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Socket FS1b
Socket FS1b (rebranded as Socket AM1 ) is a socket designed by AMD, launched in April 2014 for desktop SoCs in the value segment. Socket AM1 is intended for a class of CPUs that contain both an integrated GPU and a chipset, essentially forming a complete SoC implementation, and as such has pins for display, PCI Express, SATA, and other I/O interfaces directly in the socket. AMD's first compatible CPUs, designated as APUs, are 4 socketable chips in the ''Kabini'' family of the Jaguar microarchitecture, marketed under the Athlon and Sempron names and announced on April 9, 2014. The brand names are Athlon and Sempron. The underlying microarchitectures are Jaguar and Puma. All products are SoCs, this means the Chipset is on the die of the APU and not on the motherboard. While the AMD mobile CPUs are available in a 722-pin package Socket FS1, it is not clear whether these notebook CPUs are compatible with Socket AM1 or vice versa. Its mobile counterpart is Socket FT3 (BGA-76 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). PGA variants Plastic Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA. Flip chip A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of AMD Chipsets
This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition. North- and Southbridges Northbridges AMD-xxx A-Link Express II A-Link Express and A-Link Express II are essentially PCIe 1.1 x4 lanes. See Comparison of ATI Chipsets for the comparison of chipsets sold under the ATI brand for AMD processors, before AMD's acquisition of ATI. A-Link Express III A-Link Express III is essentially PCIe 2.0 x4 lanes. Southbridges AMD-xxx 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. A-Link Express * All models support eSATA implementations of available SATA channels. 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. Fusion controller hubs (FCH) For AMD APU models from 2011 until 2016. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Memory Controller
The memory controller is a digital circuit that manages the flow of data going to and from the computer's main memory. A memory controller can be a separate chip or integrated into another chip, such as being placed on the same die or as an integral part of a microprocessor; in the latter case, it is usually called an integrated memory controller (IMC). A memory controller is sometimes also called a memory chip controller (MCC) or a memory controller unit (MCU). A common form of memory controller is the memory management unit (MMU) which in many operating systems implements virtual addressing. History Most modern desktop or workstation microprocessors use an ''integrated memory controller'' (IMC), including microprocessors from Intel, AMD, and those built around the ARM architecture. Prior to K8 (circa 2003), AMD microprocessors had a memory controller implemented on their motherboard's northbridge. In K8 and later, AMD employed an integrated memory controller. Likewis ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit (MMU) w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobile phones, personal computers, workstations, and game consoles. Modern GPUs are efficient at manipulating computer graphics and image processing. Their parallel structure makes them more efficient than general-purpose central processing units (CPUs) for algorithms that process large blocks of data in parallel. In a personal computer, a GPU can be present on a video card or embedded on the motherboard. In some CPUs, they are embedded on the CPU die. In the 1970s, the term "GPU" originally stood for ''graphics processor unit'' and described a programmable processing unit independently working from the CPU and responsible for graphics manipulation and output. Later, in 1994, Sony used the term (now standing for ''graphics processing unit'' ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hertz
The hertz (symbol: Hz) is the unit of frequency in the International System of Units (SI), equivalent to one event (or cycle) per second. The hertz is an SI derived unit whose expression in terms of SI base units is s−1, meaning that one hertz is the reciprocal of one second. It is named after Heinrich Rudolf Hertz (1857–1894), the first person to provide conclusive proof of the existence of electromagnetic waves. Hertz are commonly expressed in multiples: kilohertz (kHz), megahertz (MHz), gigahertz (GHz), terahertz (THz). Some of the unit's most common uses are in the description of periodic waveforms and musical tones, particularly those used in radio- and audio-related applications. It is also used to describe the clock speeds at which computers and other electronics are driven. The units are sometimes also used as a representation of the energy of a photon, via the Planck relation ''E'' = ''hν'', where ''E'' is the photon's energy, ''ν'' is its freq ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Clock Rate
In computing, the clock rate or clock speed typically refers to the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components, and is used as an indicator of the processor's speed. It is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers (PCs) to arrive throughout the 1970s and 1980s had clock rates measured in megahertz (MHz), and in the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz). This metric is most useful when comparing processors within the same family, holding constant other features that may affect performance. Determining factors Binning Manufacturers of modern processors typically charge premium prices for processors that operate at higher clock rates, a practice called binning. For a given CPU, the clock rates are determined at th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thread (computing)
In computer science, a thread of execution is the smallest sequence of programmed instructions that can be managed independently by a scheduler, which is typically a part of the operating system. The implementation of threads and processes differs between operating systems. In Modern Operating Systems, Tanenbaum shows that many distinct models of process organization are possible.TANENBAUM, Andrew S. Modern Operating Systems. 1992. Prentice-Hall International Editions, ISBN 0-13-595752-4. In many cases, a thread is a component of a process. The multiple threads of a given process may be executed concurrently (via multithreading capabilities), sharing resources such as memory, while different processes do not share these resources. In particular, the threads of a process share its executable code and the values of its dynamically allocated variables and non- thread-local global variables at any given time. History Threads made an early appearance under the name of "tasks ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-core Processor
A multi-core processor is a microprocessor on a single integrated circuit with two or more separate processing units, called cores, each of which reads and executes program instructions. The instructions are ordinary CPU instructions (such as add, move data, and branch) but the single processor can run instructions on separate cores at the same time, increasing overall speed for programs that support multithreading or other parallel computing techniques. Manufacturers typically integrate the cores onto a single integrated circuit die (known as a chip multiprocessor or CMP) or onto multiple dies in a single chip package. The microprocessors currently used in almost all personal computers are multi-core. A multi-core processor implements multiprocessing in a single physical package. Designers may couple cores in a multi-core device tightly or loosely. For example, cores may or may not share caches, and they may implement message passing or shared-memory inter-core communica ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coreboot
coreboot, formerly known as LinuxBIOS, is a software project aimed at replacing proprietary firmware (BIOS or UEFI) found in most computers with a lightweight firmware designed to perform only the minimum number of tasks necessary to load and run a modern 32-bit or 64-bit operating system. Since coreboot initializes the bare hardware, it must be ported to every chipset and motherboard that it supports. As a result, coreboot is available only for a limited number of hardware platforms and motherboard models. One of the coreboot variants is Libreboot, a software distribution fully free of proprietary blobs, aimed at end users. History The coreboot project began in the winter of 1999 in the Advanced Computing Laboratory at Los Alamos National Laboratory (LANL), with the goal of creating a BIOS that would start fast and handle errors intelligently. It is licensed under the terms of the GNU General Public License version 2 (GPLv2). Main contributors include LANL, SiS, AMD, Core ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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