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Thermocompression Bonding
Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold-Gold, gold (Au), are brought into atomic contact applying force and heat simultaneously. The diffusion requires atomic contact between the surface physics, surfaces due to the atomic Motion (physics), motion. The atoms migrate from one crystal lattice to the other one based on Wavelength#Crystals, crystal lattice vibration. This atomic interaction sticks the Interface (chemistry), interface together. The diffusion process is described by the following three processes: * surface diffusion * grain boundary diffusion * bulk diffusion This method enables internal structure protecting device packages and direct electrical interconnect structures without additional steps beside the surface mounting process. Overview The most established materials for Vapor-compression evaporation#Thermocompr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Bonding
Wafer bonding is a packaging technology on Wafer (electronics), wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. Overview In microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), the package protects the sensitive internal structures from environmental influences such as temperature, moisture, high pressure and oxidizing species. The long-term stability and reliability of the functional elements depend on the encapsulation process, as does the overall device cost. The package has to fulfil ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Oxide
An oxide () is a chemical compound that contains at least one oxygen atom and one other element in its chemical formula. "Oxide" itself is the dianion of oxygen, an O2– (molecular) ion. with oxygen in the oxidation state of −2. Most of the Earth's crust consists of oxides. Even materials considered pure elements often develop an oxide coating. For example, aluminium foil develops a thin skin of Al2O3 (called a passivation layer) that protects the foil from further corrosion.Greenwood, N. N.; & Earnshaw, A. (1997). Chemistry of the Elements (2nd Edn.), Oxford:Butterworth-Heinemann. . Stoichiometry (the measurable relationship between reactants and chemical equations of a equation or reaction) Oxides are extraordinarily diverse in terms of stoichiometries and in terms of the structures of each stoichiometry. Most elements form oxides of more than one stoichiometry. A well known example is carbon monoxide and carbon dioxide.Greenwood, N. N.; & Earnshaw, A. (1997). Chemistry ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Evaporation
Evaporation is a type of vaporization that occurs on the surface of a liquid as it changes into the gas phase. High concentration of the evaporating substance in the surrounding gas significantly slows down evaporation, such as when humidity affects rate of evaporation of water. When the molecules of the liquid collide, they transfer energy to each other based on how they collide. When a molecule near the surface absorbs enough energy to overcome the vapor pressure, it will escape and enter the surrounding air as a gas. When evaporation occurs, the energy removed from the vaporized liquid will reduce the temperature of the liquid, resulting in evaporative cooling. On average, only a fraction of the molecules in a liquid have enough heat energy to escape from the liquid. The evaporation will continue until an equilibrium is reached when the evaporation of the liquid is equal to its condensation. In an enclosed environment, a liquid will evaporate until the surrounding air is ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plasma (physics)
Plasma () 1, where \nu_ is the electron gyrofrequency and \nu_ is the electron collision rate. It is often the case that the electrons are magnetized while the ions are not. Magnetized plasmas are ''anisotropic'', meaning that their properties in the direction parallel to the magnetic field are different from those perpendicular to it. While electric fields in plasmas are usually small due to the plasma high conductivity, the electric field associated with a plasma moving with velocity \mathbf in the magnetic field \mathbf is given by the usual Lorentz force, Lorentz formula \mathbf = -\mathbf\times\mathbf, and is not affected by Debye shielding. Mathematical descriptions To completely describe the state of a plasma, all of the particle locations and velocities that describe the electromagnetic field in the plasma region would need to be written down. However, it is generally not practical or necessary to keep track of all the particles in a plasma. Therefore, plasma physicist ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Cavitation
Cavitation is a phenomenon in which the static pressure of a liquid reduces to below the liquid's vapour pressure, leading to the formation of small vapor-filled cavities in the liquid. When subjected to higher pressure, these cavities, called "bubbles" or "voids", collapse and can generate shock waves that may damage machinery. These shock waves are strong when they are very close to the imploded bubble, but rapidly weaken as they propagate away from the implosion. Cavitation is a significant cause of wear in some engineering contexts. Collapsing voids that implode near to a metal surface cause cyclic stress through repeated implosion. This results in surface fatigue of the metal causing a type of wear also called "cavitation". The most common examples of this kind of wear are to pump impellers, and bends where a sudden change in the direction of liquid occurs. Cavitation is usually divided into two classes of behavior: inertial (or transient) cavitation and non-inertial c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chemical-mechanical Planarization
Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Description The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the wafer for the formation of additional circuit elements. For example, CMP can bring the entire surface within the depth of field of a photolithography system, or selectively remove material based on its position. Typical depth-o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Passivation (chemistry)
Passivation, in physical chemistry and engineering, refers to coating a material so it becomes "passive", that is, less readily affected or corroded by the environment. Passivation involves creation of an outer layer of shield material that is applied as a microcoating, created by chemical reaction with the base material, or allowed to build by spontaneous oxidation in the air. As a technique, passivation is the use of a light coat of a protective material, such as metal oxide, to create a shield against corrosion. Passivation of silicon is used during fabrication of microelectronic devices. In electrochemical treatment of water, passivation reduces the effectiveness of the treatment by increasing the circuit resistance, and active measures are typically used to overcome this effect, the most common being polarity reversal, which results in limited rejection of the fouling layer. When exposed to air, many metals naturally form a hard, relatively inert surface layer, usually an ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dry Etching
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically. Applications Dry etching is used in conjunction with photolithographic techniques to attack certain areas of a semiconductor surface in order to form recesses in material. Applications include contact holes (which are contacts to the underlying semiconductor substrate), via holes (which are holes that are formed to provide an interconnect path between conductive layers in th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Etching (microfabrication)
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride. Orientation-Dependent Etching * KOH pellets dissolved in water (self-heating) * Etch Rate > >> ** KOH has a slower etching orientation for the planes ** You cannot use this KOH photoresist as a etching mask, because the oxide attacks too slowly, so this resist will not survive * Photoresist can be used a etching mask, and the best photoresist for etching is nitride * For example, the etch rate of Si in KOH Depends on Crystallographic Plane * At low temperatur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Impurity
In chemistry and materials science, impurities are chemical substances inside a confined amount of liquid, gas, or solid, which differ from the chemical composition of the material or compound. Firstly, a pure chemical should appear thermodynamically in at least one chemical phase and can also be characterized by its one-component-phase diagram. Secondly, practically speaking, a pure chemical should prove to be homogeneous (i.e., will show no change of properties after undergoing a wide variety of consecutive analytical chemical procedures). The perfect pure chemical will pass all attempts and tests of further separation and purification. Thirdly, and here we focus on the common chemical definition, it should not contain any trace of any other kind of chemical species. In reality, there are no absolutely 100% pure chemical compounds, as there is always some minute contamination. Indeed, as detection limits in analytical chemistry decrease, the number of impurities detected tend ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Oxidation
Redox (reduction–oxidation, , ) is a type of chemical reaction in which the oxidation states of substrate change. Oxidation is the loss of electrons or an increase in the oxidation state, while reduction is the gain of electrons or a decrease in the oxidation state. There are two classes of redox reactions: * ''Electron-transfer'' – Only one (usually) electron flows from the reducing agent to the oxidant. This type of redox reaction is often discussed in terms of redox couples and electrode potentials. * ''Atom transfer'' – An atom transfers from one substrate to another. For example, in the rusting of iron, the oxidation state of iron atoms increases as the iron converts to an oxide, and simultaneously the oxidation state of oxygen decreases as it accepts electrons released by the iron. Although oxidation reactions are commonly associated with the formation of oxides, other chemical species can serve the same function. In hydrogenation, C=C (and other) bonds ar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coefficient Of Thermal Expansion
Thermal expansion is the tendency of matter to change its shape A shape or figure is a graphics, graphical representation of an object or its external boundary, outline, or external Surface (mathematics), surface, as opposed to other properties such as color, Surface texture, texture, or material type. A pl ..., area, volume, and density in response to a change in temperature, usually not including phase transitions. Temperature is a monotonic function of the average molecular kinetic energy of a substance. When a substance is heated, molecules begin to vibrate and move more, usually creating more distance between themselves. Substances which contract with increasing temperature are unusual, and only occur within limited temperature ranges (see examples below). The relative expansion (also called strain (mechanics), strain) divided by the change in temperature is called the material's coefficient of linear thermal expansion and generally varies with temperature. As energy ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
