Nanochannel Glass Materials
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Nanochannel Glass Materials
Nanochannel glass materials are an experimental mask technology that is an alternate method for fabricating nanostructures, although optical lithography is the predominant patterning technique. * Proceedings of the NATO Advanced Research Workshop, Cambridge, U.K., April 1--3, 1994 Series: NATO Science Series E: (closed), Vol. 292 Nanochannel glass materials are complex glass structures containing large numbers of parallel hollow channels. In its simplest form, the hollow channels are arranged in geometric arrays with packing densities as great as 1011 channels/cm2. Channel dimensions are controllable from micrometers to tens of nanometers, while retaining excellent channel uniformity. Exact replicas of the channel glass can be made from a variety of materials. This is a low cost method for creating identical structures with nanoscale features in large numbers. Characteristics These materials have high density of uniform channels with diameters from 15 micrometres to 15 nanomet ...
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TTO Nanochannel Glass Materials
TTO may refer to: *Time-trade-off *Trinidad and Tobago, by ISO 3166-1 alpha-3 and IOC codes *Tactical Technology Office, a division of DARPA *Technology Transfer Office *''Toontown Online'', massively multiplayer online role-playing game by Disney *Transtrachreal oxygen, as used during Jet ventilation *Trailing throttle oversteer, also known as lift-off oversteer *Twist-to-open razor, a type of safety razor (see mention under Gillette (brand)) *Triple tibial osteotomy The triple tibial osteotomy is a surgical procedure used to treat dogs that have completely or partially ruptured the cranial cruciate ligament in one or both of their stifles. The cranial cruciate ligament connects the femur with the tibia, which ...
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E-beam Lithography
Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development. Systems Electron-beam lithography systems used in commercial applications ...
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Glass
Glass is a non-crystalline, often transparent, amorphous solid that has widespread practical, technological, and decorative use in, for example, window panes, tableware, and optics. Glass is most often formed by rapid cooling (quenching) of the molten form; some glasses such as volcanic glass are naturally occurring. The most familiar, and historically the oldest, types of manufactured glass are "silicate glasses" based on the chemical compound silica (silicon dioxide, or quartz), the primary constituent of sand. Soda–lime glass, containing around 70% silica, accounts for around 90% of manufactured glass. The term ''glass'', in popular usage, is often used to refer only to this type of material, although silica-free glasses often have desirable properties for applications in modern communications technology. Some objects, such as drinking glasses and eyeglasses, are so commonly made of silicate-based glass that they are simply called by the name of the material. Despite bei ...
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Porous Glass
Porous glass is glass that includes pores, usually in the nanometre- or micrometre-range, commonly prepared by one of the following processes: through metastable phase separation in borosilicate glasses (such as in their system SiO2-B2O3-Na2O), followed by liquid extraction of one of the formed phases; through the sol-gel process; or simply by sintering glass powder. The specific properties and commercial availability of porous glass make it one of the most extensively researched and characterized amorphous solids. Due to the possibility of modeling the microstructure, porous glasses have a high potential as a model system. They show a high chemical, thermal and mechanical resistance, which results from a rigid and incompressible silica network. They can be produced in high quality and with pore sizes ranging from 1 nm up to any desired value. An easy functionalization of the inner surface opens a wide field of applications for porous glasses. A further special advantage of p ...
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Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature si ...
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Nanolithography
Nanolithography (NL) is a growing field of techniques within nanotechnology dealing with the engineering (patterning e.g. etching, depositing, writing, printing etc) of nanometer-scale structures on various materials. The modern term reflects on a design of structures built in range of 10−9 to 10−6 meters, i.e. nanometer scale. Essentially, the field is a derivative of lithography, only covering very small structures. All NL methods can be categorized into four groups: photo lithography, scanning lithography, soft lithography and other miscellaneous techniques. History The NL has evolved from the need to increase the number of sub-micrometer features (e.g. transistors, capacitors etc.) in an integrated circuit in order to keep up with Moore's Law. While lithographic techniques have been around since the late 18th century, none were applied to nanoscale structures until the mid-1950s. With evolution of the semiconductor industry, demand for techniques capable of producing ...
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Maskless Lithography
Maskless lithography (MPL) is a photomask-less photolithography-like technology used to project or focal-spot write the image pattern onto a chemical resist-coated substrate (e.g. wafer) by means of UV radiation or electron beam. In microlithography, typically UV radiation casts an image of a time constant mask onto a photosensitive emulsion (or photoresist). Traditionally, mask aligners, steppers, scanners, and other kinds of non-optical techniques are used for high speed microfabrication of microstructures, but in case of MPL, some of these become redundant. Maskless lithography has two approaches to project a pattern: rasterized and vectorized. In the first one it utilizes generation of a time-variant intermittent image on an electronically modifiable (virtual) mask that is projected with known means (also known as Laser Direct Imaging and other synonyms). In the vectored approach, direct writing is achieved by radiation that is focused to a narrow beam that is scanned in vect ...
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Ion Beam Lithography
Ion-beam lithography is the practice of scanning a focused beam of ions in a patterned fashion across a surface in order to create very small structures such as integrated circuits or other nanostructures. Details Ion-beam lithography has been found to be useful for transferring high-fidelity patterns on three-dimensional surfaces. Ion-beam lithography offers higher resolution patterning than UV, X-ray, or electron beam lithography because these heavier particles have more momentum. This gives the ion beam a smaller wavelength than even an e-beam and therefore almost no diffraction. The momentum also reduces scattering in the target and in any residual gas. There is also a reduced potential radiation effect to sensitive underlying structures compared to x-ray and e-beam lithography. Ion-beam lithography, or ion-projection lithography, is similar to Electron beam lithography, but uses much heavier charged particles, ions. In addition to diffraction being negligible, ions move ...
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Scintillator
A scintillator is a material that exhibits scintillation, the property of luminescence, when excited by ionizing radiation. Luminescent materials, when struck by an incoming particle, absorb its energy and scintillate (i.e. re-emit the absorbed energy in the form of light). Sometimes, the excited state is metastable, so the relaxation back down from the excited state to lower states is delayed (necessitating anywhere from a few nanoseconds to hours depending on the material). The process then corresponds to one of two phenomena: delayed fluorescence or phosphorescence. The correspondence depends on the type of transition and hence the wavelength of the emitted optical photon. Principle of operation A scintillation detector or scintillation counter is obtained when a scintillator is coupled to an electronic light sensor such as a photomultiplier tube (PMT), photodiode, or silicon photomultiplier. PMTs absorb the light emitted by the scintillator and re-emit it in the form of ele ...
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Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography and the production of integrated circuits (ICs or "chips") in particular. Masks are used to produce a pattern on a substrate, normally a thin slice of silicon known as a wafer in the case of chip manufacturing. Several masks are used in turn, each one reproducing a layer of the completed design, and together they are known as a mask set. Previously, photomasks used to be produced manually by using rubylith and mylar. As complexity continued to grow, manual processing of any sort became difficult. This was solved with the introduction of the optical pattern generator which automated the process of producing the initial large-scale pattern, and the step-and-repeat cameras that automated the copying of the pattern into a multiple-IC mask. The intermediate masks are known as reticles, and were initially copied to production mas ...
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