Tin-silver-copper
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Tin-silver-copper
Tin-silver-copper ( Sn- Ag- Cu, also known as SAC), is a lead-free ( Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry,Peter BioccaLead-free SMT Soldering Defects: How to Prevent Them mirrorLead-Free Defects in Reflow Soldering – How to Prevent Them emsnow, Feb 17, 2005 as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe's RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages. Typical alloys are 3–4% silver, 0.5–0.7% copper, and the balance (95%+) tin. For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some appl ...
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Soldering
Soldering (; ) is a process in which two or more items are joined by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Origins There is evidence that soldering was employed as early as 5,000 years ago in Mesopotamia. Soldering and brazing are thought to have originated very early in the history of metal-working, probably before 4000 BC. Sumerian swords from were assembled using hard soldering. Soldering was historically used to make jewelry, cookware and cooking tools, assembling stained glass, as well as other uses. ...
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Solder
Solder (; NA: ) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and co ...
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Silver
Silver is a chemical element with the Symbol (chemistry), symbol Ag (from the Latin ', derived from the Proto-Indo-European wikt:Reconstruction:Proto-Indo-European/h₂erǵ-, ''h₂erǵ'': "shiny" or "white") and atomic number 47. A soft, white, lustrous transition metal, it exhibits the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. The metal is found in the Earth's crust in the pure, free elemental form ("native silver"), as an alloy with gold and other metals, and in minerals such as argentite and chlorargyrite. Most silver is produced as a byproduct of copper, gold, lead, and zinc Refining (metallurgy), refining. Silver has long been valued as a precious metal. Silver metal is used in many bullion coins, sometimes bimetallism, alongside gold: while it is more abundant than gold, it is much less abundant as a native metal. Its purity is typically measured on a per-mille basis; a 94%-pure alloy is described as "0.940 fine". As one of th ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ...
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Tin Alloys
This is a list of named alloys grouped alphabetically by base metal. Within these headings, the alloys are also grouped alphabetically. Some of the main alloying elements are optionally listed after the alloy names. Alloys by base metal Aluminium * AA-8000: used for electrical building wire in the U.S. per the National Electrical Code, replacing AA-1350. * Al–Li (2.45% lithium): aerospace applications, including the Space Shuttle * Alnico (nickel, cobalt): used for permanent magnets * Aluminium–Scandium (scandium) * Birmabright (magnesium, manganese): used in car bodies, mainly used by Land Rover cars. * Duralumin (copper) * Hiduminium or R.R. alloys (2% copper, iron, nickel): used in aircraft pistons * Hydronalium (up to 12% magnesium, 1% manganese): used in shipbuilding, resists seawater corrosion * Italma (3.5% magnesium, 0.3% manganese): formerly used to make coinage of the Italian lira * Magnalium (5-50% magnesium): used in airplane bodies, ladders, pyrotechnics, etc ...
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Thermal Cycling
Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Several methods are commonly used – these are distinguished from one another by the property which is measured: * Dielectric thermal analysis: dielectric permittivity and loss factor * Differential thermal analysis: temperature difference versus temperature or time * Differential scanning calorimetry: heat flow changes versus temperature or time * Dilatometry: volume changes with temperature change * Dynamic mechanical analysis: measures storage modulus (stiffness) and loss modulus (damping) versus temperature, time and frequency * Evolved gas analysis: analysis of gases evolved during heating of a material, usually decomposition products * Isothermal titration calorimetry * Isothermal microcalorimetry * Laser flash analysis: thermal diffusivity and thermal conductivity * Thermogravimetric analysis: mass change versus temperature or time * Thermomec ...
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Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ...
