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LGA 1567
LGA 1567 or Socket LS, is a CPU socket used for the high-end server segment. It has 1567 protruding pins to make contact with the pads on the processor. It supports Intel Nehalem (microarchitecture), Nehalem, codenamed Beckton (microprocessor), Beckton, Xeon 7500 and Xeon 6500 series processors first released in March 2010. The 6500 series is scalable up to 2 sockets, while the 7500 series is scalable up to 4/8 sockets on a supporting motherboard. In this server segment, it is a successor of Socket 604, which was first launched in 2002. A modification of LGA 2011, the LGA 2011-1 or Socket R2, is a successor of LGA 1567. Later on, the List of Intel Xeon microprocessors#Xeon E7 (multiprocessor), Xeon E7 series using the Westmere_(microarchitecture), Westmere-EX architecture reused the same socket. Dell also manufactures the proprietary "FlexMem Bridge" module that installs into two of the LGA 1567 sockets of certain Dell PowerEdge, PowerEdge servers to allow the use of additional me ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 1567 Socket And Xeon 7500 Processor
LaGuardia Airport is a civil airport in East Elmhurst, Queens, New York City. Covering , the facility was established in 1929 and began operating as a public airport in 1939. It is named after former New York City mayor Fiorello La Guardia. The airport primarily accommodates airline service to domestic (and #Service restrictions, limited international) destinations. , it was the third-busiest airport in the New York metropolitan area, behind John F. Kennedy International Airport, Kennedy and Newark Liberty International Airport, Newark airports, and the List of the busiest airports in the United States, twenty-first busiest in the United States by passenger volume. The airport is located directly to the north of the Grand Central Parkway, the airport’s primary access highway. While the airport is a hub for both American Airlines and Delta Air Lines, commercial service is strictly governed by unique regulations including a Noise control, curfew, a Landing slot, slot system, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel QuickPath Interconnect
The Intel QuickPath Interconnect (QPI) is a point-to-point microprocessor, processor electrical connection, interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon, Itanium, and certain desktop platforms starting in 2008. It increased the scalability and available bandwidth. Prior to the name's announcement, Intel referred to it as Common System Interface (CSI). Earlier incarnations were known as Yet Another Protocol (YAP) and YAP+. QPI 1.1 is a significantly revamped version introduced with Sandy Bridge-EP (Romley platform). QPI was replaced by Intel Ultra Path Interconnect (UPI) in Skylake (microarchitecture), Skylake-SP Xeon processors based on LGA 3647 socket. Background Although sometimes called a "bus", QPI is a point-to-point interconnect. It was designed to compete with HyperTransport that had been used by Advanced Micro Devices (AMD) since around 2003. Intel developed QPI at its Massachusetts Microprocessor Design Center (MMDC) by members of what ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nehalem (microarchitecture)
Nehalem is the codename for Intel's 45 nm microarchitecture released in November 2008. It was used in the first-generation of the Intel Core i5 and i7 processors, and succeeds the older Core microarchitecture used on Core 2 processors. The term "Nehalem" comes from the Nehalem River. Nehalem is built on the 45 nm process, is able to run at higher clock speeds, and is more energy-efficient than Penryn microprocessors. Hyper-threading is reintroduced, along with a reduction in L2 cache size, as well as an enlarged L3 cache that is shared among all cores. Nehalem is an architecture that differs radically from Netburst, while retaining some of the latter's minor features. Nehalem later received a die-shrink to 32 nm with Westmere, and was fully succeeded by "second-generation" Sandy Bridge in January 2011. Technology * Cache line block on L2/L3 cache was reduced from 128 bytes in Netburst & Conroe/Penryn to 64 bytes per line in this generation (same size as Yonah and Pe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Xeon Microprocessors
The following is a list of Intel Xeon microprocessors, by generation. P6-based * Pentium II Xeon 400 * Pentium II Xeon 400 * Pentium II Xeon 450 * Pentium II Xeon 450 * Pentium II Xeon 450 * Pentium III Xeon 500 * Pentium III Xeon 500 * Pentium III Xeon 500 * Pentium III Xeon 550 * Pentium III Xeon 550 * Pentium III Xeon 550 * Pentium III Xeon 600 * Pentium III Xeon 667 * Pentium III Xeon 700 * Pentium III Xeon 700 * Pentium III Xeon 733 * Pentium III Xeon 800 * Pentium III Xeon 866 * Pentium III Xeon 900 * Pentium III Xeon 933 * Pentium III Xeon 1.00 NetBurst-based * Xeon 1.4 * Xeon 1.5 * Xeon 1.7 * Xeon 2.0 * Xeon 1.8 * Xeon 2.0A * Xeon 2.0B * Xeon 2.2 * Xeon 2.4 * Xeon 2.4B * Xeon 2.6 * Xeon 2.66 * Xeon 2.8 * Xeon 2.8B * Xeon 3.0 * Xeon 3.06 * Xeon LV 1.6 * Xeon LV 2.0 * Xeon LV 2.4 * Xeon 2.4B * Xeon 2.8B * Xeon 3.06 * Xeon 3.2 * Xeon 3.2 * Xeon 2.8 * Xeon 2.8D * Xeon 3.0 * Xeon 3.0D * Xeon 3.2 * Xeon 3.4 * Xeon 3. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket 604
Socket 604 is a 604-pin microprocessor socket designed to interface an Intel's Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink. Launched at November 18, 2002, over the year after Socket 603, it was originally used to accommodate most Xeons introduced at the time. It was succeeded by LGA 771 in 2006 for low- and mid-end server ranges, but still staying in high-end server range, including 4- and 8-processor configurations, in which the successor - LGA 1567 - appeared in 2010. At the time, LGA 1366 was the primary socket for Xeons in low- and mid-end server ranges, with cheaper configurations still sometimes using LGA 771 socket. The socket had an unusually long life span, lasting 9 years (2 years longer than consumer-grade LGA 775) until the last processors supporting it ceased production in the 3rd quarter of 2011. Technical specifications Socket 604 was designed by Intel ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 2011
LGA 2011, also called ''Socket R'', is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 (Socket B) and LGA 1567. While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers. The socket has 2011 protruding pins that touch contact points on the underside of the processor. The LGA 2011 socket uses QPI to connect the CPU to additional CPUs. DMI 2.0 is used to connect the processor to the PCH. The memory controller and 40 PCI Express (PCIe) lanes are integrated on the CPU. On a secondary processor an extra ×4 PCIe interface replaces the DMI interface. As with its predecessor LGA 1366, there is no provisioning for integrated graphics. This socket supports four DDR3 or DDR4 SDRAM memory channels with up to three unbuffered or registered DIMMs per channel, as well as up to 40 PCI Express 2.0 or 3.0 lanes. LGA ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Beckton (microprocessor)
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Xeon
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Motherboard
A motherboard (also called mainboard, main circuit board, mb, mboard, backplane board, base board, system board, logic board (only in Apple computers) or mobo) is the main printed circuit board (PCB) in general-purpose computers and other expandable systems. It holds and allows communication between many of the crucial electronic components of a system, such as the central processing unit (CPU) and memory, and provides connectors for other peripherals. Unlike a backplane, a motherboard usually contains significant sub-systems, such as the central processor, the chipset's input/output and memory controllers, interface connectors, and other components integrated for general use. ''Motherboard'' means specifically a PCB with expansion capabilities. As the name suggests, this board is often referred to as the "mother" of all components attached to it, which often include peripherals, interface cards, and daughterboards: sound cards, video cards, network cards, host bus adapters, TV t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
