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Micro-PGA1
In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering. Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin grid array, Pin Grid Array (PGA) or Land grid array, Land Grid Array (LGA). These designs apply a compression (physics), compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending Lead (electronics), pins when inserting the chip into the socket. Certain devices use Ball grid array, Ball Grid Array (BGA) sockets, although these require soldering and are generally no ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 775 Socket T
LaGuardia Airport is a civil airport in East Elmhurst, Queens, New York City. Covering , the facility was established in 1929 and began operating as a public airport in 1939. It is named after former New York City mayor Fiorello La Guardia. The airport primarily accommodates airline service to domestic (and limited international) destinations. , it was the third-busiest airport in the New York metropolitan area, behind Kennedy and Newark airports, and the twenty-first busiest in the United States by passenger volume. The airport is located directly to the north of the Grand Central Parkway, the airport’s primary access highway. While the airport is a hub for both American Airlines and Delta Air Lines, commercial service is strictly governed by unique regulations including a curfew, a slot system, and a "perimeter rule" prohibiting most nonstop flights to or from destinations greater than . Throughout the 2000s and 2010s, LaGuardia was notable for having obsolete an ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms ar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
8088
The Intel 8088 ("''eighty-eighty-eight''", also called iAPX 88) microprocessor is a variant of the Intel 8086. Introduced on June 1, 1979, the 8088 has an eight-bit external data bus instead of the 16-bit bus of the 8086. The 16-bit registers and the one megabyte address range are unchanged, however. In fact, according to the Intel documentation, the 8086 and 8088 have the same execution unit (EU)—only the bus interface unit (BIU) is different. The original IBM PC is based on the 8088, as are its clones. History and description The 8088 was designed at Intel's laboratory in Haifa, Israel, as were a large number of Intel's processors. The 8088 was targeted at economical systems by allowing the use of an eight-bit data path and eight-bit support and peripheral chips; complex circuit boards were still fairly cumbersome and expensive when it was released. The prefetch queue of the 8088 was shortened to four bytes, from the 8086's six bytes, and the prefetch algorithm was ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
8086
The 8086 (also called iAPX 86) is a 16-bit microprocessor chip designed by Intel between early 1976 and June 8, 1978, when it was released. The Intel 8088, released July 1, 1979, is a slightly modified chip with an external 8-bit data bus (allowing the use of cheaper and fewer supporting ICs),Fewer TTL buffers, latches, multiplexers (although the amount of TTL logic was not drastically reduced). It also permits the use of cheap 8080-family ICs, where the 8254 CTC, 8255 PIO, and 8259 PIC were used in the IBM PC design. In addition, it makes PCB layout simpler and boards cheaper, as well as demanding fewer (1- or 4-bit wide) DRAM chips. and is notable as the processor used in the original IBM PC design. The 8086 gave rise to the x86 architecture, which eventually became Intel's most successful line of processors. On June 5, 2018, Intel released a limited-edition CPU celebrating the 40th anniversary of the Intel 8086, called the Intel Core i7-8086K. History Background In 1972, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Transfer (computing)
In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that occur in each second in some given data-transfer channel. It is also known as sample rate, i.e. the number of data samples captured per second, each sample normally occurring at the clock edge. The terms are neutral with respect to the method of physically accomplishing each such data-transfer operation; nevertheless, they are most commonly used in the context of transmission of digital data. 1 MT/s is 106 or one million transfers per second; similarly, 1 GT/s means 109, or equivalently in the US/short scale, one billion transfers per second. Units The choice of the symbol ''T'' for ''transfer'' conflicts with the International System of Units, in which ''T'' stands for the tesla unit of magnetic flux density (so "Megatesla p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Clock Rate
In computing, the clock rate or clock speed typically refers to the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components, and is used as an indicator of the processor's speed. It is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers (PCs) to arrive throughout the 1970s and 1980s had clock rates measured in megahertz (MHz), and in the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz). This metric is most useful when comparing processors within the same family, holding constant other features that may affect performance. Determining factors Binning Manufacturers of modern processors typically charge premium prices for processors that operate at higher clock rates, a practice called binning. For a given CPU, the clock rates are determined at the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). PGA variants Plastic Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA. Flip chip A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Signal Integrity
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage (or current) waveform. However, digital signals are fundamentally analog in nature, and all signals are subject to effects such as noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), A survey of the field of electronic design automation. Portions of IC section of this article were derived (with permission) from Vol II, Chapter 21, ''Noi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
_CPU-pins_PNr°0295.jpg "Click for more on -> Pin Grid Array")