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Intermetallics
An intermetallic (also called an intermetallic compound, intermetallic alloy, ordered intermetallic alloy, and a long-range-ordered alloy) is a type of metallic alloy that forms an ordered solid-state compound between two or more metallic elements. Intermetallics are generally hard and brittle, with good high-temperature mechanical properties. They can be classified as stoichiometric or nonstoichiometic intermetallic compounds. Although the term "intermetallic compounds", as it applies to solid phases, has been in use for many years, its introduction was regretted, for example by Hume-Rothery in 1955. Definitions Research definition Schulze in 1967 defined intermetallic compounds as ''solid phases containing two or more metallic elements, with optionally one or more non-metallic elements, whose crystal structure differs from that of the other constituents''. Under this definition, the following are included: #Electron (or Hume-Rothery) compounds #Size packing phases. e.g. Lav ...
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Opto-electronics
Optoelectronics (or optronics) is the study and application of electronics, electronic devices and systems that find, detect and control light, usually considered a sub-field of photonics. In this context, ''light'' often includes invisible forms of radiation such as gamma rays, X-rays, ultraviolet and infrared, in addition to visible light. Optoelectronic devices are electrical-to-optical or optical-to-electrical transducers, or instruments that use such devices in their operation. ''Electro-optics'' is often erroneously used as a synonym, but is a wider branch of physics that concerns all interactions between light and electric fields, whether or not they form part of an electronic device. Optoelectronics is based on the quantum mechanics, quantum mechanical effects of light on electronic materials, especially semiconductors, sometimes in the presence of electric fields. * Photoelectric or photovoltaic effect, used in: ** photodiodes (including solar cells) ** phototransistor ...
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Electrical Connector
Components of an electrical circuit are electrically connected if an electric current can run between them through an electrical conductor. An electrical connector is an electromechanical device used to create an electrical connection between parts of an electrical circuit, or between different electrical circuits, thereby joining them into a larger circuit. Most electrical connectors have a genderi.e. the male component, called a ''plug'', connects to the female component, or ''socket''. The connection may be removable (as for portable equipment), require a tool for assembly and removal, or serve as a permanent electrical joint between two points. An adapter can be used to join dissimilar connectors. Thousands of configurations of connectors are manufactured for power, data, and audiovisual applications. Electrical connectors can be divided into four basic categories, differentiated by their function: * ''inline'' or ''cable'' connectors permanently attached to a cable, so it ...
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Electrolytic Capacitors
An electrolytic capacitor is a polarized capacitor whose anode or positive plate is made of a metal that forms an insulating oxide layer through anodization. This oxide layer acts as the dielectric of the capacitor. A solid, liquid, or gel electrolyte covers the surface of this oxide layer, serving as the cathode or negative plate of the capacitor. Due to their very thin dielectric oxide layer and enlarged anode surface, electrolytic capacitors have a much higher capacitance-voltage (CV) product per unit volume than ceramic capacitors or film capacitors, and so can have large capacitance values. There are three families of electrolytic capacitor: aluminum electrolytic capacitors, tantalum electrolytic capacitors, and niobium electrolytic capacitors. The large capacitance of electrolytic capacitors makes them particularly suitable for passing or bypassing low-frequency signals, and for storing large amounts of energy. They are widely used for decoupling or noise filtering i ...
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Capillary Action
Capillary action (sometimes called capillarity, capillary motion, capillary rise, capillary effect, or wicking) is the process of a liquid flowing in a narrow space without the assistance of, or even in opposition to, any external forces like gravity. The effect can be seen in the drawing up of liquids between the hairs of a paint-brush, in a thin tube, in porous materials such as paper and plaster, in some non-porous materials such as sand and liquefied carbon fiber, or in a biological cell. It occurs because of intermolecular forces between the liquid and surrounding solid surfaces. If the diameter of the tube is sufficiently small, then the combination of surface tension (which is caused by cohesion within the liquid) and adhesive forces between the liquid and container wall act to propel the liquid. Etymology Capillary comes from the Latin word capillaris, meaning "of or resembling hair." The meaning stems from the tiny, hairlike diameter of a capillary. While capilla ...
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