Motorola 68EC020
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Motorola 68EC020
The Motorola 68020 ("''sixty-eight-oh-twenty''", "''sixty-eight-oh-two-oh''" or "''six-eight-oh-two-oh''") is a 32-bit microprocessor from Motorola, released in 1984. A lower-cost version was also made available, known as the 68EC020. In keeping with naming practices common to Motorola designs, the 68020 is usually referred to as the "020", pronounced "oh-two-oh" or "oh-twenty". The 020 was in the market for a relatively short time. The Motorola 68030 was announced in September 1986 and began deliveries in the summer of 1987. Priced about the same as the 020 of the time, the 030 was significantly faster and quickly replaced in 020 in almost every use. History 68000 and 68010 At the time the Motorola 68000 was designed, Motorola's design and fabrication services were outdated. Although even small companies like MOS Technologies and Zilog had moved on to silicon gate depletion mode NMOS logic on ever-larger wafers, Motorola was still using metal gates and enhancement mode and thei ...
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Motorola 68000 Series
The Motorola 68000 series (also known as 680x0, m68000, m68k, or 68k) is a family of 32-bit complex instruction set computer (CISC) microprocessors. During the 1980s and early 1990s, they were popular in personal computers and workstations and were the primary competitors of Intel's x86 microprocessors. They were best known as the processors used in the early Apple Macintosh, the Sharp X68000, the Commodore Amiga, the Sinclair QL, the Atari ST, the Sega Genesis (Mega Drive), the Capcom System I (Arcade), the AT&T UNIX PC, the Tandy Model 16/16B/6000, the Sun Microsystems Sun-1, Sun-2 and Sun-3, the NeXT Computer, NeXTcube, NeXTstation, and NeXTcube Turbo, the Texas Instruments TI-89/TI-92 calculators, the Palm Pilot (all models running Palm OS 4.x or earlier) and the Space Shuttle. Although no modern desktop computers are based on processors in the 680x0 series, derivative processors are still widely used in embedded systems. Motorola ceased development of the 680x0 series arc ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ...
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Motorola 68881
The Motorola 68881 and Motorola 68882 are floating-point units (FPUs) used in some computer systems in conjunction with Motorola's 32-bit 68020 or 68030 microprocessors. These coprocessors are external chips, designed before floating point math became standard on CPUs. The Motorola 68881 was introduced in 1984. The 68882 is a higher performance version produced later. Overview The 68020 and 68030 CPUs were designed with the separate 68881 chip in mind. Their instruction sets reserved the "F-line" instructions – that is, all opcodes beginning with the hexadecimal digit "F" could either be forwarded to an external coprocessor or be used as "traps" which would throw an exception, handing control to the computer's operating system. If an FPU is not present in the system, the OS would then either call an FPU emulator to execute the instruction's equivalent using 68020 integer-based software code, return an error to the program, terminate the program, or crash and require a reboot ...
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Silicide
A silicide is a type of chemical compound that combines silicon and a (usually) more electropositive element. Silicon is more electropositive than carbon. Silicides are structurally closer to borides than to carbides. Similar to borides and carbides, the composition of silicides cannot be easily specified as covalent molecules. The chemical bonds in silicides range from conductive metal-like structures to covalent or ionic. Silicides of all non-transition metals, with exception of beryllium, have been described. Overview Silicon atoms in silicides can have many possible organizations: *Isolated silicon atoms: electrically conductive (or semiconductive) CrSi, MnSi, FeSi, CoSi, , , , , and nonconductive , *Si2 pairs: , hafnium and thorium silicides *Si4 tetrahedra: KSi, RbSi, CsSi *Si''n'' chains: USi, , CaSi, SrSi, YSi *Planar hexagonal graphite-like Si layers: β-USi2, silicides of other lanthanoids and actinoids *Corrugated hexagonal Si layers: CaSi2 *Open three-dimensio ...
