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Lead (electronics)
In electronics, a lead () is an electrical connection consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called ''pins''; in ball grid array packages, they are in form of small spheres, and are therefore called "balls". Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend under th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lead Wires
Lead is a chemical element with the symbol Pb (from the Latin ) and atomic number 82. It is a heavy metal that is denser than most common materials. Lead is soft and malleable, and also has a relatively low melting point. When freshly cut, lead is a shiny gray with a hint of blue. It tarnishes to a dull gray color when exposed to air. Lead has the highest atomic number of any stable element and three of its isotopes are endpoints of major nuclear decay chains of heavier elements. Lead is toxic, even in small amounts, especially to children. Lead is a relatively unreactive post-transition metal. Its weak metallic character is illustrated by its amphoteric nature; lead and lead oxides react with acids and bases, and it tends to form covalent bonds. Compounds of lead are usually found in the +2 oxidation state rather than the +4 state common with lighter members of the carbon group. Exceptions are mostly limited to organolead compounds. Like the lighter members of the group, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CSP(lead-frame) Package Sideview
CSP may refer to: Education * College Student Personnel, an academic discipline * Commonwealth Supported Place, a category in Australian education * Concordia University (Saint Paul, Minnesota), US Organizations * Caledonian Steam Packet Company, Scotland * California Society of Printmakers, US *Cambridge Scholars Publishing, UK * Canadian Ski Patrol * Center for Security Policy, a think tank in Washington, D.C., US * Chartered Society of Physiotherapy, UK * Paulist Fathers or the Congregation of St. Paul Government * California State Police, US * Civil Services of Pakistan * Colorado State Patrol, US * Committee of Public Safety, France (1793-95) * Connecticut State Police, US Political parties * Chicago Socialist Party, US * Christian Social Party (other) * Christian Solidarity Party, Ireland * Christlich Soziale Partei (Belgium) * Congress Socialist Party, India Transportation * Camas Prairie Railroad, Idaho, US * Camas Prairie RailNet, shortline railroad forme ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electrical Resistance
The electrical resistance of an object is a measure of its opposition to the flow of electric current. Its reciprocal quantity is , measuring the ease with which an electric current passes. Electrical resistance shares some conceptual parallels with mechanical friction. The SI unit of electrical resistance is the ohm (), while electrical conductance is measured in siemens (S) (formerly called the 'mho' and then represented by ). The resistance of an object depends in large part on the material it is made of. Objects made of electrical insulators like rubber tend to have very high resistance and low conductance, while objects made of electrical conductors like metals tend to have very low resistance and high conductance. This relationship is quantified by resistivity or conductivity. The nature of a material is not the only factor in resistance and conductance, however; it also depends on the size and shape of an object because these properties are extensive rather than in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Inductance
Inductance is the tendency of an electrical conductor to oppose a change in the electric current flowing through it. The flow of electric current creates a magnetic field around the conductor. The field strength depends on the magnitude of the current, and follows any changes in current. From Faraday's law of induction, any change in magnetic field through a circuit induces an electromotive force (EMF) (voltage) in the conductors, a process known as electromagnetic induction. This induced voltage created by the changing current has the effect of opposing the change in current. This is stated by Lenz's law, and the voltage is called '' back EMF''. Inductance is defined as the ratio of the induced voltage to the rate of change of current causing it. It is a proportionality factor that depends on the geometry of circuit conductors and the magnetic permeability of nearby materials. An electronic component designed to add inductance to a circuit is called an inductor. It typ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Capacitance
Capacitance is the capability of a material object or device to store electric charge. It is measured by the change in charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized are two closely related notions of capacitance: ''self capacitance'' and ''mutual capacitance''. An object that can be electrically charged exhibits self capacitance, for which the electric potential is measured between the object and ground. Mutual capacitance is measured between two components, and is particularly important in the operations of the capacitor, a device designed for this purpose as an elementary linear electronic component. Capacitance is a function only of the geometry of the design of the capacitor, e.g., the opposing surface area of the plates and the distance between them, and the permittivity of the dielectric material between the plates. For many dielectric materials, the permittivity and thus the capacitance, is in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Frequency
Frequency is the number of occurrences of a repeating event per unit of time. It is also occasionally referred to as ''temporal frequency'' for clarity, and is distinct from ''angular frequency''. Frequency is measured in hertz (Hz) which is equal to one event per second. The period is the interval of time between events, so the period is the reciprocal of the frequency. For example, if a heart beats at a frequency of 120 times a minute (2 hertz), the period, —the interval at which the beats repeat—is half a second (60 seconds divided by 120 beats). Frequency is an important parameter used in science and engineering to specify the rate of oscillatory and vibratory phenomena, such as mechanical vibrations, audio signals (sound), radio waves, and light. Definitions and units For cyclical phenomena such as oscillations, waves, or for examples of simple harmonic motion, the term ''frequency'' is defined as the number of cycles or vibrations per unit of time. The ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coefficient Of Thermal Expansion
Thermal expansion is the tendency of matter to change its shape, area, volume, and density in response to a change in temperature, usually not including phase transitions. Temperature is a monotonic function of the average molecular kinetic energy of a substance. When a substance is heated, molecules begin to vibrate and move more, usually creating more distance between themselves. Substances which contract with increasing temperature are unusual, and only occur within limited temperature ranges (see examples below). The relative expansion (also called strain) divided by the change in temperature is called the material's coefficient of linear thermal expansion and generally varies with temperature. As energy in particles increases, they start moving faster and faster weakening the intermolecular forces between them, therefore expanding the substance. Overview Predicting expansion If an equation of state is available, it can be used to predict the values of the thermal ex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Invar
Invar, also known generically as FeNi36 (64FeNi in the US), is a nickel–iron alloy notable for its uniquely low coefficient of thermal expansion (CTE or α). The name ''Invar'' comes from the word ''invariable'', referring to its relative lack of expansion or contraction with temperature changes. The discovery of the alloy was made in 1895 by Swiss physicist Charles Édouard Guillaume for which he received the Nobel Prize in Physics in 1920. It enabled improvements in scientific instruments. Properties Like other nickel/iron compositions, Invar is a solid solution; that is, it is a single-phase alloy. In one commercial version it consists of approximately 36% nickel and 64% iron. The invar range was described by Westinghouse scientists in 1961 as "30–45 atom per cent nickel". Common grades of Invar have a coefficient of thermal expansion (denoted α, and measured between 20 °C and 100 °C) of about 1.2 × 10−6 K−1 (1.2 ppm/°C), while ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad Flat No-leads Package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ''surfaces'' of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). Flat no-lead cross-section The figure shows the cross section of a flat no-lead package with a lead frame and wire bon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad Flat Package
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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