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Reflow
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inse ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reflow Oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door. Commercial conveyorised reflow ovens contain multiple individually heated zones, which can be individually controlled for temperature. PCBs being processed travel through the oven and through each zone at a controlled rate. Technicians adjust the conveyor speed and zone temperatures to achieve a known time and temperature profile. The profile in use may vary depending on the requirements of the PCBs being processed at the time. Types of reflow ovens Infrared and convection ovens In infrared reflow ovens, the heat source is normally ceramic infrared heaters above and below the conveyor, which transfer heat to the PCBs by means of radiation ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reflow Oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door. Commercial conveyorised reflow ovens contain multiple individually heated zones, which can be individually controlled for temperature. PCBs being processed travel through the oven and through each zone at a controlled rate. Technicians adjust the conveyor speed and zone temperatures to achieve a known time and temperature profile. The profile in use may vary depending on the requirements of the PCBs being processed at the time. Types of reflow ovens Infrared and convection ovens In infrared reflow ovens, the heat source is normally ceramic infrared heaters above and below the conveyor, which transfer heat to the PCBs by means of radiation ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder Paste
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand. Use A majority of the defects in circuit-board assembly are caused due to issues in the solder-paste printing process or due to defects in the solder paste. There are many different types of defects possible, e.g. too much solder, or the solder melts and connects too many wires (bridging), resulting in a short circuit. Insufficient amounts of paste result in incomplete circuits. Head-in-pillow defects, or incomplete coalesc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tin-silver-copper
Tin-silver-copper ( Sn- Ag- Cu, also known as SAC), is a lead-free ( Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry,Peter BioccaLead-free SMT Soldering Defects: How to Prevent Them mirrorLead-Free Defects in Reflow Soldering – How to Prevent Them emsnow, Feb 17, 2005 as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe's RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages. Typical alloys are 3–4% silver, 0.5–0.7% copper, and the balance (95%+) tin. For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some appl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Profiling
A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile can be ranked on how it fits in a process window (the specification or tolerance limit). Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%. A Process Window Index (PWI) greater than or equal to 100% indicates the profile is outside of the process limitations. A PWI of 99% indicates that the profile is within process limitations, but runs at the edge of the process window. For example, if the process mean is set at 200 °C with the process window calibrated at 180 °C and 220 °C respectively, then ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wave Soldering
Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components. As through-hole components have been largely replaced by surface mount components, wave soldering has been supplanted by reflow soldering methods in many large-scale electronics applications. However, there is still significant wave soldering where surface-mount technology (SMT) is not suitable (e.g., large power devices and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface Mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Example Thermal Profiler
Example may refer to: * '' exempli gratia'' (e.g.), usually read out in English as "for example" * .example, reserved as a domain name that may not be installed as a top-level domain of the Internet ** example.com, example.net, example.org, example.edu, second-level domain names reserved for use in documentation as examples * HMS ''Example'' (P165), an Archer-class patrol and training vessel of the Royal Navy Arts * ''The Example'', a 1634 play by James Shirley * ''The Example'' (comics), a 2009 graphic novel by Tom Taylor and Colin Wilson * Example (musician), the British dance musician Elliot John Gleave (born 1982) * ''Example'' (album), a 1995 album by American rock band For Squirrels See also * * Exemplar (other), a prototype or model which others can use to understand a topic better * Exemplum, medieval collections of short stories to be told in sermons * Eixample The Eixample (; ) is a district of Barcelona between the old city (Ciutat Vella) and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wetting
Wetting is the ability of a liquid to maintain contact with a solid surface, resulting from intermolecular interactions when the two are brought together. This happens in presence of a gaseous phase or another liquid phase not miscible with the first one. The degree of wetting (wettability) is determined by a force balance between adhesive and cohesive forces. Wetting is important in the bonding or adherence of two materials. Wetting and the surface forces that control wetting are also responsible for other related effects, including capillary effects. There are two types of wetting: non-reactive wetting and reactive wetting. Wetting deals with three phases of matter: gas, liquid, and solid. It is now a center of attention in nanotechnology and nanoscience studies due to the advent of many nanomaterials in the past two decades (e.g. graphene, Carbon nano tube, carbon nanotube, boron nitride nanomesh). Explanation Adhesive forces between a liquid and solid cause a liquid ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Shock
Thermal shock is a type of rapidly transient mechanical load. By definition, it is a mechanical load caused by a rapid change of temperature of a certain point. It can be also extended to the case of a thermal gradient, which makes different parts of an object expand by different amounts. This differential expansion can be more directly understood in terms of strain, than in terms of stress, as it is shown in the following. At some point, this stress can exceed the tensile strength of the material, causing a crack to form. If nothing stops this crack from propagating through the material, it will cause the object's structure to fail. Failure due to thermal shock can be prevented by: # Reducing the thermal gradient seen by the object, by changing its temperature more slowly or increasing the material's thermal conductivity # Reducing the material's coefficient of thermal expansion # Increasing its strength # Introducing built-in compressive stress, as for example in tempered ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