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Research And Development
Research and development (R&D or R+D), known in Europe as research and technological development (RTD), is the set of innovative activities undertaken by corporations or governments in developing new services or products, and improving existing ones. Research and development constitutes the first stage of development of a potential new service or the production process. R&D activities differ from institution to institution, with two primary models of an R&D department either staffed by engineers and tasked with directly developing new products, or staffed with industrial scientists and tasked with applied research in scientific or technological fields, which may facilitate future product development. R&D differs from the vast majority of corporate activities in that it is not intended to yield immediate profit, and generally carries greater risk and an uncertain return on investment. However R&D is crucial for acquiring larger shares of the market through the marketisation ...
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New York Times
''The New York Times'' (''the Times'', ''NYT'', or the Gray Lady) is a daily newspaper based in New York City with a worldwide readership reported in 2020 to comprise a declining 840,000 paid print subscribers, and a growing 6 million paid digital media, digital subscribers. It also is a producer of popular podcasts such as ''The Daily (podcast), The Daily''. Founded in 1851 by Henry Jarvis Raymond and George Jones (publisher), George Jones, it was initially published by Raymond, Jones & Company. The ''Times'' has won List of Pulitzer Prizes awarded to The New York Times, 132 Pulitzer Prizes, the most of any newspaper, and has long been regarded as a national "newspaper of record". For print it is ranked List of newspapers by circulation, 18th in the world by circulation and List of newspapers in the United States, 3rd in the U.S. The paper is owned by the New York Times Company, which is Public company, publicly traded. It has been governed by the Sulzberger family since 189 ...
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CMOS
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", ) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data converters, RF circuits (RF CMOS), and highly integrated transceivers for many types of communication. The CMOS process was originally conceived by Frank Wanlass at Fairchild Semiconductor and presented by Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. commercialized the technology with the trademark "COS-MO ...
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Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). PGA variants Plastic Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA. Flip chip A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows ...
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Random Access Memory
Random-access memory (RAM; ) is a form of computer memory that can be read and changed in any order, typically used to store working Data (computing), data and machine code. A Random access, random-access memory device allows data items to be read (computer), read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks, CD-RWs, DVD-RWs and the older Magnetic tape data storage, magnetic tapes and drum memory), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement. RAM contains multiplexer, multiplexing and demultiplexing circuitry, to connect the data lines to the addressed storage for reading or writing the entry. Usually more than one bit of storage is accessed by the same address, and RAM ...
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Data Bus
In computer architecture, a bus (shortened form of the Latin '' omnibus'', and historically also called data highway or databus) is a communication system that transfers data between components inside a computer, or between computers. This expression covers all related hardware components (wire, optical fiber, etc.) and software, including communication protocols. Early computer buses were parallel electrical wires with multiple hardware connections, but the term is now used for any physical arrangement that provides the same logical function as a parallel electrical busbar. Modern computer buses can use both parallel and bit serial connections, and can be wired in either a multidrop (electrical parallel) or daisy chain topology, or connected by switched hubs, as in the case of Universal Serial Bus (USB). Background and nomenclature Computer systems generally consist of three main parts: * The central processing unit (CPU) that processes data, * The memory that holds the p ...
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Address Bus
In computer architecture, a bus (shortened form of the Latin '' omnibus'', and historically also called data highway or databus) is a communication system that transfers data between components inside a computer, or between computers. This expression covers all related hardware components (wire, optical fiber, etc.) and software, including communication protocols. Early computer buses were parallel electrical wires with multiple hardware connections, but the term is now used for any physical arrangement that provides the same logical function as a parallel electrical busbar. Modern computer buses can use both parallel and bit serial connections, and can be wired in either a multidrop (electrical parallel) or daisy chain topology, or connected by switched hubs, as in the case of Universal Serial Bus (USB). Background and nomenclature Computer systems generally consist of three main parts: * The central processing unit (CPU) that processes data, * The memory that holds the p ...
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Dual Inline Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For ex ...
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