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IC Package
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Signetics NE555N
Signetics Corporation was an American electronics manufacturer specifically established to make integrated circuits. Founded in 1961, they went on to develop a number of early microprocessors and support chips, as well as the widely used 555 timer chip. The company was bought by Philips in 1975 and incorporated in Philips Semiconductors (now NXP). History Signetics was started in 1961, by a group of engineers (David Allison, David James, Lionel Kattner, and Mark Weissenstern) who had left Fairchild Semiconductor. At the time, Fairchild was concentrating on its discrete component business (mostly transistors), and its management felt that by making integrated circuits (ICs) it would lose its customers. Signetics founders believed that ICs were the future of electronics (much like another contemporary Fairchild spinoff, Amelco) and wished to commercialize them. The name of the new company was coined from Signal Network Electronics. The venture was financed by a group organized th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-Chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnectio ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad Flat Package
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MicroLeadFrame
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ''surfaces'' of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). Flat no-lead cross-section The figure shows the cross section of a flat no-lead package with a lead frame and wire bond ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad-flat No-leads Package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ''surfaces'' of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). Flat no-lead cross-section The figure shows the cross section of a flat no-lead package with a lead frame and wire bon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PQFP
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Quad Flat Package
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flatpack (electronics)
Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count. The main vehicle for testing of high reliability flatpack packages has been MIL-PRF-38534 (General Specification for Hybrid Microcircuits). This document outlines the general requirements of fully assembled devices, whether they are single chip, multichip, or of hybrid technology. The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum requirements that a microelectronics device must be abl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
The McGraw-Hill Companies
S&P Global Inc. (prior to April 2016 McGraw Hill Financial, Inc., and prior to 2013 The McGraw–Hill Companies, Inc.) is an American publicly traded corporation headquartered in Manhattan, New York City. Its primary areas of business are financial information and analytics. It is the parent company of S&P Global Ratings, S&P Global Market Intelligence, S&P Global Mobility, S&P Global Engineering Solutions, S&P Global Sustainable1, and S&P Global Commodity Insights, CRISIL, and is the majority owner of the S&P Dow Jones Indices joint venture. "S&P" is a shortening of "Standard and Poor's". Corporate history The predecessor companies of S&P Global have history dating to 1888, when James H. McGraw purchased the ''American Journal of Railway Appliances''. He continued to add further publications, eventually establishing The ''McGraw Publishing Company'' in 1899. John A. Hill had also produced several technical and trade publications and in 1902 formed his own business, The ''Hill ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms ar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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