element, ...
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Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit. History In the semiconductor or silicon wafer industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. Round shape comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. By 1960, silicon wafers were being manufactured in the U. ...
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Stealth Diced Si Wafer 150µm 430x400 MB11
Stealth may refer to: Military *Stealth technology, technology used to conceal ships, aircraft, and missiles **Stealth aircraft, aircraft which use stealth technology ** Stealth ground vehicle, ground vehicles which use stealth technology ** Stealth patrol unit, used by police forces in the United States and Canada **Stealth ship, ships which use stealth technology Media Books * ''Stealth'' magazine, an independent hip-hop magazine from Australia Film and Television * ''Stealth'' (film), a 2005 action/adventure thriller *'' The Stealth'', a 2008 3D-animated short film *" Stealth (The Americans)", episode of ''The Americans'' Music * ''Stealth'' (album), a 2007 release by the band Scorn *Stealth Records, an independent record label specializing in electronic dance music *"Stealth", a song by Way Out West from ''Intensify'' *Stealth, a model of B.C. Rich guitar Video games *Stealth game, a genre of video games * ''Stealth'' (1984 video game), a rail shooter game published by Br ...
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